Notus provides comprehensive analysis capabilities across signal and power integrity, thermal management, and stress analysis for PCB and package designs. Equipped with electromagnetic technologies, it can offer detailed DC and AC power analyses, optimize decoupling capacitors, and conduct electrothermal simulations. Notus supports examining complex package structures and stacked die solutions, catering to specifications required in modern electronic designs. Its integration-friendly environment and dynamic analysis capabilities confirm Notus as a robust solution for optimizing power delivery systems and improving product reliability in electronic design.
