The NuLink Die-to-Memory PHY products offer a revolutionary approach to memory interface design, utilized in cutting-edge semiconductor applications. These products bring together low-power consumption and high-performance metrics, crucial for managing increasingly complex memory requirements. The dynamic architecture allows NuLink to handle both high-density and high-bandwidth memory configurations, promoting versatility in design aspects.
NuLink's D2M technology supports bidirectional transceivers, capable of swiftly switching between transmitting and receiving modes, optimizing bandwidth without the necessity for separate read/write lanes. This feature significantly enhances data throughput, ensuring efficient memory access for applications like high-bandwidth memory (HBM) interfaces on standard organic substrates.
One of the key advancements of NuLink is its capacity to deliver substantial bandwidth improvements while reducing costs associated with traditional memory PHY designs. The integration of the Universal Memory Interface (UMI) concept is testimony to its innovation, allowing seamless connectivity for various DRAM technologies, thereby simplifying the design process and enabling broad system compatibility.
