Metis serves as a groundbreaking platform specifically for advanced 2.5D and 3D IC packaging design and analysis. Equipped with a 3D full-wave electromagnetic simulation engine, Metis effortlessly handles simulations for chips and various packaging structures, ensuring precise signal and power integrity modeling. Its hybrid meshing technology manages computational resources efficiently without compromising accuracy. Ideal for large-capacity packaging designs, Metis supports simulations from nanometer to centimeter scales, and its support for parallel computing provides significant benefits in terms of speed and efficiency.
