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All IPs > Interface Controller & PHY > USB

USB Interface Controller & PHY Semiconductor IP Solutions

The USB Interface Controller & PHY semiconductor IP category encompasses a variety of products and solutions essential for managing USB data transfer protocols and physical layer connectivity. Universal Serial Bus (USB) technology has become a fundamental element in electronic devices, providing a ubiquitous interface for data transfer, charging, and peripheral connectivity. This category includes specialized semiconductor IPs designed to implement USB standards such as USB 2.0, USB 3.0, and USB 3.1, enabling high-speed communication and seamless integration in various applications.

A USB Interface Controller plays a critical role in the communication process by handling the data exchange between the USB host and peripheral devices. It interprets USB signals, manages data flow control, and ensures compliance with USB protocols. Meanwhile, the PHY, or Physical Layer, acts as the bridge between the USB digital signals and the physical transmission medium. Together, the Interface Controller and PHY ensure the proper functioning of USB ports in devices ranging from smartphones and laptops to industrial machines and automotive systems.

Incorporating USB Interface Controller & PHY semiconductor IPs into designs provides manufacturers with flexibility and scalability. These IPs can be customized to meet the specific data rate, power consumption, and physical space requirements of diverse applications. This adaptability allows for efficient and cost-effective integration of USB functionality, reducing time-to-market and maximizing performance.

Products in this category are crucial for any device requiring USB connectivity. They are used in a vast array of applications, including consumer electronics, computer peripherals, automotive infotainment systems, and industrial control systems. Designing with these semiconductor IPs ensures compliance with global USB standards, enabling compatibility across devices and enhancing user experience by facilitating easy data transfer and device interoperability.

All semiconductor IP
Vendor

KL730 AI SoC

The KL730 is a third-generation AI chip that integrates advanced reconfigurable NPU architecture, delivering up to 8 TOPS of computing power. This cutting-edge technology enhances computational efficiency across a range of applications, including CNN and transformer networks, while minimizing DDR bandwidth requirements. The KL730 also boasts enhanced video processing capabilities, supporting 4K 60FPS outputs. With expertise spanning over a decade in ISP technology, the KL730 stands out with its noise reduction, wide dynamic range, fisheye correction, and low-light imaging performance. It caters to markets like intelligent security, autonomous vehicles, video conferencing, and industrial camera systems, among others.

Kneron
TSMC
12nm
16 Categories
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1G to 224G SerDes

The 1G to 224G SerDes is a versatile serializer/deserializer technology designed to facilitate high-speed data transfers across various interface standards. It caters to stringent speed requirements by supporting a wide range of data rates and signaling schemes, allowing efficient integration into comprehensive communication systems. This SerDes technology excels in delivering reliable, low-latency connections, making it ideal for hyperscale data centers, AI, and 5G networking where fast, efficient data processing is essential. The broad compatibility with numerous industry protocols also ensures seamless interoperability with existing systems. Adapted for scalability, the 1G to 224G SerDes provides design flexibility, encouraging implementation across a variety of demanding environments. Its sophisticated architecture promotes energy efficiency and robust performance, crucial for addressing the ever-growing connectivity demands of modern technology infrastructures.

Alphawave Semi
GLOBALFOUNDRIES, UMC
7nm, 14nm
AMBA AHB / APB/ AXI, DSP Core, Ethernet, PCI, USB, Wireless Processor
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GL3590-S

The GL3590-S is a USB 3.2 Gen 2 Hub Controller designed to provide seamless connectivity via integrated USB Type-C® support. This controller is capable of managing multiple upstream ports, making it ideal for complex data management tasks in modern electronics. Its sophisticated architecture allows for high-speed data transfer, ensuring efficiency in demanding computational environments. Integrated with USB 3.2 Gen 2 hub capabilities, the GL3590-S supports rapid data exchange rates essential for applications needing swift resolution and connectivity. The device plays a crucial role in amplifying the USB connection bandwidth, thereby enhancing the performance and reliability of connected devices. Moreover, this hub controller is equipped with advanced compatibility features, supporting various data transfer protocols. It aims to streamline the integration process across computing platforms, providing a robust solution for today's data-driven ecosystems.

Genesys Logic, Inc.
SDIO Controller, USB, V-by-One
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Universal Chiplet Interconnect Express (UCIe)

Universal Chiplet Interconnect Express, or UCIe, is a forward-looking interconnect technology that enables high-speed data exchanges between various chiplets. Developed to support a modular approach in chip design, UCIe enhances flexibility and scalability, allowing manufacturers to tailor systems to specific needs by integrating multiple functions into a single package. The architecture of UCIe facilitates seamless data communication, crucial in achieving high-performance levels in integrated circuits. It is designed to support multiple configurations and implementations, ensuring compatibility across different designs and maximizing interoperability. UCIe is pivotal in advancing the chiplet strategy, which is becoming increasingly important as devices require more complex and diverse functionalities. By enabling efficient and quick interchip communication, UCIe supports innovation in the semiconductor field, paving the way for the development of highly efficient and sophisticated systems.

EXTOLL GmbH
GLOBALFOUNDRIES, Samsung, TSMC, UMC
22nm, 28nm
AMBA AHB / APB/ AXI, D2D, Gen-Z, Multiprocessor / DSP, Network on Chip, Processor Core Independent, USB, V-by-One, VESA
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SerDes Interfaces

Silicon Creations' SerDes Interfaces are crafted to handle high-speed data transmission challenges over varied processes, ranging from 12nm to 180nm. Addressing multiple protocols such as CPRI, PCIe, and SATA, these interfaces demonstrate flexibility by supporting data transmission speeds from 100 Mbps to beyond 32 Gbps. The architecture incorporates a host of advanced features including adaptive equalization techniques and programmable de-serialization widths, making it stand out in terms of performance and signal integrity even under challenging conditions. With ultra-low latency PMAs, they sustain excellent operational speed and efficiency, imperative for sophisticated communication applications. Moreover, Silicon Creations partners with leading entities to provide comprehensive solutions, including complete PCIe PHY integrations. This synergy ensures that SerDes Interfaces are fully optimized for operational excellence, delivering stable and reliable communication signals. With an emphasis on low power and minimized area requirements, they cater to burgeoning industry needs for power-efficient and space-conservative designs.

Premium Vendor
Silicon Creations
TSMC
16nm, 180nm
AMBA AHB / APB/ AXI, MIPI, Multi-Protocol PHY, PCI, SATA, USB
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xcore.ai

The xcore.ai platform by XMOS is a versatile, high-performance microcontroller designed for the integration of AI, DSP, and real-time I/O processing. Focusing on bringing intelligence to the edge, this platform facilitates the construction of entire DSP systems using software without the need for multiple discrete chips. Its architecture is optimized for low-latency operation, making it suitable for diverse applications from consumer electronics to industrial automation. This platform offers a robust set of features conducive to sophisticated computational tasks, including support for AI workloads and enhanced control logic. The xcore.ai platform streamlines development processes by providing a cohesive environment that blends DSP capabilities with AI processing, enabling developers to realize complex applications with greater efficiency. By doing so, it reduces the complexity typically associated with chip integration in advanced systems. Designed for flexibility, xcore.ai supports a wide array of applications across various markets. Its ability to handle audio, voice, and general-purpose processing makes it an essential building block for smart consumer devices, industrial control systems, and AI-powered solutions. Coupled with comprehensive software support and development tools, the xcore.ai ensures a seamless integration path for developers aiming to push the boundaries of AI-enabled technologies.

XMOS Semiconductor
21 Categories
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KL630 AI SoC

The KL630 is a pioneering AI chipset featuring Kneron's latest NPU architecture, which is the first to support Int4 precision and transformer networks. This cutting-edge design ensures exceptional compute efficiency with minimal energy consumption, making it ideal for a wide array of applications. With an ARM Cortex A5 CPU at its core, the KL630 excels in computation while maintaining low energy expenditure. This SOC is designed to handle both high and low light conditions optimally and is perfectly suited for use in diverse edge AI devices, from security systems to expansive city and automotive networks.

Kneron
TSMC
12nm LP/LP+
ADPCM, AI Processor, Camera Interface, CPU, GPU, Input/Output Controller, Processor Core Independent, USB, VGA, Vision Processor
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LVDS Interfaces

Silicon Creations crafts highly reliable LVDS interfaces designed to meet diverse application needs, going from bi-directional I/Os to specialized uni-directional configurations. Spanning process compatibilities from 90nm CMOS to advanced 7nm FinFET, these interfaces are a cornerstone for high-speed data communication systems, thriving particularly in video data transmission and chip-to-chip communications. Supporting robust data rates over multiple channels, the LVDS Interfaces guarantee flexible programmability and protocol compatibility with standards such as FPD-Link and Camera-Link. They capitalize on proven PLL and CDR architectures for superior signal integrity and error-free data transfers. Operating efficiently in various technology nodes, they remain highly effective across collaborative chipset environments. The interfaces are fortified with adaptable features like dynamic phase alignment to stabilize data sequences and on-die termination options for superior signal integrity. Their proven record places them as a critical enabler in applications where consistent high-speed data transfer is paramount, demonstrating Silicon Creations’ prowess in delivering industry-leading communication solutions.

Premium Vendor
Silicon Creations
TSMC
12nm, 40nm
Analog Multiplexer, Input/Output Controller, MIPI, Multi-Protocol PHY, Peripheral Controller, Receiver/Transmitter, USB, V-by-One
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SERDES

The SERDES solutions by Analog Bits are integral components for high-speed data transfer applications, effectively serializing and deserializing data streams to improve bandwidth efficiency in electronic devices. These SERDES IPs support data rates that suit a variety of communication standards, including Ethernet and PCI Express. Leveraging state-of-the-art design techniques, these solutions optimize data throughput and reduce latency, providing the necessary data integrity and speed for applications like telecommunications and high-performance computing. Their scalable architecture allows for customization across different technology nodes, catering to specific design needs and operational environments. Analog Bits' SERDES IPs are commonly implemented in data-intensive applications, making them suitable for industries demanding high-speed connectivity, such as data centers, automotive electronics, and mobile communications. These products are validated on leading process nodes, ensuring that they deliver consistent performance even under stringent conditions.

Analog Bits
GLOBALFOUNDRIES, LFoundry
40nm, 55nm
D2D, HDMI, Multi-Protocol PHY, PCI, RapidIO, SAS, SATA, USB, V-by-One
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eSi-Connect

eSi-Connect offers an extensive suite of AMBA-compliant peripheral IPs designed to streamline SoC integration. This suite encompasses versatile memory controllers, standard off-chip interface support, and essential control functions. Its configurability and compatibility with low-level software drivers make it suitable for real-time deployment in complex system architectures, promoting reliable connectivity across various applications.

eSi-RISC
AMBA AHB / APB/ AXI, Gen-Z, I2C, Input/Output Controller, LCD Controller, PCI, Peripheral Controller, Receiver/Transmitter, SATA, Timer/Watchdog, USB
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EW6181 GPS and GNSS Silicon

The EW6181 is an advanced multi-GNSS silicon solution designed for high sensitivity and precision. This powerful chip supports GPS, Glonass, BeiDou, Galileo, SBAS, and A-GNSS, offering integration flexibility with various applications. Its built-in RF frontend and digital baseband facilitate robust signal processing, controlled by an ARM MCU. The EW6181 integrates essential interfaces for diverse connectivity, matched with DC-DC converters and LDOs to minimize BOM in battery-driven setups. This silicon marries low power demands with strong functional capabilities, thanks to proprietary algorithms that optimize its operation. It’s engineered to deliver exceptional accuracy and sensitivity in both standalone and cloud-related environments, adapting smoothly to connected ecosystems for enhanced efficiency. Its compact silicon footprint further enhances its suitability for applications needing prolonged battery life and reliable positioning. With a focus on Antenna Diversity, the EW6181 shines in dynamic applications like action cameras and smartwatches, ensuring clear signal reception even when devices rapidly rotate. This aspect accentuates the chip's ability to maintain consistent performance across a range of challenging environments, reinforcing its role in the forefront of GNSS technology.

EtherWhere Corporation
All Foundries
7nm
3GPP-5G, AI Processor, ATM / Utopia, Bluetooth, CAN, CAN XL, CAN-FD, Fibre Channel, FlexRay, GPS, JESD 204A / JESD 204B, OBSAI, Optical/Telecom, Photonics, RF Modules, USB, W-CDMA
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USB PHY

The USB PHY by Silicon Library Inc. provides an efficient solution for USB interfaces, ensuring seamless data transfer and connectivity. This IP is designed to support the robust requirements of modern USB connectors, delivering high-speed performance and reliability. It integrates easily into various platforms, ensuring compliance with USB standards. The USB PHY facilitates crucial communication pathways needed in numerous devices, such as computers, mobile devices, and peripheral accessories. It optimizes power usage, contributing to enhanced system energy efficiency. Additionally, this IP's modular nature allows flexibility in deployment across different applications, from consumer electronics to automotive systems. With a focus on integrating advanced features and maintaining low power consumption, Silicon Library's USB PHY is engineered to meet the demands of next-generation connectivity solutions. Its adaptability and high performance make it a preferred choice for developers looking to implement reliable and high-speed USB connections in their products.

Silicon Library Inc.
AMBA AHB / APB/ AXI, USB
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Multi-Protocol SerDes

The Multi-Protocol SerDes provided by Silicon Creations serves as an essential component for high-speed data interfaces across multiple industry protocols. This SerDes portfolio accommodates a vast array of protocols such as PCIe, JESD204, XAUI, and many more, facilitating broad compatibility with industry standards. Operating across 12nm to 180nm processes, these interfaces support data rates from 100 Mbps to an impressive 32.75 Gbps. Incorporating advanced features like programmable de-serialization widths and adaptive equalization, the Multi-Protocol SerDes ensures optimal signal integrity and performance even in demanding environments. The design includes jitter cleaner functions and employs low-latency optimized PMAs, delivering high precision and speed across various operational scenarios. This comprehensive adaptability ensures seamless integration into a wide range of applications from communications to high-performance computing. Supported by robust architectures, the SerDes enables enhanced efficiency and reliability, featuring low power consumption and reduced area overheads. With a commitment to customer satisfaction, Silicon Creations offers complete solutions through partnerships with leading controller vendors, cementing its products as high-value choices for modern electronic systems.

Premium Vendor
Silicon Creations
TSMC
40nm, 180nm
AMBA AHB / APB/ AXI, Interlaken, MIPI, Multi-Protocol PHY, PCI, USB, V-by-One
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H.264 FPGA Encoder and CODEC Micro Footprint Cores

The H.264 FPGA Encoder and CODEC micro footprint cores are a compact and fast solution for video compression, specifically tailored for FPGAs. This licensable IP cores support 1080p60 H.264 Baseline encoding with a single core, offering various configurations such as an H.264 Encoder, CODEC, and I-Frame Only Encoder. These cores are renowned for their small size and rapid processing capabilities, designed to be ITAR compliant for secure applications. Developers can customize these cores to achieve desired pixel depths and resolutions, ensuring adaptability to diverse project needs. With an exceptionally low 1ms latency at 1080p30, these cores are acclaimed as industry-leading in terms of both size and performance. They enhance efficiency by providing fast video processing solutions without compromising quality. The cores are particularly useful in applications demanding high-speed and high-resolution video compression in FPGA implementations. These H.264 cores come with the option for a low-cost evaluation license, providing a seamless entry into advanced video processing tasks. With customizable features, they represent a versatile choice for engineers working on applications involving intensive video encoding and decoding needs.

A2e Technologies
AI Processor, AMBA AHB / APB/ AXI, Arbiter, Audio Controller, DVB, H.264, H.265, HDMI, Multiprocessor / DSP, Other, TICO, USB, Wireless Processor
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AXI4 DMA Controller

The AXI4 DMA Controller is a highly versatile IP core that supports multi-channel data transfers, ranging from 1 to 16 channels, depending on system requirements. Optimized for high throughput, this controller excels in transferring both small and large data sets effectively. It features independent DMA Read and Write Controllers for enhanced data handling with options for FIFO transfers to a diverse array of memory and peripheral configurations. This IP core offers significant flexibility with its programmable burst sizes, supporting up to 256 beats and adhering to critical boundary crossings in the AXI specification.

Digital Blocks
AMBA AHB / APB/ AXI, DMA Controller, Ethernet, SD, SDRAM Controller, SRAM Controller, USB
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HOTLink II Product Suite

The HOTLink II Product Suite by Great River Technology is tailored for mission-critical avionics systems requiring robust data communication. It enables seamless data transfer and ensures consistent performance under high-stress operational environments. This suite incorporates advanced technologies to handle complex data streams effectively. It includes component options that enhance data throughput and communication efficiency, meeting stringent industry standards for avionics platforms. Designed with precision, the HOTLink II suite supports the integration and management of large datasets, ensuring that avionics systems can perform efficiently and reliably, crucial for modern aircraft and defense applications.

Great River Technology, Inc.
15 Categories
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C100 IoT Control and Interconnection Chip

The Chipchain C100 is a pioneering solution in IoT applications, providing a highly integrated single-chip design that focuses on low power consumption without compromising performance. Its design incorporates a powerful 32-bit RISC-V CPU which can reach speeds up to 1.5GHz. This processing power ensures efficient and capable computing for diverse IoT applications. This chip stands out with its comprehensive integrated features including embedded RAM and ROM, making it efficient in both processing and computing tasks. Additionally, the C100 comes with integrated Wi-Fi and multiple interfaces for transmission, broadening its application potential significantly. Other notable features of the C100 include an ADC, LDO, and a temperature sensor, enabling it to handle a wide array of IoT tasks more seamlessly. With considerations for security and stability, the Chipchain C100 facilitates easier and faster development in IoT applications, proving itself as a versatile component in smart devices like security systems, home automation products, and wearable technology.

Shenzhen Chipchain Technologies Co., Ltd.
TSMC
7nm LPP, 16nm, 28nm
20 Categories
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YouSerdes

YouSerdes offers a versatile, high-speed serial interface solution supporting a broad range of data rates from 2.5Gbps to 32Gbps. The multi-rate SERDES solution is innovatively designed to incorporate multiple SERDES channels, delivering superior performance, minimized area, and reduced power consumption compared to other competitive products. This solution is ideal for high-speed data transfer applications, delivering reliable performance across various industry standards. Its optimized architecture ensures that designers can achieve maximum throughput, catering to the demanding needs of telecommunication, data center, and consumer electronic applications. Moreover, YouSerdes is crafted to provide a seamless integration experience, backed by comprehensive compatibility with different IC platforms. This adaptability facilitates a smoother system design process, allowing developers to integrate high-speed connectivity into their products efficiently.

Brite Semiconductor (Shanghai) Corporation Limited
AMBA AHB / APB/ AXI, D2D, Multi-Protocol PHY, USB
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GNSS ICs AST 500 and AST GNSS-RF

The AST 500 and AST GNSS-RF are multifaceted SOC and RF solutions designed for GNSS applications. They support a wide array of constellations such as GPS, GLONASS, NavIC, and others, in multiple frequency bands, enhancing navigation performance. These ICs integrate features like secure boots and data encryption, facilitating robust security measures crucial for sensitive data. The AST GNSS-RF is equipped with capabilities for L1, L2, L5, and S band reception, catering to high-fidelity signal requirements across various applications. The support for dual-band reception ensures that ionosphere errors are minimized, offering exceptional positioning accuracy.

Accord Software & Systems Pvt Ltd
GLOBALFOUNDRIES, Samsung
28nm
AMBA AHB / APB/ AXI, Amplifier, DDR, Ethernet, Gen-Z, GPS, Receiver/Transmitter, RLDRAM Controller, SDRAM Controller, USB, UWB, W-CDMA
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ISPido on VIP Board

ISPido on the VIP Board is tailored for Lattice Semiconductors' Video Interface Platform, providing a runtime solution optimized for delivering crisp, balanced images in real-time. This solution offers two primary configurations: automatic deployment for optimal settings instantly upon startup, and a manual, menu-driven interface allowing users to fine-tune settings such as gamma tables and convolution filters. Utilizing the CrossLink VIP Input Bridge with Sony IMX 214 sensors and an ECP5-85 FPGA, it provides HD output in HDMI YCrCb format, ensuring high-quality image resolution and real-time calibration.

DPControl
19 Categories
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THOR Toolbox - NFC and UHF Connectivity

The THOR platform is a versatile tool for developing application-specific NFC sensor and data logging solutions. It incorporates silicon-proven IP blocks, creating a comprehensive ASIC platform suitable for rigorous monitoring and continuous data logging applications across various industries. THOR is designed for accelerated development timelines, leveraging low power and high-security features. Equipped with multi-protocol NFC capabilities and integrated temperature sensors, the THOR platform supports a wide range of external sensors, enhancing its adaptability to diverse monitoring needs. Its energy-efficient design allows operations via energy harvesting or battery power, ensuring sustainability in its applications. This platform finds particular utility in sectors demanding precise environmental monitoring and data management, such as logistics, pharmaceuticals, and industrial automation. The platform's capacity for AES/DES encrypted data logging ensures secure data handling, making it a reliable choice for sectors with stringent data protection needs.

Presto Engineering
AMBA AHB / APB/ AXI, Amplifier, HDMI, I2C, MIPI, PLL, RF Modules, Sensor, Timer/Watchdog, USB
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DisplayPort 1.4

The DisplayPort 1.4 IP-core offered by Parretto B.V. is a compact yet potent solution for DisplayPort connectivity needs. Supporting a range of link rates from 1.62 to 8.1 Gbps, this IP-core accommodates varied setups with ease, including embedded DisplayPort (eDP) applications. It provides support for multiple lane configurations and both native video and AXI stream interfaces. The inclusion of Single and Multi Stream transport modes enhances its versatility for different video applications. Tailored for modern FPGA devices, the core supports a comprehensive video format range, including RGB and various YCbCr colorspaces. A standout feature is the secondary data packet interface, enabling audio and metadata transport alongside video signals. This makes it a full-fledged solution for video-centric applications, complemented by a Video Toolbox geared for video processing tasks like timing and test pattern generation. Parretto ensures the IP-core's adaptability by offering it with a thin host driver and API for seamless integration. The core is compatible with an extensive list of FPGA devices, such as AMD UltraScale+ and Intel Arria 10 GX. Customers benefit from the availability of source code via GitHub, promoting easier customization and deep integration into diverse systems. Comprehensive documentation supports the IP-core, ensuring efficient setup and utilization.

Parretto B.V.
AMBA AHB / APB/ AXI, Audio Interfaces, Cell / Packet, Ethernet, HDMI, Image Conversion, LCD Controller, MIL-STD-1553, MIPI, Receiver/Transmitter, SATA, USB, V-by-One, VGA
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Polar ID Biometric Security System

Polar ID from Metalenz offers a cutting-edge face unlock solution, using advanced meta-optic technology to provide secure, high-resolution facial recognition capabilities. It captures the unique "polarization signature" of a human face, making it resistant to both 2D photos and sophisticated 3D masks. Polar ID operates efficiently in a variety of lighting conditions, from bright daylight to dark environments, ensuring its utility extends across all smartphone models without sacrificing security or user experience. This technology replaces complex structured light modules, incorporating a single near-infrared polarization camera and active illumination source. It significantly reduces costs and footprint, supporting a broad adoption across hundreds of millions of mobile devices. With its low price point and high performance, Polar ID elevates smartphone security, offering robust protection for digital transactions and identity verification. By enabling this on an embedded platform with compatibility for Qualcomm's Snapdragon processors, Metalenz ensures widespread applicability. The key advantage of Polar ID is its affordability and ease of integration, as it eliminates the need for larger, more intrusive notches in phone designs. Its sophisticated polarization sensing means secure authentication is possible even if the user wears sunglasses or masks. Polar ID sets a new benchmark in smartphone security by delivering convenience and enhanced protection, marking it as the first polarization sensor available for smartphones.

Metalenz Inc.
13 Categories
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Mixed-Signal CODEC

The Mixed-Signal CODEC offered by Archband Labs integrates advanced analog and digital audio processing to deliver superior sound quality. Designed for a variety of applications such as portable audio devices, automotive systems, and entertainment systems, this CODEC provides efficiency and high performance. With cutting-edge technologies, it handles complex signal conversions with minimal power consumption. This CODEC supports numerous interface standards, making it a versatile component in numerous audio architectures. It's engineered to offer precise sound reproduction and maintains audio fidelity across all use cases. The integrated components within the CODEC streamline design processes and reduce the complexity of audio system implementations. Furthermore, the Mixed-Signal CODEC incorporates features that support high-resolution audio, ensuring compatibility with high-definition sound systems. It's an ideal choice for engineers looking for a reliable and comprehensive audio processing solution.

Archband Labs
ADPCM, Audio Controller, Audio Interfaces, Audio Processor, Coder/Decoder, DMA Controller, GPU, Peripheral Controller, Receiver/Transmitter, Timer/Watchdog, USB
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TSN Switch for Automotive Ethernet

The TSN Switch for Automotive Ethernet is designed to address the needs of modern automotive networks by offering time-sensitive networking capabilities. This switch is tailored to manage Ethernet-based communication in vehicles, ensuring low-latency and reliable data transmission. It supports complex automotive network architectures, making it ideal for real-time communication requirements in vehicles. With its robust time-sensitive networking features, this switch is capable of guaranteeing data delivery within tight time constraints, a critical requirement for advanced driver assistance systems (ADAS) and autonomous driving. It integrates seamlessly within the automotive Ethernet ecosystem, providing scalability and integration flexibility. The switch is engineered to support the industry's move towards centralized vehicle networking, improving data throughput and reducing cabling complexity. The switch’s architecture supports multiple ports, allowing for the connection of various vehicle subsystems within a unified network framework. Implementing this technology can drastically improve the efficiency and reliability of in-vehicle communication systems. The TSN capabilities optimize network traffic management, ensure the prioritization of time-critical messages, and enhance the overall stability and predictability of automotive data flows.

Fraunhofer Institute for Photonic Microsystems (IPMS)
AMBA AHB / APB/ AXI, ATM / Utopia, CXL, Ethernet, LIN, Optical/Telecom, RapidIO, Safe Ethernet, SDRAM Controller, USB, V-by-One
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RISCV SoC - Quad Core Server Class

The RISCV SoC developed by Dyumnin Semiconductors is engineered with a 64-bit quad-core server-class RISCV CPU, aiming to bridge various application needs with an integrated, holistic system design. Each subsystem of this SoC, from AI/ML capabilities to automotive and multimedia functionalities, is constructed to deliver optimal performance and streamlined operations. Designed as a reference model, this SoC enables quick adaptation and deployment, significantly reducing the time-to-market for clients. The AI Accelerator subsystem enhances AI operations with its collaboration of a custom central processing unit, intertwined with a specialized tensor flow unit. In the multimedia domain, the SoC boasts integration capabilities for HDMI, Display Port, MIPI, and other advanced graphic and audio technologies, ensuring versatile application across various multimedia requirements. Memory handling is another strength of this SoC, with support for protocols ranging from DDR and MMC to more advanced interfaces like ONFI and SD/SDIO, ensuring seamless connectivity with a wide array of memory modules. Moreover, the communication subsystem encompasses a broad spectrum of connectivity protocols, including PCIe, Ethernet, USB, and SPI, crafting an all-rounded solution for modern communication challenges. The automotive subsystem, offering CAN and CAN-FD protocols, further extends its utility into automotive connectivity.

Dyumnin Semiconductors
28 Categories
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LPDDR4/4X/5 Secondary/Slave PHY

The LPDDR4/4X/5 Secondary/Slave PHY is designed as a memory-side interface IP primarily used in DRAM products. This technology enables efficient data communication between AI processors, in-memory computation units, and other advanced memory technologies. Supporting both LPDDR4X and LPDDR5 standards as outlined by JEDEC, it caters to a broad spectrum of devices. Originally developed for 7nm TSMC processes, this PHY can be adapted for various manufacturing processes, ensuring compatibility with a diversity of memory types, including DRAM, SRAM, and novel NVM technologies, providing extensive reach across industries.

Green Mountain Semiconductor Inc.
TSMC
7nm
AMBA AHB / APB/ AXI, DDR, eMMC, Flash Controller, Mobile DDR Controller, NAND Flash, SDRAM Controller, USB
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D2D® Technology - Direct-to-Data RF Conversion

D2D® Technology, developed by ParkerVision, is a revolutionary approach to RF conversion that transforms how wireless communication operates. This technology eliminates traditional intermediary stages, directly converting RF signals to digital data. The result is a more streamlined and efficient communication process that reduces complexity and power consumption. By bypassing conventional analog-to-digital conversion steps, D2D® achieves higher data accuracy and reliability. Its direct conversion approach not only enhances data processing speeds but also minimizes energy usage, making it an ideal solution for modern wireless devices that demand both performance and efficiency. ParkerVision's D2D® technology continues to influence a broad spectrum of wireless applications. From improving the connectivity in smartphones and wearable devices to optimizing signal processing in telecommunication networks, D2D® is a cornerstone of ParkerVision's technological offerings, illustrating their commitment to advancing communication technology through innovative RF solutions.

ParkerVision, Inc.
3GPP-5G, 3GPP-LTE, 802.11, A/D Converter, AMBA AHB / APB/ AXI, CAN, Coder/Decoder, Digital Video Broadcast, Platform Security, PLL, Receiver/Transmitter, RF Modules, USB, UWB, W-CDMA
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Digital I/O

Certus Semiconductor's Digital I/O solutions are engineered to meet various GPIO/ODIO standards. These versatile libraries offer support for standards such as I2C, I3C, SPI, JEDEC CMOS, and more. Designed to withstand extreme conditions, these I/Os incorporate features like ultra-low power consumption, multiple drive strengths, and high levels of ESD protection. These attributes make them suitable for applications requiring resilient performance under harsh conditions. Certus Semiconductor’s offerings also include a variety of advanced features like RGMII-compliant IO cells, offering flexibility for different project needs.

Premium Vendor
Certus Semiconductor
GLOBALFOUNDRIES, Samsung, TSMC
55nm
AMBA AHB / APB/ AXI, Embedded Memories, I/O Library, I2C, Input/Output Controller, Receiver/Transmitter, SDRAM Controller, USB
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Bluetooth LE Audio Solutions

Packetcraft's Bluetooth LE Audio Solutions offer a full suite of host, controller, and LC3 components optimized for seamless transition to Bluetooth LE Audio. The platform supports Auracast broadcast audio and True Wireless Stereo (TWS), making it adaptable to prevalent chipsets and providing flexibility to product companies. The modular design facilitates simplified integration, ensuring companies can leverage advanced audio capabilities in a variety of applications. As Bluetooth audio technology evolves, Packetcraft remains at the leading edge, offering industry-leading solutions that cater to modern audio requirements.

Packetcraft, Inc.
Audio Interfaces, Bluetooth, H.264, Network on Chip, Peripheral Controller, USB, Wireless USB
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Network Protocol Accelerator Platform

The Network Protocol Accelerator Platform (NPAP) is engineered to accelerate network protocol processing and offload tasks at speeds reaching up to 100 Gbps when implemented on FPGAs, and beyond in ASICs. This platform offers patented and patent-pending technologies that provide significant performance boosts, aiding in efficient network management. With its support for multiple protocols like TCP, UDP, and IP, it meets the demands of modern networking environments effectively, ensuring low latency and high throughput solutions for critical infrastructure. NPAP facilitates the construction of function accelerator cards (FACs) that support 10/25/50/100G speeds, effectively handling intense data workloads. The stunning capabilities of NPAP make it an indispensable tool for businesses needing to process vast amounts of data with precision and speed, thereby greatly enhancing network operations. Moreover, the NPAP emphasizes flexibility by allowing integration with a variety of network setups. Its capability to streamline data transfer with minimal delay supports modern computational demands, paving the way for optimized digital communication in diverse industries.

Missing Link Electronics
AMBA AHB / APB/ AXI, Cell / Packet, Ethernet, MIL-STD-1553, Multiprocessor / DSP, Optical/Telecom, RapidIO, Safe Ethernet, SATA, USB, V-by-One
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ORC3990 – DMSS LEO Satellite Endpoint System On Chip (SoC)

The ORC3990 is a groundbreaking LEO Satellite Endpoint SoC engineered for use in the Totum DMSS Network, offering exceptional sensor-to-satellite connectivity. This SoC operates within the ISM band and features advanced RF transceiver technology, power amplifiers, ARM CPUs, and embedded memory. It boasts a superior link budget that facilitates indoor signal coverage. Designed with advanced power management capabilities, the ORC3990 supports over a decade of battery life, significantly reducing maintenance requirements. Its industrial temperature range of -40 to +85 degrees Celsius ensures stable performance in various environmental conditions. The compact design of the ORC3990 fits seamlessly into any orientation, further enhancing its ease of use. The SoC's innovative architecture eliminates the need for additional GNSS chips, achieving precise location fixes within 20 meters. This capability, combined with its global LEO satellite coverage, makes the ORC3990 a highly attractive solution for asset tracking and other IoT applications where traditional terrestrial networks fall short.

Orca Systems Inc.
Samsung
500nm
3GPP-5G, Bluetooth, Processor Core Independent, RF Modules, USB, W-CDMA, Wireless Processor
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DisplayPort Transmitter

The DisplayPort Transmitter from Trilinear Technologies is a sophisticated solution designed for high-performance digital video streaming applications. It is compliant with the latest VESA DisplayPort standards, ensuring compatibility and seamless integration with a wide range of display devices. This transmitter core supports high-resolution video outputs and is equipped with advanced features like adaptive sync and panel refresh options, making it ideal for consumer electronics, automotive displays, and professional AV systems. This IP core provides reliable performance with minimal power consumption, addressing the needs of modern digital ecosystems where energy efficiency is paramount. It includes customizable settings for audio and video synchronization, ensuring optimal output quality and user experience across different devices and configurations. By reducing load on the system processor, the DisplayPort Transmitter guarantees a seamless streaming experience even in high-demand environments. In terms of integration, Trilinear's DisplayPort Transmitter is supported with comprehensive software stacks allowing for easy customization and deployment. This ensures rapid product development cycles and aids developers in managing complex video data streams effectively. The transmitter is particularly optimized for use in embedded systems and consumer devices, offering robust performance capabilities that stand up to rigorous real-time application demands. With a focus on compliance and testing, the DisplayPort Transmitter is pre-tested and proven to work seamlessly with a variety of hardware platforms including FPGA and ASIC technologies. This robustness in design and functionality underlines Trilinear's reputation for delivering reliable, high-quality semiconductor IP solutions that cater to diverse industrial applications.

Trilinear Technologies
AMBA AHB / APB/ AXI, Coprocessor, HDMI, Input/Output Controller, PCI, PowerPC, RapidIO, SATA, USB, V-by-One
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UTTUNGA

UTTUNGA is a high-performance PCIe accelerator card, purpose-built to amplify HPC and AI tasks through its integration with the TUNGA SoC. It effectively harnesses the power of multi-core RISC-V technology combined with Posit arithmetic, offering significant enhancements in computation efficiency and memory optimization. Designed to be compatible with a broad range of server architectures, including x86, ARM, and PowerPC, UTTUNGA elevates system capabilities, particularly in precision computing applications. The UTTUNGA card operates by implementing foundational arithmetic operations in Posit configurations, supporting multiple bit-width formats for diverse processing needs. This flexibility is further complemented by a pool of programmable FPGA gates, optimized for scenarios demanding real-time adaptability and cloud computing acceleration. These gates facilitate the acceleration of complex tasks and aid in the effortless management of non-standard data types essential for advanced AI processing and cryptographic applications. By leveraging a seamless integration process, UTTUNGA eliminates the need for data copying in host memory, thus ensuring efficient utilization of resources. It also provides support for well-known scientific libraries, enabling easy adoption for legacy systems while fostering a modern computing environment. UTTUNGA stands as a testament to the profound impact of advancing arithmetic standards like Posit, paving the way for a transformation in computational practices across industries.

Calligo Technologies
AMBA AHB / APB/ AXI, CPU, Input/Output Controller, MIL-STD-1553, Multi-Protocol PHY, Network on Chip, PCI, SATA, USB
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High-Speed Interface Technology

The High-Speed Interface Technology by VeriSyno Microelectronics Co., Ltd. encompasses a range of connectivity solutions designed to meet the rigorous demands of modern applications. This suite includes versatile interfaces such as USB, DDR, MIPI, HDMI, PCIe, and SATA, each meticulously crafted to ensure seamless data transmission and robust performance across various technological landscapes. VeriSyno's high-speed interface solutions are built upon a robust framework that supports rigorous signaling protocols, ensuring consistency and reliability in high-bandwidth environments. These interfaces are optimized for diverse manufacturing processes, ranging from 28nm to 90nm, demonstrating flexibility and adaptability to next-generation design requirements. The technology facilitates customization, allowing clients to tailor interface attributes to specific application needs, thereby maximizing system efficiency. With a commitment to excellence, VeriSyno consistently updates its technology suite to incorporate latest advancements, ensuring clients benefit from leading-edge connectivity solutions.

VeriSyno Microelectronics Co., Ltd.
TSMC
28nm, 40nm, 130nm, 180nm
AMBA AHB / APB/ AXI, DDR, Ethernet, HBM, HDLC, HDMI, MIPI, SATA, USB
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ISPido

ISPido offers a comprehensive set of IP cores focused on high-resolution image signal processing and tuning across multiple devices and platforms, including CPU, GPU, VPU, FPGA, and ASIC technologies. Its flexibility is a standout feature, accommodating ultra-low power devices as well as systems exceeding 8K resolution. Designed for devices where power efficiency and high-quality image processing are paramount, ISPido adapts to a range of hardware architectures to deliver optimal image quality and processing capabilities. The IP has been widely adopted in various applications, making it a cornerstone for industries requiring advanced image calibration and processing capabilities.

DPControl
22 Categories
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Dual-Drive™ Power Amplifier - FCM1401

The FCM1401 is a 14GHz CMOS Power Amplifier tailored for Ku-band applications, operating over a frequency range of 12.4 to 16 GHz. This amplifier exhibits a gain of 22 dB and a saturated output power (Psat) of 19.24 dBm, ensuring optimal performance with a power-added efficiency (PAE) of 47%. The architecture enables reduction in battery consumption and heat output, making it ideal for satellite and telecom applications. Its small silicon footprint facilitates integration in space-constrained environments.

Falcomm
TSMC
14nm
3GPP-5G, A/D Converter, Coder/Decoder, Ethernet, Input/Output Controller, PLL, Power Management, RF Modules, USB
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QUIC Protocol Core

The QUIC Protocol Core by Design Gateway is a high-speed, low-latency communication core designed to optimize network traffic in environments prone to congestion. It offers exceptional performance benefits over traditional protocols, leveraging the latest technology in secure and reliable data transmission.\n\nThis core is engineered to support high-speed environments, enhancing data throughput while reducing the likelihood of packet loss. It is particularly effective in networks with high congestion, where maintaining a seamless and efficient flow of data is critical. The QUIC Protocol Core's design focuses on minimizing latency, providing faster data exchange and enhancing overall network performance.\n\nIntegrating this protocol core into existing network infrastructure supports secure, encrypted data communication, vital for maintaining data integrity across various network environments. Its high-performance capabilities reduce overhead and improve application response times, making it indispensable for modern, high-speed data networks.\n\nBy incorporating the QUIC Protocol Core, businesses can optimize their network capabilities, ensuring secure, efficient, and reliable communications that are crucial for today's technology-driven communication systems.

Design Gateway Co., Ltd.
AI Processor, ATM / Utopia, Cryptography Cores, Error Correction/Detection, Ethernet, RapidIO, Security Protocol Accelerators, USB, V-by-One
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QUIC Protocol Core

The QUIC Protocol Core by Design Gateway is a high-speed, low-latency communication core designed to optimize network traffic in environments prone to congestion. It offers exceptional performance benefits over traditional protocols, leveraging the latest technology in secure and reliable data transmission.\n\nThis core is engineered to support high-speed environments, enhancing data throughput while reducing the likelihood of packet loss. It is particularly effective in networks with high congestion, where maintaining a seamless and efficient flow of data is critical. The QUIC Protocol Core's design focuses on minimizing latency, providing faster data exchange and enhancing overall network performance.\n\nIntegrating this protocol core into existing network infrastructure supports secure, encrypted data communication, vital for maintaining data integrity across various network environments. Its high-performance capabilities reduce overhead and improve application response times, making it indispensable for modern, high-speed data networks.\n\nBy incorporating the QUIC Protocol Core, businesses can optimize their network capabilities, ensuring secure, efficient, and reliable communications that are crucial for today's technology-driven communication systems.

Design Gateway Co., Ltd.
AI Processor, ATM / Utopia, Cryptography Cores, Error Correction/Detection, Ethernet, RapidIO, Security Protocol Accelerators, USB, V-by-One
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eSi-Crypto

The eSi-Crypto suite by EnSilica is a comprehensive collection of cryptographic IP cores designed for both ASIC and FPGA architectures, aiming for minimal resource consumption while ensuring high throughput. A key component within this suite is the True Random Number Generator (TRNG), which adheres to NIST 800-22 standards and is offered as a hard macro in target technologies. Its configurable options are tailored to balance resource efficiency with throughput, making it essential for robust encryption solutions. These IP cores are available as stand-alone modules or integrated with AMBA APB/AHB or AXI bus interfaces.\n\nThe suite supports a variety of cryptographic algorithms such as CRYSTALS Kyber, CRYSTALS Dilithium, elliptic curve cryptography (ECC/ECDSA), RSA, AES, SHA1/SHA2/SHA3, ChaCha20, Poly1305, and TDES/DES. These diverse implementations can be tailored for specific use cases, including high-throughput core configurations ideal for applications like V2X communications. Additionally, the suite's ECC/ECDSA capabilities provide secured digital signature mechanisms, critical for applications requiring stringent data integrity and authenticity.\n\nEnSilica's dedication to cryptographic excellence is further evidenced in their sophisticated handling of secure web-server implementations. By leveraging their ultra-low-power accelerators, particularly for algorithms like ChaCha20 and Poly1305, eSi-Crypto reduces computational overhead while optimizing security performance. This makes the suite a preferred choice for customers seeking efficient and reliable cryptographic solutions across varied technology platforms.

EnSilica
Content Protection Software, Cryptography Cores, Embedded Security Modules, IEEE1588, Input/Output Controller, Platform Security, Security Protocol Accelerators, Security Subsystems, USB
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RWM6050 Baseband Modem

The RWM6050 Baseband Modem is an innovative component of Blu Wireless's mmWave technology portfolio, architected to support high-bandwidth, high-capacity data communications. Designed in collaboration with industry leaders Renesas, this modem unit stands out for its efficiency and versatility, effectively marrying physical modem layers with advanced processing capabilities. The RWM6050 modem is instrumental in providing seamless data transmission for access and backhaul networks. Built to accommodate varying channelisation modes, the RWM6050 supports deep levels of customisation for different bandwidth requirements and transmission distances. It handles multi-gigabit throughput, which makes it ideal for expanding connectivity in urban or industrial areas with dense infrastructure requirements. From smart cities to complex transport systems, this baseband modem scales effectively to meet demanding data needs. Equipped with dual modems and integrated mixed-signal front-end capabilities, the RWM6050 offers a flexible solution for evolving communication infrastructures. Its design ensures optimization for real-time digital signal processing, beamforming, and adaptable connectivity management. The RWM6050 is a key enabler in unlocking the full potential of mmWave technology in a variety of settings, furthering connectivity innovations.

Blu Wireless Technology Ltd.
LFoundry, Renesas
55nm, 130nm
17 Categories
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Bi-Directional LVDS

Silicon Creations' Bi-Directional LVDS Interfaces are engineered to offer high-speed data transmission with exceptional signal integrity. These interfaces are designed to complement FPGA-to-ASIC conversions and include broad compatibility with industry standards like FPD-Link and Camera-Link. Operating efficiently over processes from 90nm to 12nm, the LVDS interfaces achieve data rates exceeding 3Gbps using advanced phase alignment techniques. A standout feature of this IP is its capability to handle independent LVCMOS input and output functions while maintaining high compatibility with TIA/EIA644A standards. The bi-directional nature allows for seamless data flow in chip-to-chip communications, essential for modern integrated circuits requiring high data throughput. The design is further refined with trimmable on-die termination, enhancing signal integrity during operations. The LVDS interfaces are versatile and highly programmable, meeting bespoke application needs with ease. The interfaces ensure robust error rate performance across varying phase selections, making them ideal for video data applications, controllers, and other high-speed data interfaces where reliability and performance are paramount.

Premium Vendor
Silicon Creations
TSMC
12nm, 40nm
Analog Multiplexer, Input/Output Controller, MIPI, Multi-Protocol PHY, Peripheral Controller, Receiver/Transmitter, USB, V-by-One
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I/O Products

Dolphin Technology's I/O products encompass a vast selection of interface IPs known for their high-performance capabilities. These I/O components are designed to complement various process technologies, ensuring reliability and efficiency in applications ranging from core limited designs to flip-chip utilizations. The product range includes standard I/O, high-speed I/O, and specialty interface I/O that can be customized for specific design requirements. The portfolio comprises various specialized I/Os like High Voltage Tolerant GPIO, LVDS Tx/Rx, and several DDR and SD IO variations, each built to meet demanding design specifications. Dolphin Technology’s offerings are fully equipped with compilers that allow for customization, ensuring each I/O library can be tailored to address process and chip-specific needs, thereby delivering optimal performance and versatility. These I/O solutions are available in multiple forms, including inline styles and flip-chip arrangements, which assist in the efficient use of space and signal integrity in complex semiconductor designs. The capability to integrate with different technology levels further broadens the applicability of these products, making them suitable for a diverse set of industry requirements.

Dolphin Technology
Tower, TSMC
8nm LPP, 32/28nm, 65nm, 90nm
Input/Output Controller, USB
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DisplayPort Receiver

Trilinear Technologies has developed a cutting-edge DisplayPort Receiver that enhances digital connectivity, offering robust video reception capabilities necessary for today's high-definition video systems. Compliant with VESA standards, the receiver supports the latest DisplayPort specifications, effortlessly handling high-bandwidth video data necessary for applications such as ultra-high-definition televisions, professional video wall setups, and complex automotive display systems. The DisplayPort Receiver is designed with advanced features that facilitate seamless video data acquisition and processing, including multi-stream transport capabilities for handling multiple video streams concurrently. This is particularly useful in professional display settings where multiple input sources are needed. The core also incorporates adaptive sync features, which help reduce screen tearing and ensure smooth video playback, enhancing user experience significantly. An important facet of the DisplayPort Receiver is its low latency and high-efficiency operations, crucial for systems requiring real-time data processing. Trilinear's receiver core ensures that video data is processed with minimal delay, maintaining the integrity and fidelity of the original visual content. This makes it a preferred choice for high-performance applications in sectors like gaming, broadcasting, and high-definition video conferencing. To facilitate integration and ease of use, the DisplayPort Receiver is supported by a comprehensive suite of development tools and software packages. This makes the deployment process straightforward, allowing developers to integrate the receiver into both FPGA and ASIC environments with minimal adjustments. Its scalability and flexibility mean it can meet the demands of a wide range of applications, solidifying Trilinear Technologies' position as a leader in the field of semiconductor IP solutions.

Trilinear Technologies
AMBA AHB / APB/ AXI, Coprocessor, HDMI, Input/Output Controller, PCI, PowerPC, RapidIO, SATA, USB, V-by-One
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VoSPI Rx for FLIR Lepton IR Sensor

The VoSPI Rx for FLIR Lepton IR Sensor is designed to cater to infrared sensor needs for various applications. Specially configured to support the FLIR Lepton sensor, this receiver facilitates effective and precise data handling of infrared signals, crucial in environments demanding high thermal accuracy. It provides real-time processing capabilities, aligning with the rigorous demands of security and monitoring applications. This receiver excels in maintaining data integrity, ensuring that the thermal data transmitted across platforms is of the highest accuracy. Its sophisticated engineering allows it to work seamlessly with other system components, enhancing system performance and reliability. The receiver is integrated with features that boost signal processing while minimizing latency, providing a seamless operational environment. This ensures that users can rely on it for consistent performance across various industry applications, boosting both efficiency and reliability.

BitSimNOW - Part of Prevas
Bluetooth, RF Modules, Sensor, USB, UWB, WMV
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IP Platform for Low-Power IoT

The silicon IP Platform for Low-Power IoT by Low Power Futures integrates pre-validated, configurable building blocks tailored for IoT device creation. It provides a turnkey solution to accelerate product development, incorporating options to employ both ARM and RISC V processors. With a focus on reducing energy consumption, the platform is prepared for various applications, ensuring a seamless transition for products from conception to market. The platform is crucial for developing smart IoT solutions that require secure and reliable wireless communications across industries like healthcare, smart home, and industrial automation.

Low Power Futures
12 Categories
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USB Interface IP

USB Interface IP provides a reliable and standardized method for connecting peripherals to computer systems. Supporting a range of USB versions, these solutions offer high-speed data transfer capabilities with broad device compatibility. These interfaces are integral in day-to-day computing environments, facilitating communication between computers and devices such as keyboards, mice, and storage devices. They provide efficient data transfer rates and robust connectivity features that cater to both consumer and enterprise-level applications. Designed to support evolving USB standards, these IP solutions ensure that your devices remain compatible with the latest technological developments, providing a future-proof solution for connectivity. Offering both backward and forward compatibility, these interfaces maintain seamless operation with new and legacy devices alike.

Analog Circuit Works, Inc.
USB
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Yuzhen 600 RFID Chip

The Yuzhen 600 RFID Chip is engineered to provide exceptional performance in RFID applications, utilizing advanced technologies to enable efficient and accurate data capture and processing. This chip is designed for high-speed operations, ensuring that it can handle large volumes of RFID interactions seamlessly. With its robust architecture, the Yuzhen 600 is tailored for use in various environments, from supply chain management to secure access systems, delivering consistent and reliable performance. Its low power consumption and enhanced processing capabilities make it a valuable asset in optimizing RFID systems for better data management and operational efficiency.

T-Head Semiconductor
AI Processor, AMBA AHB / APB/ AXI, JESD 204A / JESD 204B, Microcontroller, NFC, Sensor, USB
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10G TCP Offload Engine (TOE)

The 10G TCP Offload Engine from Intilop brings a transformative approach to network protocol processing. Designed to handle TCP processing tasks, this engine ensures efficient data transmission by offloading TCP processing from the CPU, thus optimizing the resources available for other critical computing tasks. With features focused on reducing latency and increasing throughput, the 10G TOE is ideal for high-performance computing environments and data centers where speed and efficiency are paramount. The engine showcases Intilop's core expertise in delivering ultra-reliable and rapid networking solutions, providing support for multiple concurrent sessions with consistent low latency. Professionals in cloud services and enterprise networking will find the integration capabilities of the 10G TOE highly beneficial, as it supports a comprehensive suite of features that extend beyond traditional TCP processing, reinforcing security and operational efficiency.

Intilop Corporation
AMBA AHB / APB/ AXI, Error Correction/Detection, Ethernet, Interlaken, PCI, SAS, SATA, USB
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Camera PHY Interface for Advanced Processes

The Camera PHY Interface for Advanced Processes from Curious Corporation is engineered to support advanced imaging needs, optimizing data transfer in demanding environments. This interface excels in high-speed performance, providing robust connectivity for complex camera configurations. It is particularly valuable in applications requiring efficient bandwidth utilization and superior image data handling. Designed with modern imaging demands in mind, the Camera PHY Interface offers compatibility with various camera modules, allowing for seamless integration into diverse systems. Engineers can utilize this interface to enhance image capture capabilities, making it ideal for high-definition multimedia applications. Furthermore, its adaptability to different process nodes ensures that it can meet the rigorous demands of modern technological innovations. The interface's ability to support high-frequency operation while minimizing power consumption makes it suitable for portable and fixed imaging solutions.

CURIOUS Corporation
Samsung, TSMC
10nm, 16nm
Audio Interfaces, Camera Interface, Coder/Decoder, CSC, Interrupt Controller, MIPI, Other, Peripheral Controller, PowerPC, Receiver/Transmitter, USB
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