All IPs > Interface Controller & PHY > D2D > Die-to-Die (D2D) Interconnect
The Die-to-Die Interconnect from SkyeChip delivers a streamlined solution for high-speed data transfer between dies, ensuring minimal power overhead while maintaining high performance. Compliant with the Universal Chiplet Interconnect Express (UCIe) 2.0 specification, this IP supports transfer rates up to 32 Gbps per pin and integrates easily into diverse packaging technologies. Built-in tests and self-repair functions further enhance reliability and yield in multi-die systems.
| Class | Value |
|---|---|
| Categories |
Interface Controller & PHY > D2D |
| Availability | All Countries & Regions |
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