Eliyan's NuLink Die-to-Die PHY technology represents a significant advancement in chiplet interconnect solutions. Designed for standard packaging, this innovative PHY IP delivers robust high-performance with low power consumption, a balance that is crucial for modern semiconductor designs. The NuLink PHY supports multiple industry standards, including the Universal Chiplet Interface Express (UCIe) and Bunch of Wires (BoW), ensuring it can cater to a wide range of applications.
A standout feature of the NuLink PHY is its simultaneous bidirectional (SBD) signaling capability, which allows data to be sent and received over the same wire at the same time, effectively doubling bandwidth. This makes it an ideal solution for data-intensive applications such as AI training and inference, particularly those requiring ultra-low latency and high reliability. The technology is also adaptable for different substrates, including both silicon and organic, offering designers flexibility in their packaging approaches.
NuLink's architecture stems from extensive industry insights and is informed by Eliyan’s commitment to innovation. The platform provides a power-efficient and cost-effective alternative to traditional advanced packaging solutions. It achieves interposer-like performance metrics without the complexity and cost associated with such methods, enabling operational efficiency and reduced time-to-market for new semiconductor products.
