All IPs > Network on Chip > Network on Chip
Network on Chip (NoC) semiconductor IPs play a crucial role in modern electronic design, offering advanced solutions for efficient data communication within integrated circuits. As devices become more complex, traditional bus systems struggle to meet the demand for fast, reliable data transfer. This is where NoC technology comes into play, enhancing the scalability and performance of electronic devices from smartphones to data centers.
At its core, a Network on Chip provides a sophisticated, packet-switched network capable of linking various IP cores in a System on Chip (SoC). This architecture not only boosts communication efficiency but also facilitates easier design of high-performance systems. By implementing NoC semiconductor IPs, designers can effectively manage bandwidth, reduce latency, and improve overall chip performance. These improvements are essential for applications demanding high-speed processing, such as artificial intelligence, machine learning, and real-time data analysis.
Products in the Network on Chip category include a diverse range of solutions, from basic routers and switches to complex network architectures supporting multichip modules. These IPs are tailored to address different design requirements, offering customizable topologies that support varied performance needs. Whether you are building a simple communication channel for a small device or a robust network for a large data center, Silicon Hub provides the semiconductor IPs you need to optimize your design.
In summary, exploring the Network on Chip category at Silicon Hub opens the door to innovative solutions for next-generation electronic systems. With these semiconductor IPs, designers gain the tools necessary to overcome traditional constraints, ultimately achieving faster, more efficient, and scalable devices. Whether your focus is low-power IoT devices or high-performance computing systems, Network on Chip technology is key to unlocking enhanced communication capabilities across your products.
SkyeChip's Coherent Network-on-Chip (NOC) is a scalable networking solution aimed at systems where memory coherency is critical. Engineered for many-core setups, it effectively mitigates routing congestion through innovative architectural strategies. This NOC is capable of operating at frequencies up to 2GHz, aligning with high-speed data demands while supporting a range of protocols, including ACE and CHI. Well-suited for partitioned interconnect systems, it surgically meshes with both SkyeChip's Non-Coherent NOC and various proprietary coherence protocols. Its strength in maintaining coherency makes it ideal for applications in computing environments that require seamless communication across cores and memory subsystems.
The NuLink Die-to-Die PHY for Standard Packaging is a cutting-edge interconnect solution that bridges multiple dies on a single standard package substrate. This technology supports numerous industry standards, including UCIe and BoW, and adapts to both advanced and conventional packaging setups. It enables low-power, high-performance interconnections that are instrumental in the design of multi-die systems like SiPs, facilitating bandwidth and power efficiencies comparable to that of more costly packaging technologies. Eliyan's PHY technology, distinctive for its innovative implementation methods, offers similar performance attributes as advanced packaging alternatives but at a fraction of the thermal, cost, and production time expenditures. This design approach effectively utilizes standard packages, circumventing the complexities associated with silicon interposers, while still delivering robust data handling capabilities essential for sophisticated ASIC designs. With up to 64 data lanes, and operating at data rates that reach 32Gbps per lane, the NuLink Die-to-Die interconnect elements ensure consistent performance. Such specifications make them suitable for high-demand applications requiring reliable, efficient data transmission across multiple processing elements, reinforcing their role as a fundamental building block in the semiconductor landscape.
The ePHY-5616 is a high-performance SerDes solution from eTopus, designed for versatile use across enterprise, data center, and 5G applications. Operating efficiently at data rates from 1 to 56 Gbps, this product exploits advanced DSP techniques for superior signal integrity and robustness. It accommodates wide insertion loss ranges of 10dB to over 35dB, thus ensuring reliable performance in challenging communication environments. Its architecture supports direct optical drives and quad/octal configurations, making it ideal for network interface cards, routers, and high-speed switches in a data center setup. The embedded DSP architecture is developed with eTopus's proprietary algorithms, which enable rapid SerDes tuning and performance optimization. The ePHY-5616 is also characterized by its low Bit Error Rate (BER), ensuring data reliability and integrity. Moreover, it supports multiple protocols, including Ethernet and PCIe, enhancing its integration potential in modern broadband networks.
The Non-Coherent Network-on-Chip (NOC) by SkyeChip is a performance-driven interconnect solution, designed to optimize bandwidth and latency while minimizing silicon utilization in high-performance ICs. Primarily targeted at advanced integrated systems, this NOC significantly reduces wire congestion, enhancing power and area efficiency. It employs a variety of protocols like AXI4 and APB, facilitating ease of integration and high-frequency operation up to 2GHz. Its architectural innovations support complex 2.5D and 3D interconnect topologies, enabling versatile application across modern multi-die setups. When combined with SkyeChip's Coherent NOC technologies, it provides seamless integration for partitioned systems demanding diverse interconnect capabilities.
The Hyperspectral Imaging System is designed to provide comprehensive imaging capabilities that capture data across a wide spectrum of wavelengths. This system goes beyond traditional imaging techniques by combining multiple spectral images, each representing a different wavelength range. By doing this, it enables the identification and analysis of various materials and substances based on their spectral signatures. Ideal for applications in agriculture, healthcare, and industry, it allows for the precise characterisation of elements and compounds, contributing to advancements in fields such as remote sensing and environmental monitoring.
ISPido represents a fully configurable RTL Image Signal Processing Pipeline, adhering to the AMBA AXI4 standards and tailored through the AXI4-LITE protocol for seamless integration with systems such as RISC-V. This advanced pipeline supports a variety of image processing functions like defective pixel correction, color filter interpolation using the Malvar-Cutler algorithm, and auto-white balance, among others. Designed to handle resolutions up to 7680x7680, ISPido provides compatibility for both 4K and 8K video systems, with support for 8, 10, or 12-bit depth inputs. Each module within this pipeline can be fine-tuned to fit specific requirements, making it a versatile choice for adapting to various imaging needs. The architecture's compatibility with flexible standards ensures robust performance and adaptability in diverse applications, from consumer electronics to professional-grade imaging solutions. Through its compact design, ISPido optimizes area and energy efficiency, providing high-quality image processing while keeping hardware demands low. This makes it suitable for battery-operated devices where power efficiency is crucial, without sacrificing the processing power needed for high-resolution outputs.
The nxFeed Market Data System is engineered to provide efficient market data processing with the aid of FPGA technology. It reduces the latency typically associated with data processing, offering a normalized API for easy application integration. This system is particularly beneficial for electronic trading platforms, facilitating efficient data handling even with volatile data feeds. nxFeed supports a high volume of symbols and offers tools for effective data filtering and resynchronization across exchanges. By enabling swift data distribution via PCIe and UDP multicast, it provides unparalleled flexibility for diverse trading scenarios.
The BlueLynx Chiplet Interconnect is a sophisticated die-to-die interconnect solution that offers industry-leading performance and flexibility for both advanced and conventional packaging applications. As an adaptable subsystem, BlueLynx supports the integration of Universal Chiplet Interconnect Express (UCIe) as well as Bunch of Wires (BoW) standards, facilitating high bandwidth capabilities essential for contemporary chip designs.\n\nBlueLynx IP emphasizes seamless connectivity to on-die buses and network-on-chip (NoCs) using standards such as AMBA, AXI, and ACE among others, thereby accelerating the design process from system-on-chip (SoC) architectures to chiplet-based designs. This innovative approach not only allows for faster deployment but also mitigates development risks through a predictable and silicon-friendly design process with comprehensive support for rapid first-pass silicon success.\n\nWith BlueLynx, designers can take advantage of a highly optimized performance per watt, offering customizable configurations tailored to specific application needs across various markets like AI, high-performance computing, and mobile technologies. The IP is crafted to deliver outstanding bandwidth density and energy efficiency, bridging the requirements of advanced nodal technologies with compatibility across several foundries, ensuring extensive applicability and cost-effectiveness for diverse semiconductor solutions.
The UHS-II solution is crafted to enhance data transfer rates within low-voltage environments. It particularly supports high-definition content transmission, which is critical for modern mobile devices requiring seamless streaming and heavy data loads. Utilizing a modular design approach, it ensures a robust and efficient layout that facilitates optimal performance and reliability.
The Xinglian-500 stands as a testament to StarFive's prowess in developing interconnect technologies that ensure memory coherence across multiple CPU and SoC configurations. This proprietary interconnect fabric plays a vital role in building scalable architectures, facilitating efficient communication among processor cores and peripheral components. Optimally designed to support multi-core environments, the Xinglian-500 provides robust support for constructing sophisticated systems. Its flexibility and adaptability position it as a critical component in ensuring that complex compute models operate seamlessly, thus optimizing the performance of various applications. As systems become more demanding, the Xinglian-500's capability to maintain consistent and reliable operation across a wide array of configurations becomes invaluable. It advances the development of next-generation technology infrastructures, enhancing the efficiency and scalability of enterprise and industrial applications.
Wormhole is a versatile communication system designed to enhance data flow within complex computational architectures. By employing state-of-the-art connectivity solutions, it enables efficient data exchange, critical for high-speed processing and low-latency communication. This technology is essential for maintaining optimal performance in environments demanding seamless data integration. Wormhole's ability to manage significant data loads with minimal latency makes it particularly suitable for applications requiring real-time data processing and transfer. Its integration into existing systems can enhance overall efficiency, fostering a more responsive computational environment. This makes it an invaluable asset for sectors undergoing digital transformation. The adaptability of Wormhole to various technological requirements ensures it remains relevant across diverse industry applications. This flexibility means that it can scale with ongoing technological advancements, cementing its role as a cornerstone in the evolving landscape of high-speed data communications.
The NoC (Network on Chip) Bus Interconnect from OPENEDGES is designed to offer sophisticated networking capabilities within chips, facilitating efficient communication pathways between subsystems. This critical component serves as the backbone for data traffic, ensuring that information flows smoothly and rapidly between functional blocks, which is essential for maintaining the high-speed performance that contemporary applications demand. OPENEDGES' NoC solution boasts a design focused on minimal latency and efficient data routing, attributes that are critical for enhancing both performance and power efficiency. These features make it particularly valuable for applications within high-performance computing and advanced data processing environments. By optimizing how data packets are managed and transferred, the NoC Bus Interconnect substantially contributes to the throughput and power savings within the systems it integrates. Additionally, the NoC Bus Interconnect is engineered with scalability and adaptability in mind, making it suitable for a broad spectrum of applications, from consumer electronics to enterprise-grade systems. This versatility ensures that as operational demands grow and evolve, the network on chip can accommodate changes seamlessly, thus supporting the ongoing advancements in semiconductor technology and system architecture.
FlexWay Interconnect from Arteris provides a streamlined network-on-chip solution, ideally suited for low-power IoT edge devices and microcontrollers. This NoC IP is renowned for its efficiency and cost-effectiveness, making it an ideal candidate for embedded applications where power conservation is crucial. These interconnect mechanisms are constructed from rudimentary components, guided by robust algorithms and an intuitive graphical interface to facilitate the development of optimally configured topologies. FlexWay is adept at managing smaller scale systems, delivering smooth scalability from simple to medium complexity designs without unnecessary bloat. It maintains performance integrity across varied workloads, ensuring expedited on-chip data flow. Despite its power-efficient architecture, FlexWay handles bandwidth demands proficiently, supporting robust data transportation for embedded systems. Key capabilities include multi-clock, power, and voltage domain management, and comprehensive support for AMBA protocols to maintain a versatile environment, addressing diverse industrial standards. With SystemC simulation and UVM verification, FlexWay Interconnect ensures coherent design flows, reducing potential integration issues within the overall system architecture.
The Ncore Cache Coherent Interconnect by Arteris addresses the multifaceted challenges of multi-core ASIC design, offering a production-ready, highly configurable coherent NoC interconnect solution. Ncore is tailored for high-performance applications, supporting a variety of protocols compatible with Arm and RISC-V processors while enhancing inter-core communication and synchronization. Ncore is designed with functional safety in mind, making it suitable for ISO 26262 certification, a crucial factor for safety-critical applications such as automotive systems. It ensures credible operation in these environments with built-in safety and reliability features, including FMEDA data and ASIL certification. The IP supports multi-protocol coherency with CHI-B, CHI-E, and ACE alongside I/O coherent agent interfaces, providing versatility and backward compatibility for diverse SoC architectures. Enhanced with unique proxy caches, Ncore lowers power requirements while maintaining high performance, offering a scalable, power-efficient interconnect fabric suitable for a wide array of system scales, from small embedded solutions to extensive multi-billion transistor designs.
aiSim is the world's first ISO26262 ASIL-D certified simulator, specifically designed for ADAS and autonomous driving validation. This state-of-the-art simulator captures the essence of AI-driven digital twin environments and sophisticated sensor simulations, key for conducting high-fidelity tests in virtual settings. Offering a flexible architecture, aiSim reduces reliance on costly real-world testing by recreating diverse environmental conditions like weather and complex urban scenarios, enabling comprehensive system evaluations under deterministic conditions. As a high-caliber tool, aiSim excels at simulating both static and dynamic environments, leveraging a powerful rendering engine to deliver deterministic, reproducible results. Developers benefit from seamless integration thanks to its modular use of C++ and Python APIs, making for an adaptable testing tool that complements existing toolchains. The simulator encourages innovative scenario creation and houses an extensive 3D asset library, enabling users to construct varied, detailed test settings for more robust system validation. aiSim's cutting-edge capabilities include advanced scenario randomization and simulation of sensor inputs across multiple modalities. Its AI-powered rendering streamlines the processing of complex scenarios, creating resource-efficient simulations. This makes aiSim a cornerstone tool in validating automated driving solutions, ensuring they can handle the breadth of real-world driving environments. It is an invaluable asset for engineers looking to perfect sensor designs and software algorithms in a controlled, scalable setting.
Tensix Neo is a high-performance processor designed to accelerate AI tasks with remarkable efficiency. By optimizing for performance per watt, it caters to AI developers needing robust technology for power-intense projects. Its architectural design supports a wide range of precision formats, ensuring that varying AI workloads are managed effectively. Central to its design is a specialized Network-on-Chip (NoC) that facilitates highly efficient data transfer and communication, enabling scalable AI solutions. This NoC allows the processor to evolve alongside an ever-changing landscape of AI models and applications, making it an asset for developers focused on scalability. Tensix Neo is particularly suited for environments where adaptability and performance are crucial, such as large-scale data processing centers and real-time computational tasks. It provides the technological backbone needed for developing next-gen AI systems that require flexible and powerful processing capabilities.
Network on Chip (NOC-X) from Extoll is designed to address the complex communication needs of multi-core processors and chiplet-based systems. This advanced interconnect solution facilitates high-speed data exchange between various functional blocks within a chip, ensuring seamless operation and enhanced performance. NOC-X offers a scalable architecture that can support increasing data traffic demands within integrated circuits. Its design focuses on reducing communication latency and optimizing throughput, crucial factors for efficient processor performance. This capability makes NOC-X ideal for high-performance computing scenarios and applications requiring rigorous data movement and processing with minimal latency. Incorporating the NOC-X into a system not only enhances the data handling capabilities but also contributes to overall power efficiency by minimizing energy expenditure per data bit transferred. By facilitating coherent and synchronized communication across multiple modules, NOC-X aids in the development of systems that are both responsive and reliable. Its flexibility and efficiency make it a key component in designing next-generation digital systems.
The GL3004 fisheye image processor offers comprehensive image processing capabilities, tailored specifically for wide-angle lens applications. It delivers exceptional fisheye correction methods, allowing for versatile dewarping options from spherical panorama views to specific stitching modes. Integrated hardware ensures that images maintain high fidelity, with a focus on accurate color processing and enhanced dynamic range. Supporting inputs up to 3 megapixels, it excels in real-time processing with an integrated ISP that handles a broad spectrum of imaging functions from noise reduction to auto-exposure control. This processor ensures that every captured scene disperses real-life details efficiently, which is critical in surveillance and advanced photography contexts. Designed with multiple interfaces, such as MIPI and BT standards, the GL3004 can fit into diverse applications, offering seamless integration potential. With an onboard Cyclone-8051 CPU, it processes instructions at a high speed, with reliable PLL systems managing clock operations across varied loads, making it a solid solution for creative and technical image requirements.
The Atrevido core is a highly customizable 64-bit out-of-order RISC-V processor. It is adaptable for multiprocessor environments, supporting 2/3/4-wide configurations. Designed for intensive machine learning and HPC applications, it integrates seamlessly with vector units, capitalizing on its inherent capability to manage sparse datasets and reduce memory latency through Semidynamics' proprietary Gazzillion Misses™ technology. The core supports high-bandwidth memory systems, making it ideal for environments requiring efficient data handling and processing. Atrevido's architecture includes a range of sophisticated features such as direct support for unaligned accesses and comprehensive register renaming capabilities. Further, its compatibility with standard Linux environments and support for RISC-V vector specifications underscore its versatility. Applications in AI use its ability to decode multiple instructions per cycle, supporting both complex matrix operations and real-time processing needs. The core's capability to integrate with Semidynamics' Vector Unit offers additional computing power, enhancing its performance in tasks requiring parallel data processing. This combination makes it suitable for dense computational tasks, such as those found in recommendation systems and key-value stores, providing a robust platform that scales efficiently across various industry needs.
Packetcraft's Bluetooth LE Audio Solutions represent a leading-edge offering in wireless communication, providing a robust and flexible framework for integrating advanced audio features. It accommodates a variety of audio configurations, including LC3 optimized codecs and support for Auracast broadcast audio, which is tailored for seamless integration into true wireless stereo (TWS) systems. This offering allows product manufacturers to leverage Bluetooth LE's low-energy capabilities while ensuring high-fidelity audio transmission, paving the way for a new generation of audio devices that are both energy-efficient and feature-rich. The solution has been successfully ported to several popular chipsets, granting product developers significant flexibility in product design and reducing time-to-market. By enabling a straightforward migration path from existing Bluetooth technologies, Packetcraft ensures that its customers can rapidly adopt the latest features of Bluetooth LE Audio, including extended capabilities for broadcast audio and advanced stereo output. Moreover, Packetcraft's comprehensive support infrastructure and ongoing updates guarantee that users can maximize the potential of their Bluetooth LE Audio implementations, remaining competitive in a rapidly evolving market. This is particularly valuable for companies looking to distinguish themselves through enhanced user experiences, broad compatibility, and energy-efficient performance.
Magillem Connectivity by Arteris offers a comprehensive system-on-chip integration solution that simplifies the design of complex systems by streamlining connectivity processes. By automating the assembly of system components, it eliminates manual tasks and allows developers to concentrate on value-adding activities. Utilization of the IP-XACT standard ensures accuracy and consistency throughout the integration process. With embedded automation workflows, Magillem Connectivity greatly reduces the time required for system integration by up to 30%, maintaining a high quality of development and configurability. The tool enables seamless IP deployment and incorporates continuous integration practices to adapt swiftly to design changes, improving productivity and design predictability. Magillem Connectivity offers a robust set of features including project management, automatic IP instantiation, and comprehensive hierarchical design manipulation. This supports the efficient management of power and physical design constraints, while reducing integration time from several weeks to just a few days. Its capacity to manage thousands of instances in large-scale designs makes it invaluable for comprehensive projects, ensuring error-free design implementation with progress reporting tools that underscore portability and adaptability.
The HUMMINGBIRD Optical Network-on-Chip (ONOC) is an advanced interconnect technology that utilizes optical pathways to enhance on-chip communication. It is designed to significantly boost data transfer speeds within semiconductor chips by replacing traditional electronic wired pathways with optical networks. This ONOC architecture facilitates a network of components on a single chip, drastically reducing latency and improving data throughput, which is essential for high-speed computing environments and AI applications. HUMMINGBIRD's innovative use of optical signals not only enhances speed but also minimizes power consumption, as optical signals inherently require less energy than electrical currents. This efficient operation is particularly beneficial in modern processors, where heat and power are limiting factors for scaling up capabilities. By mitigating these factors, HUMMINGBIRD enables denser chip designs and more powerful processing. The adaptability of this optical network-on-chip makes it suitable for integration into various semiconductor platforms. It helps data centers and computing applications efficiently manage increasingly complex data loads without significant increases in power consumption or heat generation. HUMMINGBIRD stands out as an optimal choice for cutting-edge chip designs seeking to leverage the benefits of optical technology within the semiconductor industry.
The SoC Platform from SEMIFIVE is a comprehensive solution facilitating the creation of custom silicon platforms rapidly and cost-effectively. It integrates pre-verified silicon IPs and utilizes optimized design methodologies geared towards reducing both risks and costs while accelerating turnaround times. The platform caters particularly to domain-specific architectures, providing a pre-configured and thoroughly vetted pool of IPs ready for immediate deployment. This platform enables swift development by offering a seamless and systematic integration of hardware with an easy bring-up for both hardware and software applications. It simplifies the process of turning ideas into silicon, ensuring lower non-recurring engineering costs and shortening the time to market significantly when compared to industry norms. The SoC Platform offers several engagement models, each designed to meet different customer needs, whether they require maximum efficiency with existing IPs or more flexibility to integrate third-party components. Technical highlights include sophisticated CPU and memory interface options as well as advanced integration possibilities for AI inference, big data analytics, and other critical applications. Designed for modern high-performance computing environments, it supports rapid prototyping and efficient system development with robust user support throughout the process.
The Complete 5G NR Physical Layer from AccelerComm offers a robust solution for high-performance networks, whether terrestrial or satellite-based. This full-featured physical layer is versatile, supporting various specialized applications, including O-RAN, satellite, and small-cell solutions. By integrating both high and low PHY components, it delivers optimal performance, power, and area efficiency. Boasting innovative signal processing technologies, the product ensures top-tier link performance, with a strong focus on meeting the needs of demanding network environments.\n\nThe solution's adaptability allows it to be implemented as licensable IP across multiple platforms, including ARM software, FPGA, and ASIC-ready cores. This flexibility is pivotal for diverse deployment scenarios, making it an ideal choice for developers seeking to reduce project risks through comprehensive pre-integration testing on COTS development boards.\n\nFurthermore, the product's inclusion of AccelerComm's proprietary 5G acceleration technologies enables users to achieve game-changing power and performance metrics in their 5G networks. Whether for LEO satellites or dense urban networks, this physical layer solution stands out for its capacity to address unique challenges faced by modern communication infrastructures, maximizing both spectral efficiency and global network reach.
The Satellite Navigation SoC Integration solution by GNSS Sensor Ltd facilitates the incorporation of GNSS capabilities into system-on-chips. This integration supports GPS, GLONASS, SBAS, and Galileo, enabling comprehensive navigation system compatibility. The solution involves independent search engines for rapid satellite signal acquisition and processing, enhancing the overall efficacy of the navigation systems. Additionally, it accommodates various frequency bands and provides platform-independent signal processing capabilities, making it a versatile option for developers. The solution is designed to provide optimum performance with its sophisticated navigation engine. It supports a broad spectrum of satellite frequency bands, ensuring a wide range of compatibility. This feature is pivotal for applications requiring precise geolocation capabilities, providing developers with a reliable and efficient platform to build upon. Its integration into SoCs simplifies development, allowing for seamless incorporation into existing systems. Further enriching its offering are features like a high update rate and a platform-independent API, ensuring that it meets the technical demands of modern applications. This API facilitates easy integration into various software platforms, ensuring that as navigation needs evolve, the system remains adaptable. Additionally, the focus on ensuring a high level of flexibility in design and functionality makes this solution particularly appealing for developers aiming to develop robust, innovative GNSS-enabled systems.
The VibroSense AI Chip is a cutting-edge solution designed for vibration analysis in Industrial IoT applications. It is based on the Neuromorphic Analog Signal Processor, which preprocesses raw sensor data, significantly reducing the amount of data to be stored and transmitted. This chip is particularly beneficial in predictive maintenance applications, where it helps in the early detection of potential machinery failures by analyzing vibrations generated by industrial equipment. VibroSense excels in overcoming the traditional challenges linked to data processing for condition monitoring systems. By performing data preprocessing at the sensor level, it minimizes data volumes by a thousand times or more, making it feasible to conduct condition monitoring over narrow-bandwidth communications and at lower operational costs. This ensures industrial operations can identify issues like bearing wear or imbalance effectively, ultimately extending equipment life and improving safety. The implementation of VibroSense's neural network architecture enables it to handle complex vibration signals with high accuracy. It supports energy-efficient designs, providing a compelling solution for industries aiming to optimize maintenance operations without increasing their OPEX. Its ease of integration with standard sensor nodes and support for energy harvesting applications further enhances its market appeal.
The Xinglian-700 expands on its predecessor by offering high-scalability and performance qualities tailored for demanding multi-core and SoC architectures. As a sophisticated interconnect fabric, it is engineered to deliver exceptional throughput and low latency, crucial for maintaining effective data communication between cores. This advanced fabric supports high-performance computing environments where rapid data transfer and processing are critical. Its architecture is adept at enhancing the scalability and reliability of network-on-chip (NoC) designs, positioning it well for industries that demand resilient and dynamically adaptable infrastructural solutions. By providing a stable backbone for complex systems, the Xinglian-700 ensures that the architecture can handle the pressures of data-intensive applications. This makes it an integral part in developing future-ready technologies, driving innovation in fields such as telecommunications, autonomous vehicles, and beyond.
Menta’s eFPGA IP cores represent the frontier of integrated programmable logic technology. These cores are designed with a third-party standard-cell foundation, ensuring seamless compatibility across any production node and technology. This innovative platform transforms traditional design approaches by integrating FPGA functionality directly within ASICs, providing enhanced customization and reconfigurability. This makes Menta's eFPGA ideal for edge chips that demand adaptability, security, and optimized performance. The eFPGA technology is engineered to afford significant power savings, crucial for applications constrained by power usage, like mobile and IoT devices. They reduce the interconnect overhead and dispense with the need for off-chip communication, maximizing energy efficiency. Furthermore, Menta’s design enables the embedding of adaptable security features within the digital circuitry, reinforcing encryption, authentication, and secure boot capabilities. Offering exceptional scalability, the eFPGA allows for dynamic scaling of logical resources for evolving design requirements. Whether enhancing logic elements, memory, or signal processing capacity, Menta’s eFPGA solutions ensure engineers can cater to their application's precise needs without reconstructing their designs, thus speeding up the time-to-market.
Marquee Semiconductor is adept at designing Network-on-Chip (NoC) based subsystems that skillfully interlink various chip components, enhancing both coherent and non-coherent network designs. By leveraging sophisticated integration techniques, they expertly combine these features into scalable chiplet architectures. This approach not only boosts performance but also facilitates the creation of flexible solutions tailor-made for intricate chip designs. The company employs advanced methodologies to ensure their NoC systems function efficiently, maximizing data throughput while minimizing latency. This finesse in designing NoC ecosystems provides clients with highly reliable and adaptable semiconductor solutions. Furthermore, these platforms are optimized to support a broad spectrum of applications, extending their utility across different technological domains. Marquee Semiconductor's commitment to innovation is evident in their capacity to foresee and address potential design challenges, making them a reliable partner for cutting-edge semiconductor projects. The company continues to lead the charge in developing integrated systems that push the boundaries of current technology landscapes, ensuring seamless operations and meeting high industry standards.
NC-NoC offers a smart, configurable Network-on-Chip (NoC) solution that is engineered for non-coherent data communication. This advanced technology features a layered, scalable architecture, equipped to support numerous protocols including AXI4/3, AHB, APB, and AXI-lite. With support for varied bus widths ranging from 32 to 2048 bits, it effectively handles a multitude of design requirements. Physically-aware and equipped with multiple clocking schemes, NC-NoC is ideal for sophisticated SoCs requiring substantial customization and scalability without the need for data coherency. Its design enables efficient packet-based communication, enhancing the system's overall performance by reducing latency and ensuring reliable data transfer. This NoC architecture is particularly beneficial for applications where multiple concurrent processes must be managed with precision. Overall, NC-NoC is crafted to facilitate developers in overcoming complexity through an intuitive yet robust architecture that caters to high-performance needs. By focusing on configurability and scalability, it allows designers to optimize their systems for specific use cases, ultimately driving enhanced efficiency in data processing and power management.
The iNoCulator is an innovative all-in-one solution designed to facilitate rapid and flexible creation and exploration of Network-on-Chips (NoCs). Starting from conceptualization, it takes users through to system architecture, RTL simulation, emulation, and final implementation. The platform's unique toolset allows for effortless adjustments to NoC topologies and configurations, enabling users to swiftly iterate design variations in a fully integrated EDA environment. This flexibility and speed are critical in reducing time-to-market and enhancing design quality, particularly for high-performance and complex SoC applications. By leveraging advanced end-to-end design tools, the iNoCulator promotes a streamlined workflow, allowing for real-time simulation and optimization. Its capabilities include top-level RTL code generation, intuitive editing interfaces, and fostering seamless integration with existing EDA systems. This ensures that users can promptly evaluate performance metrics such as latency, throughput, and power consumption across different NoC configurations. Additionally, the iNoCulator stands out for its user-centric approach that prioritizes configurability without compromising on the scalability needed for advanced SoC designs. With comprehensive support throughout the design process, it equips developers with unparalleled design flexibility and deep insight into their NoC architecture, ultimately fostering innovation and efficiency.
The 40G MAC/PCS ULL enhances data transfer capabilities with 40G Ethernet support, offering extraordinarily low latency for high-demand trading environments. Ideal for expansive data networks, this IP ensures efficient data processing over FPGA architectures, reducing bottlenecks and enhancing throughput. It suits trading applications that prioritize speed and precision, integrating seamlessly within existing systems to maintain optimal network performance.
C-NoC represents an intelligent advancement in coherent Network-on-Chip (NoC) solutions, targeted at delivering low-latency and high-efficiency data communication within complex SoCs. Its availability starts in the second half of 2023 and is marked by support for mesh, grid, and torus topologies, thus providing exceptional flexibility for complex system configurations. This coherent NoC integrates on-chip L3 cache support to minimize latency and to streamline data handling across the network. It is compatible with multiple protocols like CHI, AXI4/3, and the ACE family, alongside variable bus width configurations from 32 to 2048 bits. The C-NoC is central to achieving balanced data flow and handling multiple communication streams simultaneously, which is vital for systems that necessitate high-bandwidth and smooth data integration. The C-NoC's ability to adjust coherency levels and use efficient topological structures paves the way for optimized data processing operations, making it a preferred choice for high-performance computing scenarios. This ensures not only improved communication efficiency but also enhances the processing capability across processor cores, crucial for elevating overall system performance.
The 10G MAC/PCS ULL is designed to provide ultra-low latency data transmission over FPGA platforms. This IP is particularly suited for environments where rapid data exchange is critical. It leverages robust technology to ensure minimal delay in data packet processing, making it ideal for high-frequency trading applications that require consistent performance. The integration of this IP allows for seamless communication over 10G Ethernet, optimizing network utilization and connectivity.
5G technology heralds a new era in mobile connectivity by significantly enhancing wireless data capacity and opening new possibilities in smart applications like autonomous vehicles and remote surgery. Faststream Technologies approaches the evolution from 4G to 5G with robust innovations in base stations, core networks, and RAN management systems. They strategically invest in key 5G technologies, differentiating their offerings and ensuring their position in the fast-evolving 5G ecosystem. Open RAN principles allow mobile networks to break free from traditional vendor dependencies, promoting a competitive landscape that fosters innovation and cost reduction through interoperability of hardware and software. The core component of a 5G network is its macrocell, a critical RAN ingredient that supports cellular network radio coverage. Utilizing Multiple Input, Multiple Output (MIMO) technology, 5G macrocells provide extensive radio signal transmission and reception capabilities, connecting billions of devices with minimal latency. This allows for broad data capacity and reduced network costs. Faststream's 5G base station solutions also involve intricate orchestration between central (CU) and distributed units (DU), leveraging FPGAs, network synchronization ICs, and precision oscillators. Such architecture not only meets the complex power and bandwidth requirements of modern telecom infrastructures but also addresses future needs with expandable capabilities for new applications.
Gazzillion Misses™ is a unique technology developed by Semidynamics designed to overcome latency issues in memory-intensive applications. Embedded within the company's RISC-V processor cores, this technology allows multiple outstanding memory requests simultaneously, bypassing traditional pipeline stalls caused by cache misses. This enables processors to continue executing instructions rather than waiting for data retrieval, significantly reducing idle cycles. By handling up to 128 simultaneous requests, Gazzillion Misses™ significantly boosts system performance and is highly beneficial in big data, HPC, and AI environments where bandwidth is critical. This technology effectively increases memory throughput, making it ideal for applications with extensive data stream requirements, such as machine learning models and complex algorithms in data centers. Moreover, its implementation allows for more straightforward software development processes, easing complexity by providing an efficient framework to sustain high memory bandwidth. It ensures that the processor's compute capabilities are fully utilized, enhancing overall system response and efficiency. This makes Gazzillion Misses™ a keystone in modern architecture for high-performance computing solutions.
The IMG B-Series GPU exemplifies the pinnacle of multi-core graphics technology, designed to deliver scalable performance across a wide array of applications, from automotive to cloud computing. With over twenty configurations available, it provides flexibility for integrating multi-GPU core setups, enhancing both graphical and computational throughput for a variety of demanding scenarios. Aimed at offering maximum performance, this GPU series supports intensive graphical effects like volumetric lighting and advanced physical shading systems. Its architecture is also conducive to safety-critical applications in automotive markets, where it ensures compliance with ISO 26262 standards, making it a reliable choice for high-quality, functionally safe graphics. The B-Series is engineered for high efficiency and supports integration in cloud-based systems, where its robust multi-core configurations and superior power management significantly optimize operational costs while ensuring peak performance. Its deployment in consumer electronics also highlights its versatility, adapting flexibly to various compute and display demands while maintaining optimal energy usage.
The NoC Crossbar Silicon IP by Truechip offers a robust solution for enhancing the communication fabric of a system on chip (SoC) through a crossbar architecture. This IP is designed to support a variety of connected master and slave nodes, ensuring efficient data routing across the network. It effortlessly handles multiple data streams and different protocol requirements at each port, thanks to its flexible configuration options. The crossbar IP features programmable registers, which help dynamically adjust operation to meet varying data loads and processing requirements. Integration into SOC environments is streamlined through a highly customizable framework that accommodates diverse communication standards and protocols. This makes it particularly suited for scenarios requiring intricate data path management and intricate synchronization between different system components. Advanced features such as port prioritization and physical address conversion enhance network communication efficiency, supporting high-speed data transfer while maintaining data integrity. The inclusion of comprehensive debug features and scenarios allows thorough testing and validation to ensure seamless operation under different conditions and workloads. Overall, Truechip's NoC Crossbar IP boosts system performance with its optimized routing and communication capabilities within SoC environments.
Channel Sounding is Packetcraft's pioneering technology in the domain of precise Bluetooth distance measurement. This innovative approach allows for high-accuracy distance and location determination, serving a multitude of applications that demand pinpoint spatial awareness. Key to its function is a sophisticated measurement technique that exploits Bluetooth signal properties to derive accurate positioning data. The technology's utility extends across various uses, from automotive systems requiring detailed spatial data to consumer electronics that need dependable indoor navigation capabilities. Packetcraft’s Channel Sounding solutions have been demonstrated in live test environments, showcasing their efficacy on international stages, such as automotive events in China. These applications highlight the robustness of Channel Sounding in real-world conditions. Packetcraft ensures that this advanced technology remains at the forefront of emerging innovations in Bluetooth connectivity by offering comprehensive support and a well-documented integration process. This allows developers to seamlessly incorporate Channel Sounding into their systems, ensuring precise spatial data collection and enhancing the performance of spatially aware applications.
Truechip’s NoC Mesh Silicon IP is engineered to enhance system-on-chip (SoC) communication by implementing a mesh network architecture. This IP facilitates efficient data management and transfer across multiple network nodes, supporting extensive scalability for complex SoC designs. By adopting a mesh topology, it offers robust interconnectivity between processors, memory, and peripherals, ensuring optimal performance even as system complexity increases. The mesh architecture provides high bandwidth and low-latency communication pathways, ideal for applications requiring strenuous data traffic management. It efficiently balances loads across nodes, enabling seamless data flow without congestion, thereby optimizing overall network throughput. The mesh network supports various protocol interfaces, enabling versatile integration with diverse SOC components. Equipped with advanced debugging and monitoring tools, Truechip's NoC Mesh Silicon IP ensures reliability and predictability in system operations. Its configurability allows engineers to customize routes and manage power efficiency dynamically, adapting to performance needs and ensuring energy saving. This IP is indispensable for demanding applications that require high levels of reliability, scalability, and performance in their interconnect solutions.
The NoC Coherent Crossbar Silicon IP from Truechip provides a sophisticated solution for interconnectivity within a System on Chip (SoC) through a coherent crossbar architecture. Designed for efficiency and flexibility, this IP supports coherent communication pathways by maintaining data consistency across various processing units, an essential feature for multi-core systems. Incorporating advanced coherence management functionalities, the crossbar IP ensures that data operations remain consistent across the different nodes, reducing latency and improving throughput. This is crucial for systems that perform complex computations and require stringent data synchronization and communication between processors. The crossbar design streamlines integration in SoCs while offering robust support for different protocol standards. Truechip's solution is equipped with debugging and monitoring features, aiding in the rapid identification and correction of system issues. The ability to prioritize ports and seamlessly convert physical addresses enhances processing performance by optimizing data traffic flow. With a focus on ensuring data integrity and lowering operational costs, this IP is tailored for high-performance multi-core systems demanding tight data coherence and reliability.
The 32G UCIe PHY from GUC supports the UCIe 2.0 specification, achieving top speeds of 32Gbps per lane with high bandwidth density. Designed for advanced applications in AI, HPC, and complex networking environments, it utilizes TSMC's N3P process and CoWoS technology to interconnect multiple dies in a unified package. It features advanced monitoring and self-healing capabilities to ensure continuous, optimum performance. The IP supports dynamic voltage and frequency scaling and advanced preventive monitoring, enhancing system reliability.
IM Twin offers capabilities for developing twin solutions in communication technologies. It provides essential functionalities that allow systems to mirror or replicate performance across multiple platforms, ensuring enhanced data integrity and synchronization. These solutions are vital in fields requiring robust data transfer and management.
FlexGen Smart Network-on-Chip (NoC) by Arteris offers an innovative approach for crafting Network-on-Chip designs through AI and machine learning enhancements. This NoC IP allows design iterations to proceed up to ten times faster than traditional methodologies, primarily by automating the complex task of topology generation. By adopting FlexGen, developers can significantly reduce wire lengths and enhance power efficiency, thereby minimizing the typical manual effort involved in such processes. FlexGen caters to applications in sectors like automotive, data centers, and industrial electronics by streamlining design cycles for quicker launches and more exploratory design ventures. Optimizing productivity with a substantial tenfold increase in speed, FlexGen is specifically engineered to address intricate design needs, condensing SoC or chiplet iteration times from several weeks to a mere few days. It achieves expert-level results by reducing routing congestion and improving both silicon area and throughput during physical synthesis. This is complemented by its capability to optimize wirelength and overall performance using advanced machine learning algorithms. The core features of this IP include scripting-driven topology creation, incremental design capabilities, and automatic timing closure assistance. These tools equip engineers to manage intricate physical design challenges efficiently, allowing for substantial time savings and enhanced project outcomes. FlexGen’s design automation features enable developers to extract significant performance improvements while expediting the overall SoC design process.
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