Eliyan's NuLink Die-to-Memory PHY technology stands as a testament to the company's innovative approach toward enhancing semiconductor performance without resorting to advanced packaging. This IP solution offers low-power, high-performance connectivity capabilities for die-to-memory interconnects, utilizing the same foundational NuLink technology adapted for unique applications. Unlike traditional unidirectional designs, this PHY provides a more fluid data transfer, supporting a diverse range of industry standards while maintaining efficiency and adaptability.
The NuLink Die-to-Memory PHY product allows integrations on both standard and advanced packaging, delivering exceptional performance metrics. In contrast to established methods that often necessitate complex silicon interposers, Eliyan’s solution is able to provide equivalent, if not superior, results using standard packaging techniques. Its structure is geared towards minimizing power consumption and maximizing data throughput, thus enabling the realization of more powerful and efficient semiconductors.
This technology is particularly beneficial for applications requiring dynamic interfacing between dies and memory, making it viable for a multitude of cutting-edge electronic devices. By offering scalable and effective solutions, Eliyan facilitates advancements in both traditional memory coupling and emerging semiconductor technologies.
