Hermes Layered offers a sophisticated finite element method (FEM) simulation tool tailored for the analysis of multilayered IC, package, and PCB structures. This product addresses the intricate nature of electromagnetic field interactions in layered environments, providing precise EM modeling solutions for designers. Hermes Layered is designed to manage complex geometries and material properties, facilitating the exploration of design alternatives and optimization strategies. Its extensive simulation capabilities help engineers predict system behavior under various conditions, ensuring high-fidelity outcomes in RF, microwave, and high-speed digital applications. By supporting multi-physics simulation, Hermes Layered confirms that designs not only meet functional specifications but also maintain performance integrity under real-world conditions.
