Designed as an Anti-Fuse One Time Programmable (OTP) memory, LEE Fuse ZA caters to trimming applications and redundancy requirements in memory systems. It stands out by offering high retention life and temperature resilience, indispensable in stringent automotive sectors where dependability is crucial.
LEE Fuse ZA is optimized for easy implementation, requiring no additional masks or process modifications. It's an adaptable solution compatible with processes from as wide as 180nm down to advanced sub-10nm nodes, showcasing its versatility across generations of technology.
This IP allows for programming at the production line or in-field, adding a layer of flexibility in product customization and post-deployment adjustments. Consequently, it's particularly well-suited for dynamic environments where in-field updates and tweaks might be necessary.
