All IPs > Interface Controller & PHY > D2D > AresCORE UCIe Die-to-Die PHY
AresCORE UCIe Die-to-Die PHY is engineered to provide ultra-low power, high-bandwidth connections between dies within a single package. It supports data rates of up to 64 Gbps per lane and is essential for applications demanding high throughput and minimal latency like AI and data centers. The IP efficiently supports various advanced packaging technologies, ensuring reduced IO complexity and increased power savings, facilitating robust connectivity within multi-die systems.
| Foundry | Process Nodes |
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| All Foundries |
All Process Nodes |
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| Categories |
Interface Controller & PHY > D2D |
| Availability | All Countries & Regions |
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