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All IPs > Wireless Communication > Bluetooth > BLE 6.0 Linklayer, Stack & Profiles

BLE 6.0 Linklayer, Stack & Profiles

From T2M GmbH

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Description

Designed with the latest Bluetooth 6.0 standards, the BLE 6.0 Linklayer, Stack & Profiles provides a feature-rich stack for developing IoT devices requiring low energy consumption and robust connectivity. It features advanced codecs like LC3 for audio-over-BLE applications and supports wide interoperability, allowing seamless integration into various platforms. The solution is optimized for low power use and tested for interoperability, ensuring smooth operation with a multitude of devices.

Features
  • Supports Bluetooth 6.0 Link-layer and Stack
  • Optimized LC3 codec for audio applications
  • Platform and OS agnostic
Tech Specs
Class Value
Categories Wireless Communication > Bluetooth
Processor > Audio Processor
Interface Controller & PHY > USB
Availability All Countries & Regions
Applications
  • Smart Door Locks
  • Smart Speakers
  • Wearables
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