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All IPs > Wireless Communication > Bluetooth > BLE 6.0 Linklayer, Stack & Profiles

BLE 6.0 Linklayer, Stack & Profiles

From T2M GmbH

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Description

This IP solution focuses on delivering advanced Bluetooth capabilities with a Bluetooth v6.0 certified Link-layer controller, Digital PHY, Stack, and Profiles. Building on the Bluetooth Special Interest Group (SIG) specifications for version 5.4, it supports single-mode Bluetooth low energy. Notably, the solution facilitates Audio-over-BLE functionality, introducing core Protocol Stack and Link Layer standards fitted for audio transmission.

This IP features portability across 8/16/32-bit microcontroller architectures and provides support for multiple processor bus interfaces, ensuring broad compatibility. Additionally, it offers optimized SBC, mSBC, and LC3 codecs alongside platform and OS-agnostic layers for broad adoption. Its architecture is designed for minimal power consumption and a small footprint while supporting various operational roles and states within the Bluetooth ecosystem.

The solution is qualified by the Bluetooth Qualification Body (BQB) and includes a range of deliverables like source code, technical documentation, and management interfaces. Applications for this IP span TWS earbuds, headsets, hearing aids, smart locking mechanisms, asset tracking solutions, and various wearables.

Features
  • Audio-over-BLE
  • Extensive codec support
  • Wide processor compatibility
Foundries & Process Nodes
Foundry Process Nodes
TSMC 28nm
Tech Specs
Class Value
Categories Wireless Communication > Bluetooth
Processor > Audio Processor
Interface Controller & PHY > USB
Bluetooth Version v6.0
Microcontroller compatibility 8/16/32-bit
Availability All Countries & Regions
Applications
  • TWS earbuds
  • Smart Door Locks
  • Smart Speakers
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