Eliyan's NuLink Die-to-Die PHY for standard packaging is a technological innovation designed to enhance chiplet interconnectivity within conventional package forms. Tailored to seamlessly integrate with both silicon bridges and organic package substrates, this product eliminates the need for advanced packaging solutions while matching their performance characteristics. By achieving the same remarkable levels of data transfer efficiency and power optimization typically associated with advanced methods, NuLink technology stands out as a cost-effective solution for multi-die integration.
Targeted for ASIC designs, the NuLink Die-to-Die PHY is capable of supporting a wide array of industry standards including UCIe and BoW. Its design enables the connection of chiplets in standard packaging without requiring large silicon interposers, ensuring both significant performance gains and cost savings. This flexibility makes it particularly appealing for systems that require mixing and matching of chiplets of varying dimensions.
In practical applications, Eliyan’s solution facilitates increased placement flexibility and supports configurations that demand physical separation of components, such as those between hot ASICs and heat-sensitive dies. By leveraging a standard packaging approach, this PHY product provides substantial improvements in thermal management, cost efficiency, and production timelines compared to traditional methods.
