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KL730 AI SoC

The KL730 is a third-generation AI chip that integrates advanced reconfigurable NPU architecture, delivering up to 8 TOPS of computing power. This cutting-edge technology enhances computational efficiency across a range of applications, including CNN and transformer networks, while minimizing DDR bandwidth requirements. The KL730 also boasts enhanced video processing capabilities, supporting 4K 60FPS outputs. With expertise spanning over a decade in ISP technology, the KL730 stands out with its noise reduction, wide dynamic range, fisheye correction, and low-light imaging performance. It caters to markets like intelligent security, autonomous vehicles, video conferencing, and industrial camera systems, among others.

Kneron
TSMC
12nm
16 Categories
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Metis AIPU PCIe AI Accelerator Card

The Metis AIPU PCIe AI Accelerator Card is engineered for developers demanding superior AI performance. With its quad-core Metis AIPU, this card delivers up to 214 TOPS, tackling challenging vision applications with unmatched efficiency. The PCIe card is designed with user-friendly integration in mind, featuring the Voyager SDK software stack that accelerates application deployment. Offering impressive processing speeds, the card supports up to 3,200 FPS for ResNet-50 models, providing a competitive edge for demanding AI tasks. Its design ensures it meets the needs of a wide array of AI applications, allowing for scalability and adaptability in various use cases.

Axelera AI
2D / 3D, AI Processor, AMBA AHB / APB/ AXI, Building Blocks, CPU, Ethernet, Multiprocessor / DSP, Processor Core Dependent, Processor Core Independent, Processor Cores, Vision Processor, WMV
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C-PHY

The Mixel MIPI C-PHY IP (MXL-CPHY) is a high-frequency, low-power, low cost, physical layer. (Learn more about Mixel’s MIPI ecosystem at Mixel MIPI Central which gives you access to Mixel’s best of class MIPI ecosystem supply chain partners.) The C-PHY configuration consists of up to three lane modules and is based on 3-Phase symbol encoding technology, delivering 2.28 bits per symbol over three-wire trios and targeting a maximum rate of 2.5 Gsps, 5.7Gbps. The C-PHY is partitioned into a digital module – CIL (Control and Interface Logic) and a mixed-signal module. The PHY IP is provided as a combination of soft IP views (RTL, and STA Constraints) for the digital module, and hard IP views (GDSII/CDL/LEF/LIB) for the mixed-signal module. This unique offering of both soft and hard IP permits architectural design flexibility and seamless implementation in customer-specific design flow. The CIL module interfaces with the protocol layer and determines the global operation of the module. The interface between the PHY and the protocol is using the PHY-Protocol Interface (PPI). The mixed-signal module includes high-speed signaling mode for fast-data traffic and low-power signaling mode for control purposes. During normal operation, a lane switches between low-power and high-speed mode. Bidirectional lanes can also switch communication direction. The change of operating mode or direction requires enabling and disabling of certain electrical functions. These enable and disable events do not cause glitches on the lines that would result in a detection of incorrect signal levels. All mode and direction changes are smooth to always ensure a proper detection of the line signals. Mixel’s C-PHY is a complete PHY, silicon-proven at multiple foundries and multiple nodes. It is built to support the MIPI Camera Serial Interface (CSI) and Display Serial Interface (DSI).

Mixel Inc
All Foundries
All Process Nodes
Analog Front Ends, MIPI
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3DNR Noise Reduction

Overview: CMOS Image Sensors (CIS) often suffer from base noise, such as Additive White Gaussian Noise (AWGN), which deteriorates image quality in low-light environments. Traditional noise reduction methods include mask filters for still images and temporal noise data accumulation for video streams. However, these methods can lead to ghosting artifacts in sequential images due to inconsistent signal processing. To address this, this IP offers advanced noise reduction techniques and features a specific Anti-ghost Block to minimize ghosting effects. Specifications:  Maximum Resolution o Image : 13MP o Video : 13MP@30fps  -Input formats : YUV422–8 bits  -Output formats o DVP : YUV422-8 bits o AXI : YUV420, YUV422  -8 bits-Interface o ARM® AMBA APB BUS interface for ISP system control o ARM® AMBA AXI interface for data o Direct connection to sensor stream data (DVP) Features:  Base Noise Correction: AWGN reduction for improved image quality  Mask Filter: Convolution-based noise reduction for still images  Temporal Noise Data Accumulation: Gaussian Distribution-based noise reduction for video streams using 2 frames of images  3D Noise Reduction (3DNR): Sequential image noise reduction with Anti-ghost Block  Motion Estimation and Adaptive: Suppresses ghosting artifacts during noise reduction  Real-Time Processing: Supports Digital Video Port (DVP) and AXI interfaces for seamless integration  Anti-Ghost  Real time De-noising output

Plurko Technologies
All Foundries
All Process Nodes
2D / 3D
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TSMC 3nm ESD Rail clamp

0.75V ESD power protection. The ESD clamp is designed to provide protection for 0.75 V Analog and Core domain using 0.75V FinFet transistors in TSMC N3E process. The target ESD robustness can be selected.

Sofics
TSMC
3nm
Other
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UCIe-S 1.1/PCIe Gen6 Controller

Overview: The UCIe IP supports multiple protocols (CXL/PCIe/Streaming) to connect chiplets, reducing overall development cycles for IPs and SOCs. With flexible application and PHY interfaces, The UCIe IP is ideal for SOCs and chiplets. Key Features:  Supports UCIe 1.0 Specification  Supports CXL 2.0 and CXL 3.0 Specifications  Supports PCIe Gen6 Specification  Supports PCIe Gen5 and older versions of PCIe specifications  Supports single and two-stack modules  Supports CXL 2.0 68Byte flit mode with Fallback mode for PCIe non-flit mode transfers  Supports CXL 3.0 256Byte flit mode  Supports PCIe Gen6 flit mode  Configurable up to 64-lane configuration for Advanced UCIe modules and 16 lanes for Standard UCIe modules  Supports sideband and Mainband signals  Supports Lane repair handling  Data to clock point training and eye width sweep support from transmitter and receiver ends  UCIe controller can work as Downstream or Upstream  Main Band Lane reversal supported  Dynamic sense of normal and redundant clock and data lines activation  UCIe enumeration through DVSEC  Error logging and reporting supported  Error injection supported through Register programming  RDI/FDI PM entry, Exit, Abort flows supported  Dynamic clock gang at adapter supported Configurable Options:  Maximum link width (x1, x2, x4, x8, x16)  MPS (128B to 4KB)  MRRS (128B to 4KB)  Transmit retry/Receive buffer size  Number of Virtual Channels  L1 PM substate support  Optional Capability Features can be Configured  Number of PF/VFDMA configurable Options  AXI MAX payload size Variations  Multiple CPI Interfaces (Configurable)  Cache/memory configurable  Type 0/1/2 device configurable

Plurko Technologies
All Foundries
All Process Nodes
Peripheral Controller
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1G to 224G SerDes

The 1G to 224G SerDes is a versatile serializer/deserializer technology designed to facilitate high-speed data transfers across various interface standards. It caters to stringent speed requirements by supporting a wide range of data rates and signaling schemes, allowing efficient integration into comprehensive communication systems. This SerDes technology excels in delivering reliable, low-latency connections, making it ideal for hyperscale data centers, AI, and 5G networking where fast, efficient data processing is essential. The broad compatibility with numerous industry protocols also ensures seamless interoperability with existing systems. Adapted for scalability, the 1G to 224G SerDes provides design flexibility, encouraging implementation across a variety of demanding environments. Its sophisticated architecture promotes energy efficiency and robust performance, crucial for addressing the ever-growing connectivity demands of modern technology infrastructures.

Alphawave Semi
GLOBALFOUNDRIES, UMC
7nm, 14nm
AMBA AHB / APB/ AXI, DSP Core, Ethernet, PCI, USB, Wireless Processor
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WAVE-N

Focused on image quality enhancement, WAVE-N is a specialized neural processing unit developed by Chips&Media. It employs advanced algorithms to deliver superior resolutions, transitioning from 2K to 4K at 60fps, while also offering effective noise reduction at similar frame rates. WAVE-N is particularly tailored for CNN-based image processing applications, featuring a fully programmable core that utilizes Chips&Media's proprietary ISA. Notably, WAVE-N's design emphasizes efficiency by minimizing bandwidth consumption, boasting over 50% MAC utilization in intensive computing tasks. This NPU excels in applications requiring high detail visual output, such as automotive displays and high-definition broadcasting.

Premium Vendor
Chips&Media, Inc.
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C/D-PHY Combo

The Mixel MIPI C/D-PHY combo IP (MXL-CPHY-DPHY) is a high-frequency low-power, low cost, physical layer compliant with the MIPI® Alliance Standard for C-PHY and D-PHY. (Learn more about Mixel’s MIPI ecosystem at Mixel MIPI Central which gives you access to Mixel’s best of class MIPI ecosystem supply chain partners.) The PHY can be configured as a MIPI Master or MIPI Slave, supporting camera interface CSI-2 v1.2 or display interface DSI v1.3 applications in the D-PHY mode. It also supports camera interface CSI-2 v1.3 and display interface DSI-2 v1.0 applications in the C-PHY mode. The high-speed signals have a low voltage swing, while low-power signals have large swing. High-Speed functions are used for high-speed data traffic while low-power functions are mostly used for control. The C-PHY is based on 3-Phase symbol encoding technology, delivering 2.28 bits per symbol over three-wire trios, operating with a symbol rate range of 80 to 4500 Msps per lane, which is the equivalent of about 182.8 to 10260 Mbps per lane. The D-PHY supports a bit rate range of 80 to 1500 Mbps per Lane without deskew calibration, and up to 4500 Mbps with deskew calibration. The low-power mode and escape mode are the same in both the D-PHY and C-PHY modes. To minimize EMI, the drivers for low-power mode are slew-rate controlled and current limited. The data rate in low-power mode is 10 Mbps. For a fixed clock frequency, the available data capacity of a PHY configuration can be increased by using more lanes. Effective data throughput can be reduced by employing burst mode communication. Mixel’s C-PHY/D-PHY combo is a complete PHY, silicon-proven at multiple foundries and multiple nodes. The C/D-PHY is fully integrated and has analog circuitry, digital, and synthesizable logic.

Mixel Inc
All Foundries
All Process Nodes
Analog Front Ends, MIPI
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Ceva-Waves Links - Turnkey Multi-protocol Wireless IP Platforms

**Ceva-Waves Links** is a growing family of multi-standard wireless platforms. By optimizing connectivity support for various combinations of **Wi-Fi, Bluetooth, 802.15.4, and ultra-wideband (UWB)**, the Ceva-Waves Links family provides preconfigured, optimized solutions for SoCs requiring multiple connectivity standards. All Ceva-Waves Links configurations are based on field-proven Ceva-Waves hardware IP and software stacks. Unique Ceva coexistence algorithms ensure efficient and interference-free operation of multiple connections while sharing one radio. The **Ceva-Waves Links family** offers combinations of Ceva-Waves Wi-Fi, Ceva-Waves Bluetooth, 802.15.4 (supporting protocols such as Thread, Matter and Zigbee), and Ceva-Waves UWB hardware IP, integrated with Ceva or third-party radios and CPU- and OS-agnostic software stacks. New platforms will be introduced to address market trends or customers’ demands. [**Learn more about Ceva-Waves Links family solution>**](https://www.ceva-ip.com/product/ceva-waves-links/?utm_source=silicon_hub&utm_medium=ip_listing&utm_campaign=ceva_waves_links_page)

Ceva, Inc.
802.11, Bluetooth, UWB
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Ceva-XC21 - High-efficiency vector DSP cores for 5G and 5G-Advanced

**Ceva-XC21** is the most efficient vector DSP core available today for communications applications. The Ceva-XC21 DSP is designed for low-power, cost- and size-optimized cellular IoT modems, NTN VSAT terminals, eMBB and uRLLC applications. Ceva-XC21 offers scalable architecture and dual thread design with support for AI, addressing growing demand for smarter, yet more cost and power efficient cellular devices. Targeted for 5G and 5G-Advanced workloads, the Ceva-XC21 has multiple products configurations enabling system designers to optimize the size and cost to their specific application needs. The Ceva-XC21, based on the advanced Ceva-XC20 architecture, features a product line of 3 vector DSP cores. Each of the cores offers a unique performance & area configuration with a SW compatibility between them. The different cores span across single thread or dual thread configurations, and 32 or 64 16bits x 16bits MACs. The Ceva-XC212, the highest performing variant of the Ceva-XC21 delivers up to 1.8x times the performance of Ceva’s previous-generation Ceva-XC4500 architecture, while reducing the core area. Ceva-XC210, the smallest configuration of the Ceva-XC21, enables system designers to reduce the core die size in 48% compared with the previous generation. Ceva-XC211 offers the same performance envelope compared with the previous generation at 63% of the area. [**Learn more about Ceva-XC21>**](https://www.ceva-ip.com/product/ceva-xc21/?utm_source=silicon_hub&utm_medium=ip_listing&utm_campaign=ceva_xc21_page)

Ceva, Inc.
3GPP-5G
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GL3590-S

The GL3590-S is a USB 3.2 Gen 2 Hub Controller designed to provide seamless connectivity via integrated USB Type-C® support. This controller is capable of managing multiple upstream ports, making it ideal for complex data management tasks in modern electronics. Its sophisticated architecture allows for high-speed data transfer, ensuring efficiency in demanding computational environments. Integrated with USB 3.2 Gen 2 hub capabilities, the GL3590-S supports rapid data exchange rates essential for applications needing swift resolution and connectivity. The device plays a crucial role in amplifying the USB connection bandwidth, thereby enhancing the performance and reliability of connected devices. Moreover, this hub controller is equipped with advanced compatibility features, supporting various data transfer protocols. It aims to streamline the integration process across computing platforms, providing a robust solution for today's data-driven ecosystems.

Genesys Logic, Inc.
SDIO Controller, USB, V-by-One
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Primesoc's PCIE Gen7

Primesoc's PCIE GEn7 IP is dual mode controller , supporting upto 128Gbps per lane data rate , which can work as root complex or as an endpoint. This is a soft IP which can support serdes and non serdes architectures and PIPE interface of 64bit and lanes configurable from 1/2/4/8/16.

Primesoc Technologies
All Foundries
5nm
PCI
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Ceva-Waves Bluetooth Connectivity Platforms

The **Ceva-Waves Bluetooth platform** includes field-proven hardware IP for baseband controller, modem, and 2.4 GHz RF transceiver functions, and allows use of many third-party radio IPs as well. The platform includes optimized baseband controller hardware and software, and above the Host Controller Interface (HCI) a host-agnostic software protocol stack supporting all major Bluetooth profiles. The built-in 802.15.4 add-on suite shares the same Bluetooth radio, and includes IEEE 802.15.4 MAC & modem hardware IP and software, and is compatible with Zigbee, Thread and Matter host protocol stacks. The Ceva-Waves Bluetooth platform is also available as part of the **Ceva-Waves Links family** of multi-protocol turnkey platforms, including with optimized Wi-Fi & Bluetooth co-existence interface and packet traffic arbiter. The Ceva-Waves Bluetooth platforms also comprises a state-of-the-art radio in TSMC 12nm FFC+ supporting all the latest Bluetooth 6.0 dual mode features, along with next gen Bluetooth High Data Throughput and IEEE 802.15.4. Its innovative architecture provides best in class performance in term of power consumption, die size, sensitivity and output power. [**Learn more about Ceva's Bluetooth solution>**](https://www.ceva-ip.com/product/ceva-waves-bluetooth/?utm_source=silicon_hub&utm_medium=ip_listing&utm_campaign=ceva_waves_bluetooth_page)

Ceva, Inc.
Bluetooth
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LVDS IP

The LVDS IP offered by Sunplus Technology is tailored for power-efficient, high-speed data transmission in a variety of digital systems. As a low voltage differential signaling solution, it is suitable for use in applications that require reliable, high-frequency data transfer with minimized electromagnetic interference. This LVDS solution provides robust communication interfaces commonly used in display and communication technologies, enabling seamless data transmission with minimal signal distortion. The LVDS IP is designed to be energy-efficient, allowing for extended operation in battery-powered devices without sacrificing performance. Sunplus' LVDS IP excels in applications that demand low power consumption combined with high data throughput, such as portable electronics, automotive systems, and network devices. It integrates easily into existing hardware designs, thereby streamlining the development process and ensuring that products reach the market faster.

Sunplus Technology Co., Ltd.
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Coherent Network-on-Chip (NOC)

The Coherent Network-on-Chip by SkyeChip is an efficient interconnect solution built for memory coherent systems. It ensures reduced routing congestion through sophisticated architectural design, providing scalability for many-core systems. This NOC supports ACE4, ACE5, and CHI protocols, and can integrate seamlessly with proprietary coherency handlers. It operates effectively at frequencies up to 2GHz and can be combined with the Non-Coherent NOC to support partitioned interconnect systems, maximizing integration while maintaining high performance.

SkyeChip
Network on Chip
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Akida IP

The Akida IP is a state-of-the-art neural processor that harnesses the power of brain-inspired computing principles. Engineered for ultra-low power consumption, it excels in real-time AI processing at the edge. The Akida architecture is characterized by its innovative use of sparsity, allowing it to focus computational resources on the most pertinent data while minimizing energy usage. This IP supports a variety of AI workloads, efficiently running both convolutional and fully-connected neural network layers. One of Akida's standout features is its on-chip learning capability. This functionality empowers devices to adapt and learn from new data with minimal need for cloud connectivity, enhancing both privacy and latency. Additionally, the Akida IP is highly configurable, offering extensive post-silicon flexibility, which ensures its adaptability across numerous applications such as vision processing, audio analysis, and sensor fusion. The platform's scalability is another notable advantage, allowing configurations from single to multiple neural nodes. This flexibility makes it a suitable choice for a wide range of AI applications, from small-scale consumer devices to larger industrial implementations. The successful integration of Akida IP in various products highlights its potential to revolutionize AI at the edge.

BrainChip
AI Processor, Audio Processor, Coprocessor, CPU, Cryptography Cores, GPU, Input/Output Controller, IoT Processor, Platform Security, Processor Core Independent, Vision Processor
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ADAS and Autonomous Driving

KPIT Technologies specializes in advancing autonomous driving technologies aimed at accomplishing higher levels of vehicle autonomy. This includes addressing significant industry challenges such as safety assurance, local infrastructure alignment, and comprehensive system integration. KPIT's proactive approach aims to ensure that autonomous vehicles not only meet but exceed current safety and reliability standards through rigorous testing and smart AI applications. Their focus on autonomous driving includes developing capabilities that enable Level 3 autonomy and beyond, where consumer safety takes precedence through robust features and thoroughly validated systems. The technologies they develop are geared towards understanding corner case scenarios, utilizing AI to improve beyond perception and ensuring comprehensive regulatory compliance. KPIT’s innovation extends to overcoming infrastructure and validation challenges by strategically integrating advanced technologies with a vision to deliver fully autonomous solutions. This encompasses building flexible and agile platforms that support rapid development and deployment to bring these advanced driving systems to market efficiently.

KPIT Technologies
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TRNG/AES/DES/3DES/HASH/SHA/RSA

Overview: Cybersecurity IPs offer a range of essential security features to protect your digital assets and sensitive information. From True Random Number Generators (TRNG) to advanced encryption algorithms like AES, DES, 3DES, and cryptographic hash functions like SHA, as well as RSA for secure key exchange and digital signatures, the IPs provide a comprehensive suite of tools to safeguard your data. Key Features:  True Random Number Generator (TRNG): Generates unpredictable and unbiased random numbers for cryptographic applications.  Advanced Encryption Standard (AES): Provides robust encryption with symmetric key algorithms for securing data.  Data Encryption Standard (DES) and Triple DES (3DES): Implement legacy encryption algorithms for data protection.  Hash Functions: Includes secure cryptographic hash functions like SHA (Secure Hash Algorithm) for data integrity verification.  RSA: Enables secure key exchange, encryption, and digital signatures for secure communication. These cybersecurity IPs are designed to meet the stringent security requirements of modern applications, ensuring the confidentiality, integrity, and authenticity of your data.

Plurko Technologies
All Foundries
All Process Nodes
Cryptography Cores
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DeWraping/De-Distortion

Overview: Lens distortion is a common issue in cameras, especially with wide-angle or fisheye lenses, causing straight lines to appear curved. Radial distortion, where the image is expanded or reduced radially from the center, is the most prominent type. Failure to correct distortion can lead to issues in digital image analysis. The solution involves mathematically modeling and correcting distortion by estimating parameters that determine the degree of distortion and applying inverse transformations. Automotive systems often require additional image processing features, such as de-warping, for front/rear view cameras. The Lens Distortion Correction H/W IP comprises 3 blocks for coordinate generation, data caching, and interpolation, providing de-warping capabilities for accurate image correction. Specifications:  Maximum Resolution: o Image: 8MP (3840x2160) o Video: 8MP @ 60fps  Input Formats: YUV422 - 8 bits  Output Formats: o AXI: YUV420, YUV422, RGB888 - 8 bits  Interface: o ARM® AMBA APB BUS interface for system control o ARM® AMBA AXI interface for data Features:  Programmable Window Size and Position  Barrel Distortion Correction Support  Wide Angle Correction up to 192°  De-warping Modes: o Zoom o Tilt o Pan o Rotate o Side-view  Programmable Parameters: o Zoom Factor: controls Distance from the Image Plane to the Camera (Sensor)

Plurko Technologies
All Foundries
All Process Nodes
Camera Interface
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Universal Chiplet Interconnect Express (UCIe)

Universal Chiplet Interconnect Express, or UCIe, is a forward-looking interconnect technology that enables high-speed data exchanges between various chiplets. Developed to support a modular approach in chip design, UCIe enhances flexibility and scalability, allowing manufacturers to tailor systems to specific needs by integrating multiple functions into a single package. The architecture of UCIe facilitates seamless data communication, crucial in achieving high-performance levels in integrated circuits. It is designed to support multiple configurations and implementations, ensuring compatibility across different designs and maximizing interoperability. UCIe is pivotal in advancing the chiplet strategy, which is becoming increasingly important as devices require more complex and diverse functionalities. By enabling efficient and quick interchip communication, UCIe supports innovation in the semiconductor field, paving the way for the development of highly efficient and sophisticated systems.

EXTOLL GmbH
GLOBALFOUNDRIES, Samsung, TSMC, UMC
22nm, 28nm
AMBA AHB / APB/ AXI, D2D, Gen-Z, Multiprocessor / DSP, Network on Chip, Processor Core Independent, USB, V-by-One, VESA
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Ceva-Waves UWB - Low Power Ultra-wideband (UWB) IP

**Ceva-Waves UWB platform** cuts the development time and risk for implementing a wide range of UWB functionality in SoCs. It provides optimized MAC and PHY hardware IP and supporting software for secure and accurate ranging, and Doppler Radar presence detection applications. It can be implemented in an SoC independently or in conjunction with the Ceva-Waves Bluetooth platform, as well as part of the Ceva-Waves Links family of multiprotocol platforms. The Ceva-Waves UWB platform includes hardware IP for an optimized UWB MAC and PHY meeting 802.15.4 HRP, FiRa 3.0, and the Car Connectivity Consortium Digital Key 3.0 (CCC DK3.0) requirements. The platform includes advanced Wi-Fi interference suppression. A comprehensive suite of CPU-agnostic software stacks that support FiRa 3.0 MAC, CCC DK3.0 MAC, and radar for implementing applications such as automotive digital keys and in-cabin child-presence detection (CPD), general power-saving presence detection in laptops, TVs and smart buildings, asset tracking tags, real-time location services (RTLS), and tap-free payment. [**Learn more about our UWB soluion>**](https://www.ceva-ip.com/product/ceva-waves-uwb/?utm_source=silicon_hub&utm_medium=ip_listing&utm_campaign=ceva_waves_uwb_page)

Ceva, Inc.
UWB
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ntLDPC_WiFi6 IEEE 802.11 n/ac/ax compliant LDPC Codec

The Low Density Parity Check (LDPC) codes are powerful, capacity approaching channel codes and have exceptional error correction capabilities. The high degree of parallelism that they offer enables efficient, high throughput hardware architectures. The ntLDPC_WiFi6 IP Core is based on an implementation of QC-LDPC Quasi-Cyclic LDPC Codes and is fully compliant with IEEE 802.11 n/ac/ax standard. The Quasi-Cyclic LDPC codes are based on block-structured LDPC codes with circular block matrices. The entire parity check matrix can be partitioned into an array of block matrices; each block matrix is either a zero matrix or a right cyclic shift of an identity matrix. The parity check matrix designed in this way can be conveniently represented by a base matrix represented by cyclic shifts. The main advantage of this feature is that they offer high throughput at low implementation complexity. The ntLDPC_WiFi6 decoder IP Core may optionally implement one of two approximations of the log-domain LDPC iterative decoding algorithm (Belief propagation) known as either Layered Normalized Offset Min-Sum Algorithm or Layered Lambda-min Algorithm. Selecting between the two algorithms presents a decoding performance .vs. system resources utilization trade-off. The core is highly reconfigurable and fully compliant to the IEEE 802.11 n/ac/ax Wi-Fi4, Wi-Fi5 and Wi-Fi 6 standards. The ntLDPC_WiFi6 encoder IP implements a 81-bit parallel systematic LDPC encoder. An off-line profiling Matlab script processes the original matrices and produces a set of constants that are associated with the matrix and hardcoded in the RTL encoder.

Noesis Technologies P.C.
All Foundries
All Process Nodes
802.11, Error Correction/Detection
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DDR5 RCD (Registering Clock Driver) Controller

Overview: The DDR5 RCD Controller is a registering clock driver utilized in DDR5 RDIMMs and LRDIMMs. It buffers the Command/Address (CA) bus, chip selects, and clock signals between the host controller and DRAMs. Additionally, it establishes a BCOM bus to control data buffers in LRDIMMs. Key Features:  Compliance with JEDEC's JESD82-511  Maximum SCL Operating speed of 12.5MHz in I3C mode  DDR5 server speeds up to 4800MT/s  Dual-channel configuration with 32-bit data width per channel  Support for power-saving mechanisms  Rank 0 & rank 1 DIMM configurations  Loopback and pass-through modes  BCOM sideband bus for LRDIMM data buffer control  In-band Interrupt support  Packet Error Check (PEC)  CCC Packet Error Handling  Error log register  Parity Error Handling  Interrupt Arbitration  I2C Fast-mode Plus (FM+) and I3C Basic compatibility  Switch between I2C mode and I3C Basic  Clearing of Status Registers  Compliance with JESD82-511 specification  I3C Basic Common Command Codes (CCC) Applications:  RDIMM  LRDIMM  AI (Artificial Intelligence)  HPC (High-Performance Computing)  Data-intensive applications

Plurko Technologies
All Foundries
All Process Nodes
DDR
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Yitian 710 Processor

The Yitian 710 Processor represents T-Head Semiconductor's debut in Arm server chip development. It integrates cutting-edge architecture to deliver exceptional computing performance and efficiency. Designed for high-demand environments, this processor uses advanced Armv9 instruction set architecture, allowing for increased compatibility and robust performance metrics. With a design that maximizes throughput while minimizing power consumption, Yitian 710 is well-suited for cloud services and data-driven applications. The processor is engineered with a 2.5D packaging design, which enables enhanced performance through a dual-die structure. Its architecture includes 128 high-performance Armv9 CPU cores, each featuring a substantial cache and memory management capabilities, fostering smooth and efficient processing of large data volumes. This setup ensures high-speed data access and transfer, making it ideal for modern computational demands. The Yitian 710 Processor's I/O subsystem supports PCIe 5.0, providing substantial bandwidth to accommodate heavy data loads and improve interface interaction. This expansion capability makes the T-Head Yitian 710 Processor a versatile and scalable solution, designed to address the requirements of AI, big data analytics, and enterprise-level computing. Its power efficiency and support for high-frequency operations guarantee optimal performance in energy-conscious and high-load environments.

T-Head Semiconductor
AI Processor, AMBA AHB / APB/ AXI, Audio Processor, CPU, IoT Processor, Microcontroller, Multiprocessor / DSP, Processor Core Independent, Processor Cores, Vision Processor
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AI Camera Module

The AI Camera Module from Altek is a versatile, high-performance component designed to meet the increasing demand for smart vision solutions. This module features a rich integration of imaging lens design and combines both hardware and software capacities to create a seamless operational experience. Its design is reinforced by Altek's deep collaboration with leading global brands, ensuring a top-tier product capable of handling diverse market requirements. Equipped to cater to AI and IoT interplays, the module delivers outstanding capabilities that align with the expectations for high-resolution imaging, making it suitable for edge computing applications. The AI Camera Module ensures that end-user diversity is meaningfully addressed, offering customization in device functionality which supports advanced processing requirements such as 2K and 4K video quality. This module showcases Altek's prowess in providing comprehensive, all-in-one camera solutions which leverage sophisticated imaging and rapid processing to handle challenging conditions and demands. The AI Camera's technical blueprint supports complex AI algorithms, enhancing not just image quality but also the device's interactive capacity through facial recognition and image tracking technology.

Altek Corporation
Samsung
22nm
2D / 3D, AI Processor, AMBA AHB / APB/ AXI, Audio Interfaces, GPU, Image Conversion, IoT Processor, JPEG, Receiver/Transmitter, SATA, Vision Processor
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Camera ISP

Overview: The Camera ISP IP is an Image Signal Processing (ISP) IP developed for low-light environments in surveillance and automotive applications, supporting a maximum processing resolution of 13 Mega or 8Mega Pixels (MP) at 60 frames per second (FPS). It offers a configurable ISP pipeline with features such as 18x18 2D/8x6 2D Color Shading Correction, 19-Point Bayer Gamma Correction, Region Color Saturation, Hue, and Delta L Control functions. The ISP IP enhances image quality with optimal low-light Noise/Sharp filters and offers benefits such as low gate size and memory usage through algorithm optimization. The IP is also ARM® AMBA 3 AXI protocol compliant for easy control via an AMBA 3 APB bus interface. Specifications:  Maximum Resolution: o Image: 13MP/8MP o Video: 13MP @ 60fps / 8MP @ 60fps  Input Formats: Bayer-8, 10, 12, 14 bits  Output Formats: o DVP: YUV422, YUV444, RGB888 - 8, 10, 12 bits o AXI: YUV422, YUV444, YUV420, RGB888 - 8, 10, 12 bits  Interface: o ARM® AMBA APB BUS interface for ISP system control o ARM® AMBA AXI interface for data o Direct connection to sensor stream data (DVP) o Features:  Defective Pixel Correction: On-The-Fly Defective Pixel Correction  14-Bit Bayer Channel Gain Support: Up to x4 / x7.99 with Linear Algebra for Input Pixel Level Adjustment  Gb/Gr Unbalance Correction: Maximum Correction Tolerance Gb/Gr Rate of 12.5%  2D Lens-Shading Correction: Supports 18x18 / 8x6 with Normal R/Gb/Gr/B Channel Shading Correction and Color Stain Correction  High-Resolution RGB Interpolation: Utilizes ES/Hue-Med/Average/Non-Directional Based Hybrid Type Algorithm  Color Correction Matrix: 3x3 Matrix  Bayer Gamma Correction: 19 points  RGB Gamma Correction: 19 points  Color Enhancement: Hue/Sat/∆-L Control for R/G/B/C/M/Y Channels  High-Performance Noise Reduction: For Bayer/RGB/YC Domain Noise Reduction  High-Resolution Sharpness Control: Multi-Sharp Filter with Individual Sharp Gain Control  Auto Exposure: Utilizes 16x16 Luminance Weight Window & Pixel Weighting  Auto White Balance: Based on R/G/B Feed-Forward Method  Auto Focus: 2-Type 6-Region AF Value Return

Plurko Technologies
All Foundries
All Process Nodes
JPEG
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Speedcore Embedded FPGA IP

Speedcore embedded FPGA (eFPGA) IP represents a notable advancement in integrating programmable logic into ASICs and SoCs. Unlike standalone FPGAs, eFPGA IP lets designers tailor the exact dimensions of logic, DSP, and memory needed for their applications, making it an ideal choice for areas like AI, ML, 5G wireless, and more. Speedcore eFPGA can significantly reduce system costs, power requirements, and board space while maintaining flexibility by embedding only the necessary features into production. This IP is programmable using the same Achronix Tool Suite employed for standalone FPGAs. The Speedcore design process is supported by comprehensive resources and guidance, ensuring efficient integration into various semiconductor projects.

Achronix
TSMC
All Process Nodes
Processor Cores
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SerDes Interfaces

Silicon Creations' SerDes Interfaces are crafted to handle high-speed data transmission challenges over varied processes, ranging from 12nm to 180nm. Addressing multiple protocols such as CPRI, PCIe, and SATA, these interfaces demonstrate flexibility by supporting data transmission speeds from 100 Mbps to beyond 32 Gbps. The architecture incorporates a host of advanced features including adaptive equalization techniques and programmable de-serialization widths, making it stand out in terms of performance and signal integrity even under challenging conditions. With ultra-low latency PMAs, they sustain excellent operational speed and efficiency, imperative for sophisticated communication applications. Moreover, Silicon Creations partners with leading entities to provide comprehensive solutions, including complete PCIe PHY integrations. This synergy ensures that SerDes Interfaces are fully optimized for operational excellence, delivering stable and reliable communication signals. With an emphasis on low power and minimized area requirements, they cater to burgeoning industry needs for power-efficient and space-conservative designs.

Premium Vendor
Silicon Creations
TSMC
16nm, 180nm
AMBA AHB / APB/ AXI, MIPI, Multi-Protocol PHY, PCI, SATA, USB
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Aries fgOTN Processors

The Aries fgOTN processor family is engineered according to the ITU-T G.709.20 fgOTN standard. This line of processors handles a variety of signals, including E1/T1, FE/GE, and STM1/STM4, effectively monitoring and managing alarms and performance metrics. Aries processors excel at fine-grain traffic aggregation, efficiently channeling fgODUflex traffic across OTN lines to support Ethernet, SDH, PDH client services. Their capacity to map signals to fgODUflex containers, which are then multiplexed into higher order OTN signals, demonstrates their versatility and efficiency. By allowing cascaded configurations with other Aries devices or Apodis processors, Aries products optimize traffic routes through OTN infrastructures, positioning them as essential components in optical networking and next-generation access scenarios.

Tera-Pass
AMBA AHB / APB/ AXI, HBM, NAND Flash, PCMCIA, Receiver/Transmitter, SAS
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agilePMU Customizable Power Management Unit

The agilePMU Subsystem is an efficient and highly integrated power management unit for SoCs/ASICs. Featuring a power-on-reset, multiple low drop-out regulators, and an associated reference generator. The agilePMU Subsystem is designed to ensure low power consumption while providing optimal power management capabilities. Equipped with an integrated digital controller, the agilePMU Subsystem offers precise control over start-up and shutdown, supports supply sequencing, and allows for individual programmable output voltage for each LDO. Status monitors provide real-time feedback on the current state of the subsystem, ensuring optimal system performance. Agile Analog designs are based on tried and tested architectures to ensure reliability and functionality. Our automated design methodology is programmatic, systematic and repeatable leading to analog IP that is more verifiable, more robust and more reliable. Our methodology also allows us to quickly re-target our IP to different process options. Our highly configurable and multi-node analog IP products are developed to meet the customer’s exact requirements. These digitally-wrapped and verified solutions can be seamlessly integrated into any SoC, significantly reducing complexity, time and costs.

Agile Analog
GLOBALFOUNDRIES, Intel Foundry, Samsung, SMIC, Tower, TSMC, UMC, X-Fab
3nm, 4nm, 5nm, 7nm, 8nm LPP, 12nm, 12nm FinFET, 14nm, 16nm, 20nm, 22nm FD-SOI, 28nm, 28nm SLP, 32/28nm, 40nm, 40/45nm, 45nm, 55nm, 65nm, 90nm, 110nm, 130nm, 150nm, 180nm, Intel 4, Intel 18A
Analog Subsystems
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AUTOSAR & Adaptive AUTOSAR Solutions

KPIT is at the forefront in developing AUTOSAR solutions that cater to the changing landscape of automotive software and architecture. They specialize in both classic and adaptive AUTOSAR frameworks, providing a structured approach to software integration that streamlines automotive systems development. Their AUTOSAR offerings are designed to promote interoperability across various vehicle electronics, ensuring seamless communication and function integration. By providing tailor-made solutions that adapt to specific OEM requirements, KPIT enhances vehicle functionality, benefitting from reduced development times and increased system efficiency. The evolution of software-defined vehicles necessitates advanced middleware solutions, and KPIT’s commitment to AUTOSAR leverages these technologies to maintain agility and scalability across vehicle ecosystems. They work closely with automotive manufacturers to adapt AUTOSAR standards that meet stringent safety and regulatory compliances, ensuring quality and performance.

KPIT Technologies
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DDR5 Serial Presence Detect (SPD) Hub Interface

The SPD5 Hub Function IP has been developed to interface I3C/I2C Host Bus and it allows an isolation of local devices like Temperature Sensor(TS), from master host bus. This SPD5 has Two wire serial interface like SCL, SDA

MAXVY Technologies Pvt Ltd
All Foundries
All Process Nodes
DDR
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D-PHY

The Mixel MIPI D-PHY IP (MXL-DPHY) is a high-frequency low-power, low cost, source-synchronous, physical layer compliant with the MIPI® Alliance Standard for D-PHY. (Learn more about Mixel’s MIPI ecosystem at Mixel MIPI Central which gives you access to Mixel’s best of class MIPI ecosystem supply chain partners.) Although primarily used for connecting cameras and display devices to a core processor, this MIPI PHY can also be used for many other applications. It is used in a master-slave configuration, where high-speed signals have a low voltage swing, and low-power signals have large swing. High-speed functions are used for high-speed data traffic while low-power functions are mostly used for control. The D-PHY is partitioned into a Digital Module – CIL (Control and Interface Logic) and a Mixed Signal Module. It is provided as a combination of Soft IP views (RTL, and STA Constraints) for Digital Module, and Hard IP views (GDSII/CDL/LEF/LIB) for the Mixed Signal Module. This unique offering of Soft and Hard IP permits architectural design flexibility and seamless implementation in customer-specific design flow. The CIL module interfaces with the protocol layer and determines the global operation of the lane module. The interface between the D-PHY and the protocol is called the PHY-Protocol Interface (PPI). During normal operation, the data lane switches between low-power mode and high-speed mode. Bidirectional lanes can also switch communication direction. The change of operating mode or direction requires enabling and disabling certain electrical functions. These enable and disable events do not cause glitches on the lines that would otherwise result in detections of incorrect signal levels. Therefore, all mode and direction changes occur smoothly, ensuring proper detection of the line signals. Mixel’s D-PHY is a complete PHY, silicon-proven at multiple foundries and multiple nodes. This MIPI PHY is fully integrated and has analog circuitry, digital, and synthesizable logic. Our D-PHY is built to support the MIPI Camera Serial Interface (CSI) and Display Serial Interface (DSI) using the PHY Protocol Interface (PPI). Mixel has provided this IP in many different configurations to accommodate different applications. The Universal Lane configuration can be used to support any allowed use-case, while other configurations are optimized for many different use cases such as Transmit only, Receive only, DSI, CSI, TX+ and RX+. Both TX+ and RX+ configurations support full-speed loopback operation without the extra area associated with a universal lane configuration.

Mixel Inc
All Foundries
All Process Nodes
Analog Front Ends, MIPI
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Veyron V2 CPU

The Veyron V2 CPU represents Ventana's second-generation RISC-V high-performance processor, designed for cloud, data center, edge, and automotive applications. This processor offers outstanding compute capabilities with its server-class architecture, optimized for handling complex, virtualized, and cloud-native workloads efficiently. The Veyron V2 is available as both IP for custom SoCs and as a complete silicon platform, ensuring flexibility for integration into various technological infrastructures. Emphasizing a modern architectural design, it includes full compliance with RISC-V RVA23 specifications, showcasing features like high Instruction Per Clock (IPC) and power-efficient architectures. Comprising of multiple core clusters, this CPU is capable of delivering superior AI and machine learning performance, significantly boosting throughput and energy efficiency. The Veyron V2's advanced fabric interconnects and extensive cache architecture provide the necessary infrastructure for high-performance applications, ensuring broad market adoption and versatile deployment options.

Ventana Micro Systems
AI Processor, Audio Processor, CPU, DSP Core, Processor Core Dependent, Processor Core Independent, Processor Cores
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Chimera GPNPU

The Quadric Chimera General Purpose Neural Processing Unit (GPNPU) delivers unparalleled performance for AI workloads, characterized by its ability to handle diverse and complex tasks without requiring separate processors for different operations. Designed to unify AI inference and traditional computing processes, the GPNPU supports matrix, vector, and scalar tasks within a single, cohesive execution pipeline. This design not only simplifies the integration of AI capabilities into system-on-chip (SoC) architectures but also significantly boosts developer productivity by allowing them to focus on optimizing rather than partitioning code. The Chimera GPNPU is highly scalable, supporting a wide range of operations across all market segments, including automotive applications with its ASIL-ready versions. With a performance range from 1 to 864 TOPS, it excels in running the latest AI models, such as vision transformers and large language models, alongside classic network backbones. This flexibility ensures that devices powered by Chimera GPNPU can adapt to advancing AI trends, making them suitable for applications that require both immediate performance and long-term capability. A key feature of the Chimera GPNPU is its fully programmable nature, making it a future-proof solution for deploying cutting-edge AI models. Unlike traditional NPUs that rely on hardwired operations, the Chimera GPNPU uses a software-driven approach with its source RTL form, making it a versatile option for inference in mobile, automotive, and edge computing applications. This programmability allows for easy updating and adaptation to new AI model operators, maximizing the lifespan and relevance of chips that utilize this technology.

Quadric
15 Categories
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AMBA APB Target

Advanced Peripheral Bus (APB) is one of the Advanced Microcontroller Bus Architecture (AMBA) family protocols. It is a low-cost interface that is designed for low power consumption and interface simplicity. Unlike AHB, it is a non-pipelined protocol for connecting low-bandwidth peripherals. Mostly used to link external peripherals to the SOC. Every APB transfer requires at least two clock cycles (SETUP Cycle and ACCESS Cycle) to finish. The APB interface is designed for accessing the programmable control registers of peripheral devices. The APB protocol has two independent data buses, one for read data and one for write data. The buses can be 8, 16, or 32 bits wide. The read and write data buses must have the same width. Data transfers cannot occur concurrently because the read data and write data buses do not have their own individual handshake signals.

Agnisys, inc.
All Foundries
All Process Nodes
AMBA AHB / APB/ AXI
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LC-PLLs

Silicon Creations delivers precision LC-PLLs designed for ultra-low jitter applications requiring high-end performance. These LC-tank PLLs are equipped with advanced digital architectures supporting wide frequency tuning capabilities, primarily suited for converter and PHY applications. They ensure exceptional jitter performance, maintaining values well below 300fs RMS. The LC-PLLs from Silicon Creations are characterized by their capacity to handle fractional-N operations, with active noise cancellation features allowing for clean signal synthesis free of unwanted spurs. This architecture leads to significant power efficiencies, with some IPs consuming less than 10mW. Their low footprint and high frequency integrative capabilities enable seamless deployments across various chip designs, creating a perfect balance between performance and size. Particular strength lies in these PLLs' ability to meet stringent PCIe6 reference clocking requirements. With programmable loop bandwidth and an impressive tuning range, they offer designers a powerful toolset for achieving precise signal control within cramped system on chip environments. These products highlight Silicon Creations’ commitment to providing industry-leading performance and reliability in semiconductor design.

Premium Vendor
Silicon Creations
GLOBALFOUNDRIES, TSMC, UMC
10nm, 28nm
Amplifier, Clock Generator, Photonics, PLL
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eSi-3250

Leveraging a high-performance RISC architecture, the eSi-3250 32-bit core efficiently integrates instruction and data caches. This makes it compatible with designs utilizing slower on-chip memories such as eFlash. The core not only supports MMU for address translation but also allows for user-defined custom instructions, greatly enhancing its flexibility for specialized and high-performance applications.

eSi-RISC
All Foundries
16nm, 90nm, 250nm, 350nm
Building Blocks, CPU, DSP Core, Microcontroller, Multiprocessor / DSP, Processor Cores
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ARINC 818 Switch IP Core

iWave Global introduces the ARINC 818 Switch, a pivotal component in the management and routing of video data within avionics systems. Designed for applications that require efficient video data distribution and management, the switch is optimized for performance in environments with stringent data handling requirements. The switch's architecture supports a high level of bandwidth, allowing for the smooth routing of multiple video streams in real-time. Its design includes advanced features that ensure low-latency, error-free data transfer, integral to maintaining the integrity and reliability of video data in critical applications. Featuring robust interoperability characteristics, the ARINC 818 Switch easily integrates into existing systems, facilitating modular expansion and adaptability to new technological standards. It is indispensable for any aerospace project that involves complex video data management, providing a stable platform for video data routing and switching.

iWave Global
AMBA AHB / APB/ AXI, Coder/Decoder, Peripheral Controller
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RCCC/RCCB Processing

Overview: RCCC and RCCB in ISP refer to Red and Blue Color Correction Coefficients, respectively. These coefficients are utilized in Image Signal Processing to enhance red and blue color components for accurate color reproduction and balance. They are essential for color correction and calibration to ensure optimal image quality and color accuracy in photography, video recording, and visual displays. The IP is designed to process RCCC pattern data from sensors, where green and blue pixels are substituted by Clear pixel, resulting in Red or Clear (Monochrome) format after demosaicing. It supports real-time processing with Digital Video Port (DVP) format similar to CIS output. RCCB sensors use Clear pixels instead of Green pixels, enhancing sensitivity and image quality in low-light conditions compared to traditional RGB Bayer sensors. LOTUS converts input from RCCB sensors to a pattern resembling RGB Bayer sensors, providing DVP format interface for real-time processing. Features:  Maximum Resolution: 8MP (3840h x 2160v)  Maximum Input Frame Rate: 30fps  Low Power Consumption  RCCC/RCCB Pattern demosaicing

Plurko Technologies
All Foundries
All Process Nodes
Camera Interface
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NVMe Host Controller IP Core

The NVMe Host Controller from iWave Global offers an advanced solution for managing NVMe drive interfaces in computing systems. This controller is designed to facilitate the high-speed data exchange that NVMe drives demand, streamlining operations across data-centric applications. Engineered for scalability and performance, the NVMe Host Controller supports high data throughput, ensuring quick access and transfer of data between storage devices and host systems. Its design caters to the demands of modern computational environments where rapid data retrieval and storage are critical. The controller is integral in systems requiring high-performance storage solutions, and its support for multiple interfaces underscores its adaptability and broad applicability in data-intensive industries such as enterprise storage and high-performance computing.

iWave Global
Embedded Memories, Flash Controller
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xcore.ai

The xcore.ai platform by XMOS is a versatile, high-performance microcontroller designed for the integration of AI, DSP, and real-time I/O processing. Focusing on bringing intelligence to the edge, this platform facilitates the construction of entire DSP systems using software without the need for multiple discrete chips. Its architecture is optimized for low-latency operation, making it suitable for diverse applications from consumer electronics to industrial automation. This platform offers a robust set of features conducive to sophisticated computational tasks, including support for AI workloads and enhanced control logic. The xcore.ai platform streamlines development processes by providing a cohesive environment that blends DSP capabilities with AI processing, enabling developers to realize complex applications with greater efficiency. By doing so, it reduces the complexity typically associated with chip integration in advanced systems. Designed for flexibility, xcore.ai supports a wide array of applications across various markets. Its ability to handle audio, voice, and general-purpose processing makes it an essential building block for smart consumer devices, industrial control systems, and AI-powered solutions. Coupled with comprehensive software support and development tools, the xcore.ai ensures a seamless integration path for developers aiming to push the boundaries of AI-enabled technologies.

XMOS Semiconductor
21 Categories
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agileADC Customizable Analog-to-Digital Converter

The agileADC analog-to-digital converter is a traditional Charge-Redistribution SAR ADC that is referenced to VDD, VSS. The architecture can achieve up to 12-bit resolution at sample rates up to 64 MSPS. It includes a 16-channel input multiplexor that can be configured to be buffered or unbuffered, and support differential or single-ended inputs. Agile Analog designs are based on tried and tested architectures to ensure reliability and functionality. Our automated design methodology is programmatic, systematic and repeatable leading to analog IP that is more verifiable, more robust and more reliable. Our methodology also allows us to quickly re-target our IP to different process options. Our highly configurable and multi-node analog IP products are developed to meet the customer’s exact requirements. These digitally-wrapped and verified solutions can be seamlessly integrated into any SoC, significantly reducing complexity, time and costs.

Agile Analog
GLOBALFOUNDRIES, Intel Foundry, Samsung, SMIC, Tower, TSMC, UMC, X-Fab
27 Process Nodes
A/D Converter
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WDR (Wide Dynamic Range)

Overview: Human eyes have a wider dynamic range than CMOS image sensors (CIS), leading to differences in how objects are perceived in images or videos. To address this, CIS and IP algorithms have been developed to express a higher range of brightness. High Dynamic Range (HDR) based on Single Exposure has limitations in recreating the Saturation Region, prompting the development of Wide Dynamic Range (WDR) using Multi Exposure images. The IP supports PWL companding mode or Linear mode to perform WDR. It analyzes the full-image histogram for global tone mapping and maximizes visible contrast in local areas for enhanced dynamic range. Specifications:  Maximum Resolution: o Image: 13MP o Video: 13MP @ 60fps (Input/Output)  Input Formats (Bayer): o HDR Linear Mode: Max raw 28 bits o Companding Mode: Max PWL compressed raw 24 bits  Output Formats (Bayer): 14 bits  Interface: o ARM® AMBA APB BUS interface for ISP system control o ARM® AMBA AXI interface for data o Video data stream interface Features:  Global Tone Mapping based on histogram analysis o Adaptive global tone mapping per Input Images  Local Tone Mapping for adaptive contrast enhancement  Real-Time WDR Output  Low Power Consumption and Small Gate Count  28-bit Sensor Data Interface

Plurko Technologies
All Foundries
All Process Nodes
Camera Interface
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Metis AIPU M.2 Accelerator Module

The Metis AIPU M.2 Accelerator Module is designed for devices that require high-performance AI inference in a compact form factor. Powered by a quad-core Metis AI Processing Unit (AIPU), this module optimizes power consumption and integration, making it ideal for AI-driven applications. With a dedicated memory of 1 GB DRAM, it enhances the capabilities of vision processing systems, providing significant boosts in performance for devices with Next Generation Form Factor (NGFF) M.2 sockets. Ideal for use in computer vision systems and more, it offers hassle-free integration and evaluation with Axelera's Voyager SDK. This accelerator module is tailored for any application seeking to harness the power of AI processing efficiently. The Metis AIPU M.2 Module streamlines the deployment of AI applications, ensuring high performance with reduced power consumption.

Axelera AI
2D / 3D, AI Processor, AMBA AHB / APB/ AXI, Building Blocks, CPU, Multiprocessor / DSP, Processor Core Dependent, Processor Core Independent, Processor Cores, Vision Processor, WMV
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JESD251 xSPI Host/Device Controller

Overview: The Expanded Serial Peripheral Interface (xSPI) Master/Slave controller offers high data throughput, low signal count, and limited backward compatibility with legacy SPI devices. It is designed to connect xSPI Master/Slave devices in computing, automotive, Internet of Things, embedded systems, and mobile processors to various peripherals such as non-volatile memories, graphics peripherals, networking devices, FPGAs, and sensor devices. Key Features:  Compliance with JEDEC standard JESD251 eXpanded SPI for Non-Volatile Memory Devices, Version 1.0  Support for Single master and multiple slaves per interface port  Single Data Rate (SDR) and Double Data Rate (DDR) support  Source synchronous clocking  Deep Power Down (DPD) enter and exit commands  Eight IO ports in standard, expandable based on system requirements  Optional Data Strobe (DS) for write masking  bit wide SDR transfer support  Profile 1.0 Commands for non-volatile memory device management  Profile 2.0 Commands for read or write data for various slave devices Applications:  Consumer Electronics  Defense & Aerospace  Virtual Reality  Augmented Reality  Medical  Biometrics  Automotive Devices  Sensor Devices

Plurko Technologies
All Foundries
All Process Nodes
Peripheral Controller
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Expanded Serial Peripheral Interface (xSPI) Master Controller

Our Expanded Serial Peripheral Interface (JESD251) Master controller features a low signal count and high data bandwidth, making it ideal for use in computing, automotive, Internet of Things, embedded systems, and mobile system processors. It connects multiple sources of Serial Peripheral Interface (xSPI) slave devices, including nonvolatile memories, graphics peripherals, networking peripherals, FPGAs, and sensor devices. Features • Compliant with JEDEC standard JESD251 expanded Serial Peripheral Interface (xSPI) for Non-Volatile Memory Devices, Version 1.0. • Supports a single master and multiple slaves per interface port. • Supports Single Data Rate and Double Data Rate. • Supports source synchronous clocking. • Supports data transfer rates up to: o 400MT/s (200MHz Clock) o 333MT/s (167MHz Clock) o 266MT/s (133MHz Clock) o 200MT/s (100MHz Clock) • Supports Deep Power Down (DPD) enter and exit commands. • Standard support for eight IO ports, with the possibility to increase IO ports based on system performance requirements. • Optional support for Data Strobe (DS) for writemasking. • Supports 1-bit wide SDR transfer. • Supports Profile 1.0 commands to manage nonvolatile memory devices. • Supports Profile 2.0 commands to read or writedata for any type of slave device. • Compatible with non-volatile memory arrays such as NOR Flash, NAND Flash, FRAM, and nvSRAM. • Compatible with volatile memory arrays such as SRAM, PSRAM, and DRAM. • Supports register-mapped input/output functions. • Supports programmable function devices such as FPGAs. Application • Consumer Electronics. • Defence & Aerospace. • Virtual Reality. • Augmented Reality. • Medical. • Biometrics (Fingerprints, etc). • Automotive Devices. • Sensor Devices. Deliverables • Verilog Source code. • User Guide. • IP Integration Guide. • Run and Synthesis script. • Encrypted Verification Testbench Environment. • Basic Test-suite.

Plurko Technologies
All Foundries
All Process Nodes
Peripheral Controller
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Talamo SDK

The Talamo Software Development Kit (SDK) is an advanced solution from Innatera designed to expedite the development of neuromorphic AI applications. It integrates seamlessly with PyTorch, providing developers with a familiar environment to build and extend AI models specifically for spiking neural processors. By enhancing the standard PyTorch workflow, Talamo simplifies the complexity associated with constructing spiking neural networks, allowing a broader range of developers to create sophisticated AI solutions without requiring deep expertise in neuromorphic computing. Talamo's capabilities include automatic mapping of trained models onto Innatera's heterogeneous computing architecture, coupled with a robust architecture simulator for efficient validation and iteration. This means developers can iterate quickly and efficiently, optimizing their applications for performance and power without extensive upfront reconfiguration or capital layout. The SDK supports the creation of collaborative application pipelines that merge signal processing with AI, supporting custom functions and neural network implementation. This gives developers the flexibility to tailor solutions to specific needs, be it in audio processing, gesture recognition, or environmental sensing. Through its comprehensive toolkit, Talamo SDK empowers users to translate conceptual models into high-performing AI applications that leverage the unique processing strengths of spiking neural networks, ultimately lowering barriers to innovation in low-power, edge-based AI.

Innatera Nanosystems
AI Processor, CPU, Multiprocessor / DSP, Processor Core Independent, Vision Processor
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DDR PHY

At the forefront of memory interfaces, Dolphin Technology’s DDR PHY IPs offer exceptional performance and versatility for modern applications. This IP suite is designed to support DDR4, DDR3, and DDR2 standards, as well as LPDDR series memories. Notably, these DDR PHYs are engineered to reach speeds up to 4266 Mbps, ensuring compatibility with high-performance computing requirements. The DDR PHY IPs include features such as slew rate control, per-bit de-skew, gate training, and built-in self-test (BIST), all contributing to their robustness and adaptability in various system environments. They are compliant with the DFI 4.0 specification, providing seamless integration with DDR memory controllers to deliver comprehensive memory subsystem solutions. With proven reliability in silicon, these PHYs have been designed to efficiently integrate into SoCs, offering a high degree of speed and data integrity for advanced semiconductor applications. This makes them suitable for an array of high-performance tasks in industries ranging from consumer electronics to data center operations.

Dolphin Technology
TSMC
28nm, 65nm
DDR, Mobile SDR Controller
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