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All IPs > Interface Controller & PHY > AMBA AHB / APB/ AXI

AMBA AHB, APB, AXI Semiconductor IP Solutions

AMBA, which stands for Advanced Microcontroller Bus Architecture, is a far-reaching and well-established open-standard, on-chip interconnect specification used widely in the design and structuring of system-on-chip (SoC) technologies. Among the most popular protocols under this architecture are AHB (Advanced High-performance Bus), APB (Advanced Peripheral Bus), and AXI (Advanced eXtensible Interface). These protocols facilitate effective communication between various components of a digital system, ensuring optimal performance and scalability.

**AHB, APB, and AXI Semiconductor IPs**

*AMBA AHB* is specifically designed for high-performance and high-bandwidth requirements. It's a parallel bus interface that is commonly employed for connecting processors and other high-speed components in a SoC. AHB IPs ensure that data is transferred efficiently across the components, making them ideal for applications where speed and reliability are crucial.

*AMBA APB* is tailored for low power and less complex communication needs. It is often used for interfacing with peripheral devices that do not require high throughput, such as UARTs or low-speed memory controllers. APB semiconductor IPs are valued for their simplicity and low power consumption, often being the choice for battery-operated or portable devices.

*AMBA AXI* is characterized by its advanced features, supporting high data bandwidth and flexible configurations. AXI IPs are used where the highest performance is needed, leveraging features like burst transactions, multiple outstanding addresses, and out-of-order transaction completion, making it suitable for complex and demanding tasks.

Integrating these semiconductor IPs into your system ensures that you leverage their specialized features for increased efficiency and performance. In products that require robust, flexible, and scalable communication channels, AMBA interface controllers and PHYs provide the backbone necessary to build systems that can meet current and future demands.

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Metis AIPU PCIe AI Accelerator Card

Addressing the need for high-performance AI processing, the Metis AIPU PCIe AI Accelerator Card from Axelera AI offers an outstanding blend of speed, efficiency, and power. Designed to boost AI workloads significantly, this PCIe card leverages the prowess of the Metis AI Processing Unit (AIPU) to deliver unparalleled AI inference capabilities for enterprise and industrial applications. The card excels in handling complex AI models and large-scale data processing tasks, significantly enhancing the efficiency of computational tasks within various edge settings. The Metis AIPU embedded within the PCIe card delivers high TOPs (Tera Operations Per Second), allowing it to execute multiple AI tasks concurrently with remarkable speed and precision. This makes it exceptionally suitable for applications such as video analytics, autonomous driving simulations, and real-time data processing in industrial environments. The card's robust architecture reduces the load on general-purpose processors by offloading AI tasks, resulting in optimized system performance and lower energy consumption. With easy integration capabilities supported by the state-of-the-art Voyager SDK, the Metis AIPU PCIe AI Accelerator Card ensures seamless deployment of AI models across various platforms. The SDK facilitates efficient model optimization and tuning, supporting a wide range of neural network models and enhancing overall system capabilities. Enterprises leveraging this card can see significant improvements in their AI processing efficiency, leading to faster, smarter, and more efficient operations across different sectors.

Axelera AI
13 Categories
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1G to 224G SerDes

The 1G to 224G SerDes technology by Alphawave Semi is a robust connectivity solution designed for high-speed data transmission. It integrates seamlessly into various applications including Ethernet, PCI Express, and die-to-die connections, enabling fast and reliable data transfer. This technology supports a broad spectrum of signaling schemes such as PAM2, PAM4, PAM6, and PAM8, ensuring compatibility with over 30 different industry protocols and standards. As the demand for high-performance data centers and networking solutions increases, the 1G to 224G SerDes proves indispensable, delivering the speed and bandwidth required by modern systems. Alphawave Semi's SerDes supports data rates from as low as 1Gbps to a staggering 224Gbps, making it highly versatile for a multitude of configurations. Its application extends beyond traditional data centers, also covering areas like AI and 5G communication networks where latency and data throughput are critical. This flexibility is further enhanced by its low power consumption, which is essential for efficient data processing in today's power-conscious technological environment. Incorporating the 1G to 224G SerDes into your chip designs guarantees reduced latency and increased data throughput, which is vital for applications that demand real-time data processing. By ensuring high data integrity and reducing signal degradation, this SerDes solution aids in maintaining steadfast connectivity, even under heavy data loads, promising a future-ready component in the evolving tech landscape.

Alphawave Semi
TSMC
3nm, 4nm, 7nm, 10nm, 12nm
AMBA AHB / APB/ AXI, D2D, DSP Core, Ethernet, Interlaken, MIPI, Multi-Protocol PHY, PCI, USB, Wireless Processor
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Yitian 710 Processor

The Yitian 710 Processor is a landmark server chip released by T-Head Semiconductor, representing a breakthrough in high-performance computing. This chip is designed with cutting-edge architecture that utilizes advanced Armv9 structure, accommodating a range of demanding applications. Engineered by T-Head's dedicated research team, Yitian 710 integrates high efficiency and bandwidth properties into a unique 2.5D package, housing two dies and a staggering 60 billion transistors. The Yitian 710 encompasses 128 Armv9 high-performance cores, each equipped with 64KB L1 instruction cache, 64KB L1 data cache, and 1MB L2 cache, further amplified by a collective on-chip system cache of 128MB. These configurations enable optimal data processing and retrieval speeds, making it suitable for data-intensive tasks. Furthermore, the memory subsystem stands out with its 8-channel DDR5 support, reaching peak bandwidths of 281GB/s. In terms of connectivity, the Yitian 710's I/O system includes 96 PCIe 5.0 channels with a bidirectional theoretical total bandwidth of 768GB/s, streamlining high-speed data transfer critical for server operations. Its architecture is not only poised to meet the current demands of data centers and cloud services but also adaptable for future advancements in AI inference and multimedia processing tasks.

T-Head Semiconductor
AI Processor, AMBA AHB / APB/ AXI, Audio Processor, CPU, IoT Processor, Microcontroller, Multiprocessor / DSP, Processor Core Independent, Processor Cores, Vision Processor
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Universal Chiplet Interconnect Express (UCIe)

The Universal Chiplet Interconnect Express (UCIe) by EXTOLL is a cutting-edge interconnect framework designed to revolutionize chip-to-chip communication within heterogeneous systems. This product exemplifies the shift towards chiplet architecture, a modular approach enabling enhanced performance and flexibility in semiconductor designs. UCIe offers an open and customizable platform that supports a wide range of technology nodes, particularly excelling in the 12nm to 28nm range. This adaptability ensures it can meet the diverse needs of modern semiconductor applications, providing a bridge that enhances integration across various chiplet components. Such capabilities make it ideal for applications requiring high bandwidth and low latency. The design of UCIe focuses on minimizing power consumption while maximizing data throughput, aligning with EXTOLL’s objective of delivering eco-efficient technology. It empowers manufacturers to forge robust connections between chiplets, allowing optimized performance and scalability in data-intensive environments like data centers and advanced consumer electronics.

EXTOLL GmbH
GLOBALFOUNDRIES
22nm, 28nm, 28nm SLP
AMBA AHB / APB/ AXI, D2D, Gen-Z, Multiprocessor / DSP, Network on Chip, Processor Core Dependent, Processor Core Independent, USB, V-by-One, VESA
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ARINC 818 Switch IP Core

iWave Global introduces the ARINC 818 Switch, a pivotal component in the management and routing of video data within avionics systems. Designed for applications that require efficient video data distribution and management, the switch is optimized for performance in environments with stringent data handling requirements. The switch's architecture supports a high level of bandwidth, allowing for the smooth routing of multiple video streams in real-time. Its design includes advanced features that ensure low-latency, error-free data transfer, integral to maintaining the integrity and reliability of video data in critical applications. Featuring robust interoperability characteristics, the ARINC 818 Switch easily integrates into existing systems, facilitating modular expansion and adaptability to new technological standards. It is indispensable for any aerospace project that involves complex video data management, providing a stable platform for video data routing and switching.

iWave Global
AMBA AHB / APB/ AXI, Coder/Decoder, Peripheral Controller
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AI Camera Module

The AI Camera Module from Altek is a versatile, high-performance component designed to meet the increasing demand for smart vision solutions. This module features a rich integration of imaging lens design and combines both hardware and software capacities to create a seamless operational experience. Its design is reinforced by Altek's deep collaboration with leading global brands, ensuring a top-tier product capable of handling diverse market requirements. Equipped to cater to AI and IoT interplays, the module delivers outstanding capabilities that align with the expectations for high-resolution imaging, making it suitable for edge computing applications. The AI Camera Module ensures that end-user diversity is meaningfully addressed, offering customization in device functionality which supports advanced processing requirements such as 2K and 4K video quality. This module showcases Altek's prowess in providing comprehensive, all-in-one camera solutions which leverage sophisticated imaging and rapid processing to handle challenging conditions and demands. The AI Camera's technical blueprint supports complex AI algorithms, enhancing not just image quality but also the device's interactive capacity through facial recognition and image tracking technology.

Altek Corporation
Samsung
22nm
2D / 3D, AI Processor, AMBA AHB / APB/ AXI, Audio Interfaces, GPU, Image Conversion, IoT Processor, JPEG, Receiver/Transmitter, SATA, Vision Processor
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LVDS IP

This LVDS IP offers seamless transmission solutions for high-speed data in digital systems. Its design allows for minimized electromagnetic interference while maintaining signal integrity. Often used in video and graphic applications, the LVDS IP ensures efficient data handling, making it a critical component in complex electronic interfaces.

Sunplus Technology Co., Ltd.
AMBA AHB / APB/ AXI
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AUTOSAR & Adaptive AUTOSAR Solutions

KPIT Technologies is a leader in providing AUTOSAR and Adaptive AUTOSAR solutions, facilitating the development of software architectures that standardize interoperability across the automotive industry. Designed to support the increasing complexity of modern vehicle electronic infrastructures, KPIT's solutions enable seamless integration of software components, promoting scalability and reliability. AUTOSAR (Automotive Open System Architecture) is essential for developing modular and flexible software systems, allowing automakers to focus on innovative application features while ensuring software compatibility and integration ease. KPIT offers a comprehensive range of services, from basic software to complex component development, tailored to fit specific industry needs. With Adaptive AUTOSAR, KPIT accelerates the transition to software-defined vehicles by providing flexible, scalable, and upgradable software solutions that cater to the dynamic requirements of connected and autonomous vehicles. By aligning with industry standards, KPIT’s AUTOSAR solutions ensure cost efficiency, reduce development time, and enhance the overall quality and functionality of automotive software systems.

KPIT Technologies
AMBA AHB / APB/ AXI
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Aries fgOTN Processors

The Aries fgOTN processor family is engineered according to the ITU-T G.709.20 fgOTN standard. This line of processors handles a variety of signals, including E1/T1, FE/GE, and STM1/STM4, effectively monitoring and managing alarms and performance metrics. Aries processors excel at fine-grain traffic aggregation, efficiently channeling fgODUflex traffic across OTN lines to support Ethernet, SDH, PDH client services. Their capacity to map signals to fgODUflex containers, which are then multiplexed into higher order OTN signals, demonstrates their versatility and efficiency. By allowing cascaded configurations with other Aries devices or Apodis processors, Aries products optimize traffic routes through OTN infrastructures, positioning them as essential components in optical networking and next-generation access scenarios.

Tera-Pass
AMBA AHB / APB/ AXI, HBM, NAND Flash, PCMCIA, Receiver/Transmitter, SAS
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SerDes Interfaces

Silicon Creations' SerDes Interfaces are crafted to handle high-speed data transmission challenges over varied processes, ranging from 12nm to 180nm. Addressing multiple protocols such as CPRI, PCIe, and SATA, these interfaces demonstrate flexibility by supporting data transmission speeds from 100 Mbps to beyond 32 Gbps. The architecture incorporates a host of advanced features including adaptive equalization techniques and programmable de-serialization widths, making it stand out in terms of performance and signal integrity even under challenging conditions. With ultra-low latency PMAs, they sustain excellent operational speed and efficiency, imperative for sophisticated communication applications. Moreover, Silicon Creations partners with leading entities to provide comprehensive solutions, including complete PCIe PHY integrations. This synergy ensures that SerDes Interfaces are fully optimized for operational excellence, delivering stable and reliable communication signals. With an emphasis on low power and minimized area requirements, they cater to burgeoning industry needs for power-efficient and space-conservative designs.

Premium Vendor
Silicon Creations
TSMC
16nm, 180nm
AMBA AHB / APB/ AXI, MIPI, Multi-Protocol PHY, PCI, SATA, USB
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AMBA APB Target

Advanced Peripheral Bus (APB) is one of the Advanced Microcontroller Bus Architecture (AMBA) family protocols. It is a low-cost interface that is designed for low power consumption and interface simplicity. Unlike AHB, it is a non-pipelined protocol for connecting low-bandwidth peripherals. Mostly used to link external peripherals to the SOC. Every APB transfer requires at least two clock cycles (SETUP Cycle and ACCESS Cycle) to finish. The APB interface is designed for accessing the programmable control registers of peripheral devices. The APB protocol has two independent data buses, one for read data and one for write data. The buses can be 8, 16, or 32 bits wide. The read and write data buses must have the same width. Data transfers cannot occur concurrently because the read data and write data buses do not have their own individual handshake signals.

Agnisys, inc.
All Foundries
All Process Nodes
AMBA AHB / APB/ AXI
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Chimera GPNPU

Chimera GPNPU is engineered to revolutionize AI/ML computational capabilities on single-core architectures. It efficiently handles matrix, vector, and scalar code, unifying AI inference and traditional C++ processing under one roof. By alleviating the need for partitioning AI workloads between different processors, it streamlines software development and drastically speeds up AI model adaptation and integration. Ideal for SoC designs, the Chimera GPNPU champions an architecture that is both versatile and powerful, handling complex parallel workloads with a single unified binary. This configuration not only boosts software developer productivity but also ensures an enduring flexibility capable of accommodating novel AI model architectures on the horizon. The architectural fabric of the Chimera GPNPU seamlessly blends the high matrix performance of NPUs with C++ programmability found in traditional processors. This core is delivered in a synthesizable RTL form, with scalability options ranging from a single-core to multi-cluster designs to meet various performance benchmarks. As a testament to its adaptability, the Chimera GPNPU can run any AI/ML graph from numerous high-demand application areas such as automotive, mobile, and home digital appliances. Developers seeking optimization in inference performance will find the Chimera GPNPU a pivotal tool in maintaining cutting-edge product offerings. With its focus on simplifying hardware design, optimizing power consumption, and enhancing programmer ease, this processor ensures a sustainable and efficient path for future AI/ML developments.

Quadric
TSMC
1000nm
17 Categories
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xcore.ai

xcore.ai is XMOS Semiconductor's innovative programmable chip designed for advanced AI, DSP, and I/O applications. It enables developers to create highly efficient systems without the complexity typical of multi-chip solutions, offering capabilities that integrate AI inference, DSP tasks, and I/O control seamlessly. The chip architecture boasts parallel processing and ultra-low latency, making it ideal for demanding tasks in robotics, automotive systems, and smart consumer devices. It provides the toolset to deploy complex algorithms efficiently while maintaining robust real-time performance. With xcore.ai, system designers can leverage a flexible platform that supports the rapid prototyping and development of intelligent applications. Its performance allows for seamless execution of tasks such as voice recognition and processing, industrial automation, and sensor data integration. The adaptable nature of xcore.ai makes it a versatile solution for managing various inputs and outputs simultaneously, while maintaining high levels of precision and reliability. In automotive and industrial applications, xcore.ai supports real-time control and monitoring tasks, contributing to smarter, safer systems. For consumer electronics, it enhances user experience by enabling responsive voice interfaces and high-definition audio processing. The chip's architecture reduces the need for exterior components, thus simplifying design and reducing overall costs, paving the way for innovative solutions where technology meets efficiency and scalability.

XMOS Semiconductor
24 Categories
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Metis AIPU M.2 Accelerator Module

The Metis AIPU M.2 Accelerator Module by Axelera AI is a compact and powerful solution designed for AI inference at the edge. This module delivers remarkable performance, comparable to that of a PCIe card, all while fitting into the streamlined M.2 form factor. Ideal for demanding AI applications that require substantial computational power, the module enhances processing efficiency while minimizing power usage. With its robust infrastructure, it is geared toward integrating into applications that demand high throughput and low latency, making it a perfect fit for intelligent vision applications and real-time analytics. The AIPU, or Artificial Intelligence Processing Unit, at the core of this module provides industry-leading performance by offloading AI workloads from traditional CPU or GPU setups, allowing for dedicated AI computation that is faster and more energy-efficient. This not only boosts the capabilities of the host systems but also drastically reduces the overall energy consumption. The module supports a wide range of AI applications, from facial recognition and security systems to advanced industrial automation processes. By utilizing Axelera AI’s innovative software solutions, such as the Voyager SDK, the Metis AIPU M.2 Accelerator Module enables seamless integration and full utilization of AI models and applications. The SDK offers enhancements like compatibility with various industry tools and frameworks, thus ensuring a smooth deployment process and quick time-to-market for advanced AI systems. This product represents Axelera AI’s commitment to revolutionizing edge computing with streamlined, effective AI acceleration solutions.

Axelera AI
14 Categories
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Ethernet MAC 10M/100M/1G/2.5G IP

Ethernet MAC 10M/100M/1G/2.5G IP is a solution that enables the host to communicate data using the IEEE 802.3 standard for 10M, 100M, 1G, 2.5G speeds and is suited for use in networking equipment such as switches and routers. The Client-side interface for the IP is AXI-S and the Ethernet MAC IP comes with GMII, RGMII or MII interfaces on the PHY side. The Ethernet MAC 10M/100M/1G/2.5G IP features a compact and low latency solution, it is highly configurable and can optionally include IEEE 1588 Timestamping Unit (TSU). The Silicon agnostic Ethernet MAC IP, suitable for ASICs and FPGAs, is prepared for easy integration with Ethernet PCS 10M/ 100M/1G/2.5G IP from Comcores.

Comcores
All Foundries
All Process Nodes
AMBA AHB / APB/ AXI, Ethernet
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AMBA AHB Target

AMBA AHB is a bus interface designed for high-performance synthesizable applications. It specifies the interface between components such as initiator , interconnects, and targets. AMBA AHB incorporates the features needed for high-performance, high clock frequency systems. The most common AHB targets are internal memory devices, external memory interfaces, and high-bandwidth peripherals.

Agnisys, inc.
All Foundries
All Process Nodes
AMBA AHB / APB/ AXI
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GenAI v1

RaiderChip's GenAI v1 is a pioneering hardware-based generative AI accelerator, designed to perform local inference at the Edge. This technology integrates optimally with on-premises servers and embedded devices, offering substantial benefits in privacy, performance, and energy efficiency over traditional hybrid AI solutions. The design of the GenAI v1 NPU streamlines the process of executing large language models by embedding them directly onto the hardware, eliminating the need for external components like CPUs or internet connections. With its ability to support complex models such as the Llama 3.2 with 4-bit quantization on LPDDR4 memory, the GenAI v1 achieves unprecedented efficiency in AI token processing, coupled with energy savings and reduced latency. What sets GenAI v1 apart is its scalability and cost-effectiveness, significantly outperforming competitive solutions such as Intel Gaudi 2, Nvidia's cloud GPUs, and Google's cloud TPUs in terms of memory efficiency. This solution maximizes the number of tokens generated per unit of memory bandwidth, thus addressing one of the primary limitations in generative AI workflow. Furthermore, the adept memory usage of GenAI v1 reduces the dependency on costly memory types like HBM, opening the door to more affordable alternatives without diminishing processing capabilities. With a target-agnostic approach, RaiderChip ensures the GenAI v1 can be adapted to various FPGAs and ASICs, offering configuration flexibility that allows users to balance performance with hardware costs. Its compatibility with a wide range of transformers-based models, including proprietary modifications, ensures GenAI v1's robust placement across sectors requiring high-speed processing, like finance, medical diagnostics, and autonomous systems. RaiderChip's innovation with GenAI v1 focuses on supporting both vanilla and quantized AI models, ensuring high computation speeds necessary for real-time applications without compromising accuracy. This capability underpins their strategic vision of enabling versatile and sustainable AI solutions across industries. By prioritizing integration ease and operational independence, RaiderChip provides a tangible edge in applying generative AI effectively and widely.

RaiderChip
GLOBALFOUNDRIES, TSMC
28nm, 65nm
AI Processor, AMBA AHB / APB/ AXI, Audio Controller, Coprocessor, CPU, Ethernet, Microcontroller, Multiprocessor / DSP, PowerPC, Processor Core Dependent, Processor Cores
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AHB-Lite APB4 Bridge

The AHB-Lite APB4 Bridge serves as a crucial interconnect that facilitates communication between the AMBA 3 AHB-Lite and AMBA APB bus protocols. As a parameterized soft IP, it offers flexibility and adaptability in managing system interconnections, bridging the gap between high-speed and low-speed peripherals with efficiency. The bridge's architecture is designed to maintain data integrity while transferring information across different protocol tiers. This bridge supports the implementation of a seamless transition for data exchanges, ensuring data packets are transmitted with minimal latency. It is ideal for systems that require stable connectivity across multiple peripheral interfaces, delivering a cohesive platform for system designers to enhance operational uniformity. By enabling efficient bus conversion, it supports broader system architectures, contributing to the overall efficiency of embedded designs. With its open-architecture design, the AHB-Lite APB4 Bridge caters to a wide range of applications, providing necessary adaptability to meet the unique demands of each project. Its robust design ensures that it can accommodate the complex architectures of modern embedded systems, enhancing both performance and reliability.

Roa Logic BV
AMBA AHB / APB/ AXI, Embedded Security Modules, I2C, Input/Output Controller, Interlaken, Smart Card
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GenAI v1-Q

The GenAI v1-Q from RaiderChip brings forth a specialized focus on quantized AI operations, reducing memory requirements significantly while maintaining impressive precision and speed. This innovative accelerator is engineered to execute large language models in real-time, utilizing advanced quantization techniques such as Q4_K and Q5_K, thereby enhancing AI inference efficiency especially in memory-constrained environments. By offering a 276% boost in processing speed alongside a 75% reduction in memory footprint, GenAI v1-Q empowers developers to integrate advanced AI capabilities into smaller, less powerful devices without sacrificing operational quality. This makes it particularly advantageous for applications demanding swift response times and low latency, including real-time translation, autonomous navigation, and responsive customer interactions. The GenAI v1-Q diverges from conventional AI solutions by functioning independently, free from external network or cloud auxiliaries. Its design harmonizes superior computational performance with scalability, allowing seamless adaptation across variegated hardware platforms including FPGAs and ASIC implementations. This flexibility is crucial for tailoring performance parameters like model scale, inference velocity, and power consumption to meet exacting user specifications effectively. RaiderChip's GenAI v1-Q addresses crucial AI industry needs with its ability to manage multiple transformer-based models and confidential data securely on-premises. This opens doors for its application in sensitive areas such as defense, healthcare, and financial services, where confidentiality and rapid processing are paramount. With GenAI v1-Q, RaiderChip underscores its commitment to advancing AI solutions that are both environmentally sustainable and economically viable.

RaiderChip
TSMC
65nm
AI Processor, AMBA AHB / APB/ AXI, Audio Controller, Coprocessor, CPU, Ethernet, Microcontroller, Multiprocessor / DSP, PowerPC, Processor Core Dependent, Processor Cores
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PCIe Retimer

With a focus on maintaining signal integrity in high-speed interfaces, the PCIe Retimer extends the reach of PCI Express connections while preserving data quality. Essential for long signal paths, it works by regenerating signals to boost performance and provide reliable connections across distances. The retimer is particularly effective in environments with substantial electromagnetic interference, ensuring data transmission remains error-free and efficient across extended cable runs. By including line equalization and using advanced clock recovery techniques, the PCIe Retimer strengthens signal quality, allowing for greater system performance and reliability in a wide array of computing applications.

PrimeSOC Technologies
Samsung, TSMC
28nm, 55nm
AMBA AHB / APB/ AXI, DLL, PCI, RapidIO
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Maverick-2 Intelligent Compute Accelerator

The Maverick-2 Intelligent Compute Accelerator represents the pinnacle of Next Silicon's innovative approach to computational resources. This state-of-the-art accelerator leverages the Intelligent Compute Architecture for software-defined adaptability, enabling it to autonomously tailor its real-time operations across various HPC and AI workloads. By optimizing performance using insights gained through real-time telemetry, Maverick-2 ensures superior computational efficiency and reduced power consumption, making it an ideal choice for demanding computational environments.\n\nMaverick-2 brings transformative performance enhancements to large-scale scientific research and data-heavy industries by dispensing with the need for codebase modifications or specialized software stacks. It supports a wide range of familiar development tools and frameworks, such as C/C++, FORTRAN, and Kokkos, simplifying the integration process for developers and reducing time-to-discovery significantly.\n\nEngineered with advanced features like high bandwidth memory (HBM3E) and built on TSMC's 5nm process technology, this accelerator provides not only unmatched adaptability but also an energy-efficient, eco-friendly computing solution. Whether embedded in single-die PCIe cards or dual-die OCP Accelerator Modules, the Maverick-2 is positioned as a future-proof solution capable of evolving with technological advancements in AI and HPC.

Next Silicon Ltd.
TSMC
5nm
11 Categories
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ARINC 818 Product Suite

Great River Technology offers the ARINC 818 Product Suite, a comprehensive collection of tools and products designed to cover the full spectrum of ARINC 818 applications. This suite is pivotal for engineers and designers who are focused on the aviation sector, providing solutions necessary for the creation, testing, and deployment of high-speed digital interfaces in avionics. The suite supports design and implementation phases by offering robust support tools tailored for ARINC 818 development, including detailed implementers' guides and simulation resources. What's unique about this suite is its ability to facilitate process integrations for ARINC 818 standards across various platforms, making it adaptable for differing needs in aviation systems. The integration tools provided ensure that systems can efficiently manage data and video transmissions, providing clarity, speed, and reliability, all essential factors in mission-critical environments. Great River Technology’s ARINC 818 Product Suite is engineered to ensure seamless interoperability, offering support from initial project development through to practical operation, thus enabling avionic systems to function optimally in both standard and specialized conditions.

Great River Technology, Inc.
802.11, AMBA AHB / APB/ AXI, Analog Front Ends, Audio Interfaces, D2D, Ethernet, Graphics & Video Modules, HDMI, I2C, MIPI, MPEG 5 LCEVC, Peripheral Controller, V-by-One, VC-2 HQ
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PDM-to-PCM Converter

The PDM-to-PCM Converter from Archband Labs leads in transforming pulse density modulation signals into pulse code modulation signals. This converter is essential in applications where high fidelity of audio signal processing is vital, including digital audio systems and communication devices. Archband’s solution ensures accurate conversion, preserving the integrity and clarity of the original audio. This converter is crafted to seamlessly integrate with a wide array of systems, offering flexibility and ease-of-use in various configurations. Its robust design supports a wide range of input frequencies, making it adaptable to different signal environments. The PDM-to-PCM Converter also excels in minimizing latency and reducing overhead processing times. It’s engineered for environments where precision and sound quality are paramount, ensuring that audio signals remain crisp and undistorted during conversion processes.

Archband Labs
AMBA AHB / APB/ AXI, Audio Interfaces, Coder/Decoder, CSC, GPU, Input/Output Controller, Receiver/Transmitter, VC-2 HQ
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NuLink Die-to-Die PHY for Standard Packaging

The NuLink Die-to-Die PHY for Standard Packaging by Eliyan is engineered to facilitate superior die-to-die interconnectivity on standard organic/laminate package substrates. This innovative PHY IP supports key industry standards such as UCIe and BoW, and includes proprietary technologies like UMI and SBD. The NuLink PHY delivers leading performance and power efficiency, comparable to advanced packaging technologies, but at a fraction of the cost. It features configurations with up to 64 data lanes, supporting a data rate per lane of up to 64Gbps, making it ideal for applications demanding high bandwidth and low latency. The implementation enhances system design while reducing the necessary area and thermal load, which significantly eases integration into existing hardware ecosystems.

Eliyan
TSMC
3nm, 10nm, 16nm
AMBA AHB / APB/ AXI, CXL, D2D, DDR, MIPI, Network on Chip, Processor Core Dependent, V-by-One
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aiSim 5

aiSim 5 stands as a cutting-edge simulation tool specifically crafted for the automotive sector, with a strong focus on validating ADAS and autonomous driving solutions. It distinguishes itself with an AI-powered digital twin creation capability, offering a meticulously optimized sensor simulation environment that guarantees reproducibility and determinism. The adaptable architecture of aiSim allows seamless integration with existing industry toolchains, significantly minimizing the need for costly real-world testing.\n\nOne of the key features of aiSim is its capability to simulate various challenging weather conditions, enhancing testing accuracy across diverse environments. This includes scenarios like snowstorms, heavy fog, and rain, with sensors simulated based on physics, offering changes in conditions in real-time. Its certification with ISO 26262 ASIL-D attests to its automotive-grade quality and reliability, providing a new standard for testing high-fidelity sensor data in varied operational design domains.\n\nThe flexibility of aiSim is further highlighted through its comprehensive SDKs and APIs, which facilitate smooth integration into various systems under test. Additionally, users can leverage its extensive 3D asset library to establish detailed, realistic testing environments. AI-based rendering technologies underpin aiSim's data simulation, achieving both high efficiency and accuracy, thereby enabling rapid and effective validation of advanced driver assistance and autonomous driving systems.

aiMotive
26 Categories
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AMBA AXI Target

The Advanced eXtensible Interface(AXI) bus is a high-performance parallel bus that connects on-chip peripheral circuits (or IP blocks) to processor cores. The AXI bus employs "channels" to divide read and write transactions into semi-independent activities that can run at their own pace. The Read Address and Read Data channels send data from the target to the initiator, whereas the Write Address, Write Data, and Write Response channels transfer data from the initiator to the target.

Agnisys, inc.
AMBA AHB / APB/ AXI
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eSi-Connect

eSi-Connect offers an extensive suite of AMBA-compliant peripheral IPs designed to streamline SoC integration. This suite encompasses versatile memory controllers, standard off-chip interface support, and essential control functions. Its configurability and compatibility with low-level software drivers make it suitable for real-time deployment in complex system architectures, promoting reliable connectivity across various applications.

eSi-RISC
AMBA AHB / APB/ AXI, Gen-Z, I2C, Input/Output Controller, LCD Controller, PCI, Peripheral Controller, Receiver/Transmitter, SATA, Timer/Watchdog, USB
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High-Speed Interface Technology

This product offers an extensive range of high-speed interface IP solutions developed using an array of process technologies from 28nm to 90nm nodes. It supports various technology needs and provides tailored services for IP customization and transfer, enhancing adaptability for state-of-the-art processes or more mature ones ranging from 90-180nm. These encompass technologies like USB, DDR, and MIPI, ensuring robust solutions for advanced data communication requirements.

VeriSyno Microelectronics Co., Ltd.
AMBA AHB / APB/ AXI, DDR, Ethernet, HBM, HDLC, HDMI, MIPI, PCI, SATA, USB
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RapidGPT - AI-Driven EDA Tool

RapidGPT by PrimisAI is a revolutionary AI-based tool that transforms the landscape of Electronic Design Automation (EDA). Using generative AI, RapidGPT facilitates a seamless transition from traditional design methods to a more dynamic and intuitive process. This tool is characterized by its ability to interpret natural language inputs, enabling hardware designers to communicate design intentions effortlessly and effectively. Through RapidGPT, engineers gain access to a powerful code assistant that simplifies the conversion of ideas into fully realized Verilog code. By integrating third-party semiconductor IP seamlessly, the tool extends beyond basic design needs to offer a comprehensive framework for accelerating development times. RapidGPT further distinguishes itself by guiding users through the entire design lifecycle, from initial concepts to complete bitstream and GDSII stages, thus redefining productivity in hardware design. With RapidGPT, PrimisAI supports a wide spectrum of interactions and is trusted by numerous companies, underscoring its reliability and impact in the field. The tool's ability to enhance productivity and reduce time-to-market makes it a preferred choice for engineers aiming to combine efficiency with innovation in their projects. Easy to integrate into existing workflows, RapidGPT sets new standards in EDA, empowering users with an unparalleled interface and experience.

PrimisAI
AMBA AHB / APB/ AXI, CPU, Ethernet, HDLC, Processor Core Independent
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AXI4 DMA Controller

Digital Blocks' AXI4 DMA Controller is a robust solution designed for transferring data efficiently between systems over the AXI4 interface. Supporting up to 16 independent channels, it excels in high data throughput both for small and large data sets. Its capabilities are extended with advanced DMA features, allowing custom configurations to minimize silicon usage and licensing costs. Precise control over DMA operations is facilitated through its customizable settings, supporting a flexible range of interface buses and addressing modes.

Digital Blocks
AMBA AHB / APB/ AXI, DMA Controller, Ethernet, SAS, SD, SDRAM Controller, SRAM Controller, USB
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Apodis OTN Processors

The Apodis family of Optical Transport Network processors adheres to ITU-T standards, offering a comprehensive suite for signal termination, processing, and multiplexing. Designed to handle both SONET/SDH and Ethernet client services, these processors map signals to Optical Transport Network (OTN), empowering versatile any-port, any-service configurations. Apodis processors are notable for their capacity to support up to 16 client ports and four 10G OTN line ports, delivering bandwidth scalability up to 40G, crucial for wireless backhaul and fronthaul deployments. With a robust, non-blocking OTN switching fabric, Apodis facilitates seamless client-to-line and line-to-line connections while optimally managing network bandwidth. This adaptability makes the Apodis processors an ideal choice for next-generation access networks and optical infrastructures.

Tera-Pass
AMBA AHB / APB/ AXI, HBM, NAND Flash, PCMCIA, Receiver/Transmitter, SAS
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Ncore Cache Coherent Interconnect

The Ncore Cache Coherent Interconnect is designed to tackle the complexities inherent in multicore SoC environments. By maintaining coherence across heterogeneous cores, it enables efficient data sharing and optimizes cache use. This in turn enhances the throughput of the system, ensuring reliable performance with reduced latency. The architecture supports a wide range of cores, making it a versatile option for many applications in high-performance computing. With Ncore, designers can address the challenges of maintaining data consistency across different processor cores without incurring significant power or performance penalties. The interconnect's capability to handle multicore scenarios means it is perfectly suited for advanced computing solutions where data integrity and speed are paramount. Additionally, its configuration options allow customization to meet specific project needs, maintaining flexibility in design applications. Its efficiency in multi-threading environments, coupled with robust data handling, marks it as a crucial component in designing state-of-the-art SoCs. By supporting high data throughput, Ncore keeps pace with the demands of modern processing needs, ensuring seamless integration and operation across a variety of sectors.

Arteris
15 Categories
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SerDes PHY

The SerDes PHY offered by Credo Semiconductor epitomizes the pinnacle of performance in data communication. This physical layer device is crafted to deliver high-speed serial connections critical for data centers and AI infrastructures. Using advanced technology, it supports data rates that can extend up to an impressive 224Gbps per lane. The product is meticulously designed to facilitate PAM4 data transmission, enabling significant improvements in bandwidth that cater to next-generation data demands. Embedded with cutting-edge features, the SerDes PHY ensures seamless integration across multiple platform architectures. It is well-suited for systems employing Multichip Module System on Chip (MCM SoC) and 2.5D Silicon Interposer designs. These capabilities make it highly adaptable for diverse applications ranging from switch fabric ASIC and AI ASIC to machine learning processes, providing unparalleled solutions for expanding data processing needs. Credo's SerDes PHY stands out not only for its high data rate capabilities but also for its exceptional power efficiency. Even at demanding data transmission speeds, it ensures lower power consumption, thus reducing operational costs while maintaining top-tier performance. Its dedicated design approach embodies a commitment to reliability and scalability, ensuring that it can efficiently handle the rigors of extensive AI and hyperscale network operations.

Credo Semiconductor
TSMC, UMC
7nm LPP, 32nm
AMBA AHB / APB/ AXI, D2D, Ethernet, Gen-Z, IEEE1588, Interlaken, MIL-STD-1553, Multi-Protocol PHY, PCI, SATA
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C100 IoT Control and Interconnection Chip

The C100 IoT chip by Chipchain is engineered to meet the diverse needs of modern IoT applications. It integrates a powerful 32-bit RISC-V CPU capable of reaching speeds up to 1.5GHz, with built-in RAM and ROM to facilitate efficient data processing and computational capabilities. This sophisticated single-chip solution is known for its low power consumption, making it ideal for a variety of IoT devices. This chip supports seamless connectivity through embedded Wi-Fi and multiple transmission interfaces, allowing it to serve broad application areas with minimal configuration complexity. Additionally, it boasts integrated ADCs, LDOs, and temperature sensors, offering a comprehensive toolkit for developers looking to innovate across fields like security, healthcare, and smart home technology. Notably, the C100 simplifies the development process with its high level of integration and performance. It stands as a testament to Chipchain's commitment to providing reliable, high-performance solutions for the rapidly evolving IoT landscape. The chip's design focuses on ensuring stability and security, which are critical in IoT installations.

Shenzhen Chipchain Technologies Co., Ltd.
TSMC
10nm, 65nm
20 Categories
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AHB-Lite Multilayer Switch

The AHB-Lite Multilayer Switch by Roa Logic is a sophisticated interconnect fabric that provides high performance with low latency capabilities. Designed for extensive connectivity, it supports an unlimited number of bus masters and slaves, making it ideal for large-scale system architectures. This switch ensures data is efficiently propagated through various paths, optimizing resource allocation and throughput in complex systems. With a focus on performance, the multilayer switch is crafted to manage data traffic within high-demand environments seamlessly. Its support for multiple layers allows it to efficiently handle concurrent data transactions, facilitating effective communication between different system components. The adaptive structure and controlled latency pathways enable it to fit a multitude of applications, including those requiring rapid data transfer and processing. The AHB-Lite Multilayer Switch is engineered to integrate seamlessly into modern system architectures, enhancing throughput without compromising on signal integrity. Its robust design and flexible configuration options make it indispensable within systems necessitating dynamic connectivity solutions.

Roa Logic BV
AMBA AHB / APB/ AXI, Embedded Security Modules, Input/Output Controller
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Multi-Protocol SerDes

The Multi-Protocol SerDes provided by Silicon Creations serves as an essential component for high-speed data interfaces across multiple industry protocols. This SerDes portfolio accommodates a vast array of protocols such as PCIe, JESD204, XAUI, and many more, facilitating broad compatibility with industry standards. Operating across 12nm to 180nm processes, these interfaces support data rates from 100 Mbps to an impressive 32.75 Gbps. Incorporating advanced features like programmable de-serialization widths and adaptive equalization, the Multi-Protocol SerDes ensures optimal signal integrity and performance even in demanding environments. The design includes jitter cleaner functions and employs low-latency optimized PMAs, delivering high precision and speed across various operational scenarios. This comprehensive adaptability ensures seamless integration into a wide range of applications from communications to high-performance computing. Supported by robust architectures, the SerDes enables enhanced efficiency and reliability, featuring low power consumption and reduced area overheads. With a commitment to customer satisfaction, Silicon Creations offers complete solutions through partnerships with leading controller vendors, cementing its products as high-value choices for modern electronic systems.

Premium Vendor
Silicon Creations
TSMC
40nm, 180nm
AMBA AHB / APB/ AXI, Interlaken, MIPI, Multi-Protocol PHY, PCI, USB, V-by-One
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AHB-Lite Timer

The AHB-Lite Timer module designed by Roa Logic is compliant with the RISC-V Privileged 1.9.1 specification, offering a versatile timing solution for embedded applications. As an integral peripheral, it provides precise timing functionalities, enabling applications to perform scheduled operations accurately. Its parameterized design allows developers to adjust the timer's features to match the needs of their system effectively. This timer module supports a broad scope of timing tasks, ranging from simple delay setups to complex timing sequences, making it ideal for various embedded system requirements. The flexibility in its design ensures straightforward implementation, reducing complexity and enhancing the overall performance of the target application. With RISC-V compliance at its core, the AHB-Lite Timer ensures synchronization and precision in signal delivery, crucial for systems tasked with critical timing operations. Its adaptable architecture and dependable functionality make it an exemplary choice for projects where timing accuracy is required.

Roa Logic BV
AMBA AHB / APB/ AXI, CPU, Cryptography Software Library, Input/Output Controller, Timer/Watchdog
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ePHY-5616

The ePHY-5616 is a formidable force in high-speed data processing, supporting data rates from 1Gbps to a robust 56Gbps. Tailored to meet the needs of dynamic 16nm and 12nm process node environments, this solution was crafted to excel in both area and power efficiency. Its design incorporates cutting-edge DSP techniques to handle various insertion losses, ensuring optimal performance over a significant distance with minimal signal degradation. This IP offers a scalable architecture that effectively adapts to a range of applications, from enterprise routers to data center switches. The high level of configurability in its DSP-based receiver architecture allows for quick and precise performance tuning. The integration of eZLINK™, a proprietary algorithm, provides rapid performance tuning within a sub-millisecond range, enhancing the flexibility and responsiveness of system integration. Additionally, the ePHY-5616 supports up to 8-tap TX FIR for transmit de-emphasis, which is crucial for managing signal integrity over extended paths. Its embedded microcontroller (MCU) allows for extensive functionality and future feature expansion. This IP is further supported by a comprehensive suite of diagnostic features to facilitate system bring-up and performance tuning, making it an ideal choice for high-performance networking equipment.

eTopus Technology Inc.
TSMC
28nm, 65nm
AMBA AHB / APB/ AXI, Ethernet, Interlaken, PCI
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Bus Convertors

The bus converter module transforms wide initiator data buses to smaller target data buses or vice-versa. A narrow target on a wide bus, only requires external logic and no internal design changes. * APB: 32-bit wide initiator data buses to 16-bit target data buses. * AHB: 64-bit wide initiator data buses to 32-bit target data buses. * AXI: 256-bit wide initiator data buses to 64-bit target data buses A wide target on a narrow bus, only requires external logic and no internal design changes. * APB: 16-bit wide initiator data buses to 32-bit target data buses. * AHB: 32-bit wide initiator data buses to 64-bit target data buses. * AXI: 64-bit wide initiator data buses to 256-bit target data buses.

Agnisys, inc.
AMBA AHB / APB/ AXI
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ARINC 818-3 IP Core

The ARINC 818-3 IP Core from iWave Global represents an advancement in avionics video interface technology, designed for high-speed and high-fidelity video data transmission. This IP core addresses the needs of modern aerospace systems that require robust video communication links both for military and commercial use. It supports a wide array of enhancements over previous generations, including increased bandwidth and improved signal integrity. This ensures that the ARINC 818-3 IP Core can handle the demands of next-generation avionic systems seamlessly, supporting advanced video processing and display systems. The core's design prioritizes modularity and scalability, allowing for easy integration and expansion to meet evolving system requirements. It is positioned as an essential tool for aviation applications demanding high reliability and accuracy in video data handling and display solutions, making it indispensable for new and retrofitted aerospace projects.

iWave Global
AMBA AHB / APB/ AXI, Coder/Decoder, Peripheral Controller
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USB PHY

The USB PHY designed by Silicon Library Inc. provides a robust physical interface for USB connectivity, supporting a wide range of devices with efficient data transmission. Its design ensures compatibility with the USB 2.0 standard, allowing for seamless integration into consumer electronics, computing devices, and more. This IP emphasizes speed and reliability, crucial for applications that require high data transfer rates. USB PHY from Silicon Library Inc. integrates easily with existing device architectures, minimizing the need for additional hardware when embedding it into new products. Its design allows for energy-efficient operation, reducing power consumption without compromising performance, which is increasingly important in today's eco-conscious market. In addition, the USB PHY offers excellent compatibility with various digital platforms, providing designers with flexibility and reliability in creating new and innovative products. When considering IP for high-speed data transfer, Silicon Library Inc.'s USB PHY stands as a dependable choice.

Silicon Library Inc.
AMBA AHB / APB/ AXI, USB
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Ultra-Low Latency 10G Ethernet MAC

The Ultra-Low Latency 10G Ethernet MAC from Chevin Technology is designed for FPGA applications that prioritize speed and efficiency. This IP core achieves exceptional data transfer rates with minimized latency, making it ideal for projects where time-sensitive communication is critical. Its design focuses on reducing the complexity and power consumption typical of high-speed Ethernet solutions. A key advantage of this ultra-low latency MAC is its ability to operate without the need for additional CPUs or software, thanks to its all-logic architecture. This not only simplifies integration but also reduces the overall footprint of the design, allowing more space for other functionalities within the FPGA. Targeting industries such as defense and data storage, this Ethernet MAC ensures high reliability and performance. It allows for seamless implementation into various FPGA platforms, demonstrating Chevin Technology's commitment to versatile and adaptable design solutions that meet specific industry needs.

Chevin Technology
All Foundries
All Process Nodes
AMBA AHB / APB/ AXI, Ethernet, PLL, Receiver/Transmitter, SAS, SATA, SDRAM Controller
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CANmodule-III

The CANmodule-III is a sophisticated full CAN controller designed to handle communication on the CAN bus with outstanding efficiency. Built upon Bosch's fundamental CAN architecture, this module is fully CAN 2.0B compliant, facilitating seamless communication transactions across the network. It is optimized for system-on-chip integrations, providing customizable options to cater to specific application requirements. The module stands out with its inherited functions which ensure uninterrupted main core operations, even when additional functionalities are layered around it. Having been deployed in various applications from aerospace to industrial control, the CANmodule-III's proven reliability makes it a preferred choice for developers seeking robust communication solutions in FPGA and ASIC technologies.

Inicore Inc.
AMBA AHB / APB/ AXI, CAN, CAN-FD, PCI, UWB
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Multi-Protocol SERDES

The Multi-Protocol SERDES offered by Pico Semiconductor is a versatile solution capable of handling a variety of communication protocols. This series of SERDES includes a 4-channel configuration that supports data rates up to 32Gbps, designed for integration with XAUI, RXAUI, and SGMII. It is compatible with multiple process nodes provided by foundries like TSMC and GF, offering robust performance across different semiconductor environments. These SERDES are crafted to meet high-performance metrics, capturing speeds up to 16Gbps and 6.5Gbps across various models, with advanced versions reaching up to 32Gbps. This exceptional range not only ensures compatibility with current technologies but also prepares systems for future updates, sustaining high data throughput. By delivering reliable high-speed data transmission capabilities, the Multi-Protocol SERDES from Pico Semiconductor is integral for networking, high-speed computing, and data storage applications, where efficient and speedy data transfer is paramount.

Pico Semiconductor, Inc.
GLOBALFOUNDRIES, TSMC
16nm, 45nm, 65nm
AMBA AHB / APB/ AXI, Interlaken, MIPI, Multi-Protocol PHY, PCI
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H.264 FPGA Encoder and CODEC Micro Footprint Cores

A2e's H.264 FPGA Encoder and CODEC Micro Footprint Cores provide a customizable solution targeting FPGAs. Known for its small size and rapid execution, the core supports 1080p60 H.264 Baseline with a singular core, making it one of the industry's swiftest and most efficient FPGA offerings. The core is compliant with ITAR, offering options to adjust pixel depths and resolutions according to specific needs. Its high-performance capability includes offering a latency of just 1ms at 1080p30, which is crucial for applications demanding rapid processing speeds. This licensable core is ideal for developers needing robust video compression capabilities in a compact form factor. The H.264 cores can be finely tuned to meet unique project specifications, enabling developers to implement varied pixel resolutions and depths, further enhancing the core's versatility for different application requirements. With a licensable evaluation option available, prospective users can explore the core’s functionalities before opting for full integration. This flexibility makes it suitable for projects demanding customizable compression solutions without the burden of full-scale initial commitment. Furthermore, A2e provides comprehensive integration and custom design services, allowing these cores to be seamlessly absorbed into existing systems or developed into new solutions. This support ensures minimized risk and accelerated project timelines, allowing developers to focus on innovation and efficiency in their video-centric applications.

A2e Technologies
AI Processor, AMBA AHB / APB/ AXI, Arbiter, Audio Controller, DVB, GPU, H.264, H.265, HDMI, Multiprocessor / DSP, Other, TICO, USB, Wireless Processor
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10G Ethernet MAC and PCS

The 10G Ethernet MAC and PCS from Chevin Technology offers a high-performance solution for FPGA-based applications requiring efficient data transfer. Designed to maximize link utilization, this IP core provides sustained high throughput with minimal latency, utilizing a compact architecture that saves space and power. The core is suitable for environments that demand reliable Ethernet connectivity, ensuring optimal performance in FPGA designs. This IP core is particularly beneficial for energy-conscious applications as it operates with lower power consumption compared to solutions requiring additional CPU or software components. The design is optimized for both Intel and AMD FPGAs, providing a versatile solution that is easy to integrate into existing projects. By providing robust data transfer capabilities, the 10G Ethernet MAC and PCS core supports cutting-edge applications in fields such as industrial imaging, data storage, and scientific research. Its design ensures that users can implement multiple cores within a single FPGA, offering flexibility and scalability for a range of Ethernet needs.

Chevin Technology
All Foundries
All Process Nodes
AMBA AHB / APB/ AXI, Ethernet, PLL, Receiver/Transmitter, SAS, SATA, SDRAM Controller
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Ethernet Real-Time Publish-Subscribe (RTPS) IP Core

The Ethernet Real-Time Publish-Subscribe (RTPS) IP Core is crafted to provide a comprehensive hardware implementation of the Ethernet RTPS protocol. This core is indispensable in real-time communication networks that require the seamless integration of data streams with minimal latency. It ensures low-latency operation and efficient data exchange, which are crucial for mission-critical applications. Designing systems capable of maintaining integrity and synchronous data dissemination is the primary goal of this IP core. It is optimally structured to ensure swift data processing, making it a key component in systems where real-time data publishing and subscription minimize response delays. The RTPS IP Core stands out as a strategic solution for real-time networking in communication-intensive industries.

New Wave Design
AMBA AHB / APB/ AXI, Ethernet, Input/Output Controller, PCI
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High-Speed SerDes for Chiplets

EXTOLL's High-Speed SerDes for Chiplets is a pioneering connectivity solution crafted for seamless integration in chiplet-based systems. It serves as a core technology in facilitating swift data transfer across different chiplets, ensuring robust and efficient performance. This SerDes excels in maintaining low power consumption to optimize energy efficiency, crucial for modern computing needs. By leveraging innovative design principles, this SerDes supports mainstream technology nodes ranging from 12nm to 28nm. The flexibility provided by such support makes it a versatile choice for various high-speed data applications, ensuring adaptability to future technological advances. This capability underscores its role in facilitating heterogeneous integration, a crucial aspect in cutting-edge semiconductor environments. Furthermore, the High-Speed SerDes is crafted to cater to applications requiring reduced latency and enhanced bandwidth capabilities. Ideal for systems such as data centers and communications infrastructure, it empowers device manufacturers to implement scalable and sustainable solutions efficiently.

EXTOLL GmbH
GLOBALFOUNDRIES
22nm, 28nm, 28nm SLP
AMBA AHB / APB/ AXI, D2D, Ethernet, MIL-STD-1553, Network on Chip, Optical/Telecom, PCI
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10G TCP Offload Engine + MAC + PCIe + Host IF Ultra-Low Latency

The 10G TCP Offload Engine is a sophisticated high-performance solution designed to offload TCP processing from the host CPU. Utilizing ultra-low latency technology, this IP incorporates a TCP/UDP stack integrated into high-speed FPGA hardware, ideal for networking environments demanding efficient processing and high throughput. Designed to handle up to 16,000 concurrent sessions, it manages TCP stacks within an impressive 77 nanoseconds, offering unmatched performance without straining the CPU. The engine supports 10 Gigabit Ethernet connectivity, ensuring seamless network integration and optimal data flow. With features like full TCP stack implementation and zero host CPU processing requirement, the offload engine is perfect for real-time cloud computing and AI networking applications, significantly reducing power consumption and enhancing bandwidth utilization. Equipped with a range of additional functions, such as large send offload and checksum offload, it optimizes network operations by eliminating bottlenecks typically associated with software-based solutions. It's an excellent choice for data centers and enterprise environments struggling with CPU bottlenecks.

Intilop Corporation
AMBA AHB / APB/ AXI, Error Correction/Detection, Ethernet, Interlaken, MIPI, PCI, Receiver/Transmitter, SAS, SATA, USB, V-by-One
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DisplayPort 1.4

The DisplayPort 1.4 core provides a comprehensive solution for DisplayPort requirements, implementing both source and sink capabilities. It supports link rates ranging from 1.62 Gbps to 8.1 Gbps, fitting standard DisplayPort and eDP scenarios efficiently. Users can take advantage of its support for multiple lanes, specifically 1, 2, and 4 lanes configurations, enabling versatile video interface options such as Native and AXI stream interfaces. This facilitates a strong multimedia performance, catering to both Single Stream Transport (SST) and Multi Stream Transport (MST) modes. The video processing toolkit accompanying this IP aims at aiding users in diverse video operations. These tools include a timing generator, a versatile test pattern generator, and crucial video clock recovery mechanisms. To simplify the integration into various systems, the IP is supported across a broad range of FPGA devices, including AMD and Intel lines, providing users with choice and flexibility for their specific application needs. Notably, it supports diverse video formats and color spaces, such as RGB, YCbCr 4:4:4, 4:2:2, and 4:2:0 at pixel depths of 8 and 10 bits. Secondary data packets handling audio and metadata enhance its multimedia capabilities. Furthermore, Parretto offers the source code on GitHub for ease of custom development, ensuring developers have the tools they need to adapt the IP to their unique systems.

Parretto B.V.
2D / 3D, AMBA AHB / APB/ AXI, Audio Interfaces, Cell / Packet, Ethernet, HDMI, Image Conversion, LCD Controller, MIL-STD-1553, MIPI, MPEG 4, Receiver/Transmitter, SATA, USB, V-by-One, VGA
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