The HBM3 PHY & Memory Controller from SkyeChip offers a highly efficient, low-power memory interface tailored for applications in AI, high-performance computing, data centers, and networking. It adheres to the HBM3 JEDEC standards and provides a comprehensive PHY and Controller solution with more than 85% random efficiency. It supports speeds up to 6400 MT/s for HBM3 and 9600 MT/s for HBM3E, and includes a configurable PHY with intelligent interface training sequences. Suitable for 2.5D/3D packaging technologies, it supports up to 32Gb density per die and 16H HBM3 DRAM stacks.