All IPs > Interface Controller & PHY > AMBA AHB / APB/ AXI
AMBA, which stands for Advanced Microcontroller Bus Architecture, is a far-reaching and well-established open-standard, on-chip interconnect specification used widely in the design and structuring of system-on-chip (SoC) technologies. Among the most popular protocols under this architecture are AHB (Advanced High-performance Bus), APB (Advanced Peripheral Bus), and AXI (Advanced eXtensible Interface). These protocols facilitate effective communication between various components of a digital system, ensuring optimal performance and scalability.
**AHB, APB, and AXI Semiconductor IPs**
*AMBA AHB* is specifically designed for high-performance and high-bandwidth requirements. It's a parallel bus interface that is commonly employed for connecting processors and other high-speed components in a SoC. AHB IPs ensure that data is transferred efficiently across the components, making them ideal for applications where speed and reliability are crucial.
*AMBA APB* is tailored for low power and less complex communication needs. It is often used for interfacing with peripheral devices that do not require high throughput, such as UARTs or low-speed memory controllers. APB semiconductor IPs are valued for their simplicity and low power consumption, often being the choice for battery-operated or portable devices.
*AMBA AXI* is characterized by its advanced features, supporting high data bandwidth and flexible configurations. AXI IPs are used where the highest performance is needed, leveraging features like burst transactions, multiple outstanding addresses, and out-of-order transaction completion, making it suitable for complex and demanding tasks.
Integrating these semiconductor IPs into your system ensures that you leverage their specialized features for increased efficiency and performance. In products that require robust, flexible, and scalable communication channels, AMBA interface controllers and PHYs provide the backbone necessary to build systems that can meet current and future demands.
Sunplus's LVDS IP addresses the need for high-speed data transmission over short distances in applications like displays and video interfaces. This Low Voltage Differential Signaling (LVDS) technology underpins multiple high-quality digital systems, providing a pathway for clean, reliable signal transfer even at high frequencies. The LVDS IP from Sunplus delivers exceptional signal integrity, which is crucial in minimizing electromagnetic interference (EMI) and reducing radiation issues. It is designed for seamless data communication across versatile applications including flat-panel displays, projectors, and broadcast equipment. Crafted to support varying deployment environments, this IP offers robust performance with reduced power consumption, making it ideal for portable and battery-operated devices. Its adaptability and reliability ensure that it supports devices across multiple market segments, from consumer electronics to advanced industrial applications.
Axelera AI's Metis AIPU PCIe AI Accelerator Card is designed to tackle demanding vision applications with its powerful processing capabilities. The card embeds a single Metis AIPU which can deliver up to 214 TOPS, providing the necessary throughput for concurrent processing of high-definition video streams and complex AI inference tasks. This PCIe card is supported by the Voyager SDK, which enhances the user experience by allowing easy integration into existing systems for efficient deployment of AI inference networks. It suits developers and integrators looking for an upgrade to existing infrastructure without extensive modifications, optimizing performance and accelerating AI model deployment. The card’s design prioritizes performance and efficiency, making it suitable for diverse applications across industries like security, transportation, and smart city environments. Its capacity to deliver high frames per second on popular AI models ensures it meets modern digital processing demands with reliability and precision.
Silicon Creations' SerDes Interfaces are crafted to handle high-speed data transmission challenges over varied processes, ranging from 12nm to 180nm. Addressing multiple protocols such as CPRI, PCIe, and SATA, these interfaces demonstrate flexibility by supporting data transmission speeds from 100 Mbps to beyond 32 Gbps. The architecture incorporates a host of advanced features including adaptive equalization techniques and programmable de-serialization widths, making it stand out in terms of performance and signal integrity even under challenging conditions. With ultra-low latency PMAs, they sustain excellent operational speed and efficiency, imperative for sophisticated communication applications. Moreover, Silicon Creations partners with leading entities to provide comprehensive solutions, including complete PCIe PHY integrations. This synergy ensures that SerDes Interfaces are fully optimized for operational excellence, delivering stable and reliable communication signals. With an emphasis on low power and minimized area requirements, they cater to burgeoning industry needs for power-efficient and space-conservative designs.
Advanced Peripheral Bus (APB) is one of the Advanced Microcontroller Bus Architecture (AMBA) family protocols. It is a low-cost interface that is designed for low power consumption and interface simplicity. Unlike AHB, it is a non-pipelined protocol for connecting low-bandwidth peripherals. Mostly used to link external peripherals to the SOC. Every APB transfer requires at least two clock cycles (SETUP Cycle and ACCESS Cycle) to finish. The APB interface is designed for accessing the programmable control registers of peripheral devices. The APB protocol has two independent data buses, one for read data and one for write data. The buses can be 8, 16, or 32 bits wide. The read and write data buses must have the same width. Data transfers cannot occur concurrently because the read data and write data buses do not have their own individual handshake signals.
Panmnesia's CXL 3.1 Switch is an integral component designed to facilitate high-speed, low-latency data transfers across multiple connected devices. It is architected to manage resource allocation seamlessly in AI and high-performance computing environments, supporting broad bandwidth, robust data throughput, and efficient power consumption, creating a cohesive foundation for scalable AI infrastructures. Its integration with advanced protocols ensures high system compatibility.
The Metis AIPU M.2 Accelerator Module from Axelera AI is engineered for applications requiring edge AI computing power in a compact form factor. Leveraging the quad-core Metis AIPU, this module provides efficient AI processing capabilities tailored for real-time analysis and data-intensive tasks in areas like computer vision. Designed to fit into standard NGFF (Next Generation Form Factor) M.2 sockets, it supports a wide range of AI models with dedicated 1GB DRAM memory for optimized performance. This module is especially suitable for systems needing enhanced image and video processing capabilities while maintaining minimal power consumption. The Metis AIPU M.2 Accelerator Module enhances computing architectures by enabling seamless integration of AI for a multitude of industrial and commercial applications. Its efficient design makes it ideal for environments where space is limited, but computational demand is high, ensuring that solutions are both powerful and cost-effective.
The Yitian 710 Processor is T-Head's flagship ARM-based server chip that represents the pinnacle of their technological expertise. Designed with a pioneering architecture, it is crafted for high efficiency and superior performance metrics. This processor is built using a 2.5D packaging method, integrating two dies and boasting a substantial 60 billion transistors. The core of the Yitian 710 consists of 128 high-performance Armv9 CPU cores, each accompanied by advanced memory configurations that streamline instruction and data caching processes. Each CPU integrates 64KB of L1 instruction cache, 64KB of L1 data cache, and 1MB of L2 cache, supplemented by a robust 128MB system-level cache on the chip. To support expansive data operations, the processor is equipped with an 8-channel DDR5 memory system, enabling peak memory bandwidth of up to 281GB/s. Its I/O subsystem is formidable, featuring 96 PCIe 5.0 channels capable of achieving dual-direction bandwidth up to 768GB/s. With its multi-layered design, the Yitian 710 Processor is positioned as a leading solution for cloud services, data analytics, and AI operations.
The bus converter module transforms wide initiator data buses to smaller target data buses or vice-versa. A narrow target on a wide bus, only requires external logic and no internal design changes. * APB: 32-bit wide initiator data buses to 16-bit target data buses. * AHB: 64-bit wide initiator data buses to 32-bit target data buses. * AXI: 256-bit wide initiator data buses to 64-bit target data buses A wide target on a narrow bus, only requires external logic and no internal design changes. * APB: 16-bit wide initiator data buses to 32-bit target data buses. * AHB: 32-bit wide initiator data buses to 64-bit target data buses. * AXI: 64-bit wide initiator data buses to 256-bit target data buses.
The Aries fgOTN processor family is engineered according to the ITU-T G.709.20 fgOTN standard. This line of processors handles a variety of signals, including E1/T1, FE/GE, and STM1/STM4, effectively monitoring and managing alarms and performance metrics. Aries processors excel at fine-grain traffic aggregation, efficiently channeling fgODUflex traffic across OTN lines to support Ethernet, SDH, PDH client services. Their capacity to map signals to fgODUflex containers, which are then multiplexed into higher order OTN signals, demonstrates their versatility and efficiency. By allowing cascaded configurations with other Aries devices or Apodis processors, Aries products optimize traffic routes through OTN infrastructures, positioning them as essential components in optical networking and next-generation access scenarios.
The AHB-Lite APB4 Bridge from Roa Logic is a versatile interconnect bridge designed to facilitate communication between the AMBA 3 AHB-Lite and AMBA APB bus protocols. As a parameterized soft IP, it offers flexibility in adapting to different system requirements, ensuring smooth data transfer between high-performance and low-performance buses. This bridge is crucial for systems that integrate diverse peripherals requiring seamless interaction across varying bus standards. Its design prioritizes efficiency and performance, minimizing latency and maximizing data throughput. The AHB-Lite APB4 Bridge supports extensive customization options to meet specific design criteria, making it suitable for a wide range of applications across different industries. By serving as a conduit between different bus protocols, it plays a central role in maintaining system cohesiveness and reliability. Roa Logic enhances the bridge's usability through detailed technical documentation and supportive testbenches, easing its integration into existing frameworks. Developers can readily incorporate the bridge into their designs, optimizing inter-bus communication and ensuring that system performance remains uncompromised. This bridge exemplifies Roa Logic's dedication to providing robust, adaptable IP solutions for contemporary digital environments.
AMBA AHB is a bus interface designed for high-performance synthesizable applications. It specifies the interface between components such as initiator , interconnects, and targets. AMBA AHB incorporates the features needed for high-performance, high clock frequency systems. The most common AHB targets are internal memory devices, external memory interfaces, and high-bandwidth peripherals.
The Advanced eXtensible Interface(AXI) bus is a high-performance parallel bus that connects on-chip peripheral circuits (or IP blocks) to processor cores. The AXI bus employs "channels" to divide read and write transactions into semi-independent activities that can run at their own pace. The Read Address and Read Data channels send data from the target to the initiator, whereas the Write Address, Write Data, and Write Response channels transfer data from the initiator to the target.
The NuLink Die-to-Die PHY for Standard Packaging represents Eliyan's cornerstone technology, engineered to harness the power of standard packaging for die-to-die interconnects. This technology circumvents the limitations of advanced packaging by providing superior performance and power efficiencies traditionally associated only with high-end solutions. Designed to support multiple standards, such as UCIe and BoW, the NuLink D2D PHY is an ideal solution for applications requiring high bandwidth and low latency without the cost and complexity of silicon interposers or silicon bridges. In practical terms, the NuLink D2D PHY enables chiplets to achieve unprecedented bandwidth and power efficiency, allowing for increased flexibility in chiplet configurations. It supports a diverse range of substrates, providing advantages in thermal management, production cycle, and cost-effectiveness. The technology's ability to split a Network on Chip (NoC) across multiple chiplets, while maintaining performance integrity, makes it invaluable in ASIC designs. Eliyan's NuLink D2D PHY is particularly beneficial for systems requiring physical separation between high-performance ASICs and heat-sensitive components. By delivering interposer-like bandwidth and power in standard organic or laminate packages, this product ensures optimal system performance across varied applications, including those in AI, data processing, and high-speed computing.
Intilop's 10G TCP Offload Engine (TOE) offers an advanced solution integrating MAC, PCIe, and Host Interface to deliver ultra-low latency network performance. This solution is crafted for environments requiring high-speed data transmission and minimal delays, ensuring a robust system for demanding networking tasks. With its capability for full TCP stack implementation, the TOE handles up to 16,000 concurrent sessions, operating with remarkably low latency and without the need for additional CPU processing.\n\nThe engine's design incorporates key features like zero jitter, dual 10G ports, and extensive offloading capabilities including checksum offload and large send offload. It supports multiple DMA engines, ensuring high throughput across varied network conditions. The architecture is highly adaptable, offering both hardware and software customization options to suit specific customer requirements, leveraging Intilop's expertise in FPGA and SoC design.\n\nThis IP is deployed globally, supporting configurations in cloud computing, data centers, and high-performance computing environments. Its ability to offload significant networking tasks from the CPU allows enterprises to maximize application performance while minimizing power consumption and system costs, delivering a comprehensive network acceleration solution. The product is part of Intilop's extensive portfolio, designed to enhance network throughput and efficiency while significantly reducing processing overhead.
RaiderChip's GenAI v1 is a pioneering hardware-based generative AI accelerator, designed to perform local inference at the Edge. This technology integrates optimally with on-premises servers and embedded devices, offering substantial benefits in privacy, performance, and energy efficiency over traditional hybrid AI solutions. The design of the GenAI v1 NPU streamlines the process of executing large language models by embedding them directly onto the hardware, eliminating the need for external components like CPUs or internet connections. With its ability to support complex models such as the Llama 3.2 with 4-bit quantization on LPDDR4 memory, the GenAI v1 achieves unprecedented efficiency in AI token processing, coupled with energy savings and reduced latency. What sets GenAI v1 apart is its scalability and cost-effectiveness, significantly outperforming competitive solutions such as Intel Gaudi 2, Nvidia's cloud GPUs, and Google's cloud TPUs in terms of memory efficiency. This solution maximizes the number of tokens generated per unit of memory bandwidth, thus addressing one of the primary limitations in generative AI workflow. Furthermore, the adept memory usage of GenAI v1 reduces the dependency on costly memory types like HBM, opening the door to more affordable alternatives without diminishing processing capabilities. With a target-agnostic approach, RaiderChip ensures the GenAI v1 can be adapted to various FPGAs and ASICs, offering configuration flexibility that allows users to balance performance with hardware costs. Its compatibility with a wide range of transformers-based models, including proprietary modifications, ensures GenAI v1's robust placement across sectors requiring high-speed processing, like finance, medical diagnostics, and autonomous systems. RaiderChip's innovation with GenAI v1 focuses on supporting both vanilla and quantized AI models, ensuring high computation speeds necessary for real-time applications without compromising accuracy. This capability underpins their strategic vision of enabling versatile and sustainable AI solutions across industries. By prioritizing integration ease and operational independence, RaiderChip provides a tangible edge in applying generative AI effectively and widely.
EXOSTIV is an innovative solution designed to provide extensive visibility into FPGA internals, particularly during SoC validation and FPGA debugging processes. By offering massive capture capabilities, it addresses the challenges associated with traditional simulation-only approaches, enabling engineers to conduct at-speed analysis directly on the prototyping boards. One of the significant benefits of EXOSTIV is its ability to operate at high data rates, allowing for capturing detailed data necessary for complex design validation. This capability leads to considerable cost reduction by preventing FPGA bugs from persisting into production. The EXOSTIV system includes robust connectivity options, adaptable to various board layouts, ensuring effective monitoring across different system designs. The suite integrates Exostiv Probes, which range in capabilities to fit diverse debugging needs. These probes facilitate data capture and analysis with advanced connectivity options, making them essential for engineers focused on optimizing FPGA design workflows. EXOSTIV’s user-friendly software environment further enhances its utility, providing intuitive interfaces for streamlined integration into the development process.
Silicon Library's USB PHY solutions are designed to support high-speed, efficient data transfer across consumer electronics, personal computers, and other digital devices. These PHYs are particularly optimized for the USB 2.0 interface, which is widely adopted in various technological environments. The USB PHYs from Silicon Library ensure reliable communication by adhering to industry standards and incorporating advanced signal processing technologies. The architecture of these USB PHYs is streamlined to facilitate easy integration with various chipsets while maintaining performance and energy efficiency. They offer robust support for standard USB operations, ensuring that devices can communicate effortlessly with one another. Furthermore, these PHYs are built to handle a wide range of operating conditions, making them a versatile choice for manufacturers worldwide. Designed with precise electrical and timing specifications, the USB PHY solutions help in reducing latency and improving the overall data throughput, significantly enhancing the end-user's experience. They are crafted to minimize power consumption while maximizing data rates, which is crucial for modern digital applications where power efficiency is as important as performance.
The Multi-Protocol SERDES offered by Pico Semiconductor is a versatile solution capable of handling a variety of communication protocols. This series of SERDES includes a 4-channel configuration that supports data rates up to 32Gbps, designed for integration with XAUI, RXAUI, and SGMII. It is compatible with multiple process nodes provided by foundries like TSMC and GF, offering robust performance across different semiconductor environments. These SERDES are crafted to meet high-performance metrics, capturing speeds up to 16Gbps and 6.5Gbps across various models, with advanced versions reaching up to 32Gbps. This exceptional range not only ensures compatibility with current technologies but also prepares systems for future updates, sustaining high data throughput. By delivering reliable high-speed data transmission capabilities, the Multi-Protocol SERDES from Pico Semiconductor is integral for networking, high-speed computing, and data storage applications, where efficient and speedy data transfer is paramount.
iWave Global introduces the ARINC 818 Switch, a pivotal component in the management and routing of video data within avionics systems. Designed for applications that require efficient video data distribution and management, the switch is optimized for performance in environments with stringent data handling requirements. The switch's architecture supports a high level of bandwidth, allowing for the smooth routing of multiple video streams in real-time. Its design includes advanced features that ensure low-latency, error-free data transfer, integral to maintaining the integrity and reliability of video data in critical applications. Featuring robust interoperability characteristics, the ARINC 818 Switch easily integrates into existing systems, facilitating modular expansion and adaptability to new technological standards. It is indispensable for any aerospace project that involves complex video data management, providing a stable platform for video data routing and switching.
The AHB-Lite Multilayer Switch developed by Roa Logic is engineered to provide a high-performance, low-latency interconnect solution for systems using the AHB-Lite bus protocol. This IP is designed to support an unlimited number of bus masters and slaves, ensuring scalability and flexibility in complex system architectures. By enabling efficient data routing, the switch enhances throughput and overall system performance, making it indispensable in data-intensive applications. Capable of handling multiple data paths simultaneously, the multilayer switch ensures that there are no bottlenecks in data flow, facilitating real-time data processing and communication. Its design features are tailored to optimize latency and throughput, effectively addressing the challenges encountered in high-demand environments. Roa Logic provides a comprehensive suite of resources, including thorough documentation and testbench environments, to simplify the integration of this switch into larger system designs. This support ensures that developers can achieve optimal performance with ease, utilizing the switch's capabilities to enhance system interconnectivity and efficiency significantly. The AHB-Lite Multilayer Switch exemplifies the commitment of Roa Logic to provide innovative, responsive solutions that cater to the evolving needs of the semiconductor industry.
eSi-Connect offers an extensive suite of AMBA-compliant peripheral IPs designed to streamline SoC integration. This suite encompasses versatile memory controllers, standard off-chip interface support, and essential control functions. Its configurability and compatibility with low-level software drivers make it suitable for real-time deployment in complex system architectures, promoting reliable connectivity across various applications.
As a memory-side interface for advanced DRAM applications, this LPDDR4/4X/5 Slave PHY enables effective data interaction for AI processing units and other ASICs. Designed to adhere to the JEDEC standards, this PHY ensures high bandwidth and reduced latency in data transmission. Its architecture is compatible with TSMC's 7nm technology yet also supports customization across various logic processes, making it flexible for numerous high-speed memory interfacing scenarios.
The Chimera GPNPU from Quadric stands as a versatile processing unit designed to accelerate machine learning models across a wide range of applications. Uniquely integrating the strengths of neural processing units and digital signal processors, the Chimera GPNPU simplifies heterogeneous workloads by running traditional C++ code and complex AI networks such as large language models and vision transformers in a unified processor architecture. This scalability, tailored from 1 to 864 TOPs, allows it to meet the diverse requirements of markets, including automotive and network edge computing.\n\nA key feature of the Chimera GPNPU is its ability to handle matrix and vector operations alongside scalar control code within a single pipeline. Its fully software-driven nature enables developers to fine-tune model performance over the processor's lifecycle, adapting to evolving AI techniques without needing hardware updates. The system's design minimizes off-chip memory access, thereby enhancing efficiency through its L2 memory management and compiler-driven optimizations.\n\nMoreover, the Chimera GPNPU provides an extensive instruction set, finely tuned for AI inference tasks with intelligent memory management, reducing power consumption and maximizing processing efficiency. Its ability to maintain high performance with deterministic execution across various processes underlines its standing as a leading choice for AI-focused chip design.
The CT25205 digital core serves as a comprehensive solution for implementing the IEEE 802.3cg® 10BASE-T1S Ethernet Physical Layer. Crafted in Verilog 2005 HDL, this synthesizable core adapts elegantly to standard cells and FPGA environments. It incorporates critical components like the PMA, PCS, and PLCA Reconciliation Sublayer, working seamlessly with any Ethernet MAC conforming to the IEEE CSMA/CD standards using the MII interface. A unique feature of CT25205 is its integrated PLCA RS, which enables existing MAC devices to access PLCA functionalities without further hardware modifications. This digital core also features connectivity with a standard OPEN Alliance 10BASE-T1S PMD interface, making it pivotal in enhancing communication for Zonal Gateway SoCs and MCUs that demand advanced 10BASE-T1S capabilities.
The AHB-Lite Timer from Roa Logic is a precision timing module designed to comply with the RISC-V Privileged specification. This timer is engineered to manage time-sensitive operations within systems that utilize the AHB-Lite bus protocol, ensuring accurate timing for a variety of applications. By providing robust timer functionalities, the AHB-Lite Timer assists in overseeing operations where precise timing is crucial, such as coordinating tasks within embedded systems or managing periods in control processes. Its compliance with RISC-V standards ensures that it integrates seamlessly with systems based on this widely adopted open standard, enhancing compatibility and performance. Developers can take advantage of Roa Logic's comprehensive support materials, which include detailed documentation and pre-configured test environments, to facilitate the easy integration of the timer into existing designs. This support infrastructure is indicative of Roa Logic's commitment to simplifying the adoption and effective utilization of its sophisticated IP offerings within diverse system architectures.
Designed for high-speed transmission, the 16x112G Tx Chiplet showcases superior integration with 16 channels, each operating at 112Gbps. It includes a modulator and driver within a single silicon unit, optimized for optical communication systems requiring high-speed, high-bandwidth data transfer. This sophisticated chiplet ensures seamless modulation of optical signals, supporting efficient driver control and optimized data transmission. The integrated design simplifies system architecture, reducing the overall footprint while maintaining exceptional reliability and performance. Its built-in digital control aids in managing complex signal processing requirements, suitable for diverse applications within optical networking infrastructures. Verifying its design through silicon-proven processes assures users of its capability to meet rigorous industry standards. The application of this chiplet spans high-speed data centers, telecommunications networks, and beyond, where its efficiency and performance are indispensable. The innovation behind its creation reflects Enosemi's dedication to advancing optical technology, offering clients robust and reliable tools to meet current and future communication needs.
Brite Semiconductor's YouSerdes provides a flexible solution of multi-speed SERDES IP with rates ranging from 2.5 Gbps to 32 Gbps. This offering is characterized by its smooth integration of multiple SERDES channels, ensuring high performance, efficiency, and low power consumption.<br><br>The technology is engineered to offer excellent connectivity solutions, making it ideal for applications that require precise and high-speed data transfer. Its compact and efficient design positions it favorably against other products in the market, providing a balance of speed and area utilization.<br><br>YouSerdes stands out for its adaptability and compatibility, meeting the needs of a range of applications including telecommunication networks and data centers where reliable, high-speed data processing is crucial.
The Apodis family of Optical Transport Network processors adheres to ITU-T standards, offering a comprehensive suite for signal termination, processing, and multiplexing. Designed to handle both SONET/SDH and Ethernet client services, these processors map signals to Optical Transport Network (OTN), empowering versatile any-port, any-service configurations. Apodis processors are notable for their capacity to support up to 16 client ports and four 10G OTN line ports, delivering bandwidth scalability up to 40G, crucial for wireless backhaul and fronthaul deployments. With a robust, non-blocking OTN switching fabric, Apodis facilitates seamless client-to-line and line-to-line connections while optimally managing network bandwidth. This adaptability makes the Apodis processors an ideal choice for next-generation access networks and optical infrastructures.
The pPLL03F-GF22FDX is part of the DeepSub family of all digital PLLs specifically designed for performance computing applications. Known for its low jitter and compact area, it is optimal for clocking applications with stringent timing requirements at frequencies reaching 4GHz. This makes it particularly suitable for use in performance computing blocks and ADCs/DACs that require moderate SNR levels, offering stable and reliable clocking solutions across multiple domains. With benefits like fractional multiplication and small die size, the pPLL03F excels in systems that need integration of multiple PLLs per SoC. Its design caters to complex SoCs with multiple clock domains and low-jitter applications, enhancing the overall system performance without compromising on power efficiency. Currently available in multiple process technologies such as GlobalFoundries 22FDX, Samsung 8LPP and 14LPP, and TSMC N6/N7, the pPLL03F is highly adaptable and can be ported to other technologies as needed. Its strategic design attributes ensure that it addresses the dual challenges of high performance and energy efficiency in today's fast-paced semiconductor industry.
The PDM-to-PCM Converter from Archband Labs leads in transforming pulse density modulation signals into pulse code modulation signals. This converter is essential in applications where high fidelity of audio signal processing is vital, including digital audio systems and communication devices. Archband’s solution ensures accurate conversion, preserving the integrity and clarity of the original audio. This converter is crafted to seamlessly integrate with a wide array of systems, offering flexibility and ease-of-use in various configurations. Its robust design supports a wide range of input frequencies, making it adaptable to different signal environments. The PDM-to-PCM Converter also excels in minimizing latency and reducing overhead processing times. It’s engineered for environments where precision and sound quality are paramount, ensuring that audio signals remain crisp and undistorted during conversion processes.
The ePHY-5616 delivers data rates from 1 to 56Gbps across technology nodes of 16nm and 12nm. Designed for a diverse range of applications, this product offers superior BER and low latency, making it ideal for enterprise equipment like routers, switches, and network interface cards. The ePHY-5616 employs a highly configurable DSP-based receiver architecture designed to manage various insertion loss scenarios, from 10dB up to over 35dB. This ensures robust and reliable data transfer across multiple setups.
The 10G TCP Offload Engine (TOE) by Intilop is engineered to offer efficient TCP processing with minimized CPU involvement, thereby enhancing overall system performance. This solution is a perfect fit for networks requiring low-latency interfaces with high data throughput, supplemented by a complete implementation of TCP protocols. Its architecture supports multiple concurrent TCP sessions, ensuring consistent latency across extensive network loads.\n\nThis TOE leverages advanced offload features such as large send and checksum offload, facilitating rapid data throughput while reducing processor workload. Ideal for integration into systems where speed and efficiency are paramount, the TOE effectively alleviates data transfer burdens from host CPUs, thereby optimizing resource allocation and system functionality.\n\nThe TOE is tailored for diverse applications including broadband networking, enterprise data centers, and high-performance computing setups. Offering reliable performance with broad compatibility, the TOE provides a practical solution for modern network environments requiring scalable, robust network acceleration technologies.
The HOTLink II Product Suite from Great River Technology exemplifies a high-performance video and data communication solution, tailored to meet the demanding requirements of aerospace applications. This suite is designed to facilitate the seamless transfer of high-speed data using the HOTLink II protocol, supporting the implementation of systems that require synchronization and reliability. With its focus on bridging video interfaces efficiently, Great River Technology provides a formidable toolset for avionics engineers looking to streamline their data communication systems. Leveraging the HOTLink II suite, users can expect a credible solution that offers both adaptability and robust performance, capable of integrating into a multitude of platforms. Great River Technology's commitment to technical excellence delivers a product suite that not only caters to current industry needs but is also adaptable for future advancements within the domain of video data exchange systems. By combining the tools and expertise offered in this suite, clients can develop, test, and implement HOTLink II systems that enhance communication capabilities within their network infrastructure. The suite is backed by comprehensive support to ensure optimal performance in all stages of product deployment, making it a vital component in achieving strategic communication objectives in aerospace technology.
The Universal Chiplet Interconnect Express (UCIe) by EXTOLL presents a forward-thinking solution for seamless connectivity in chiplet applications. This interconnect technology is tailored to integrate multiple chiplets into one cohesive system, enabling efficient communication pathways within heterogeneous integrations. Highlighted by its robust design, the UCIe stands out in providing ultra-fast transfer rates while significantly reducing latency, a crucial factor for next-gen computing systems that rely on rapid and reliable data exchange. Designed for compatibility with contemporary fabrication technologies, it supports tech nodes typically used in the semiconductor industry. The architectural design of UCIe facilitates the efficient construction of chiplet-based platforms, thereby driving advancements in scalability and flexibility for computing environments. As industries push towards integrating various functionalities on a single system, EXTOLL’s UCIe offers the interconnect solution that meets these complex requirements.
The CANmodule-III is an advanced Controller Area Network (CAN) controller offering unparalleled communication capabilities. The core is constructed following Bosch's base architecture and adheres to the CAN2.0B standard, providing assured performance across all transactions on the CAN bus. This module facilitates a range of custom and standard message filtering options, ensuring precision in meeting various application needs. The core's design ensures it is readily integrable, maintaining core functionality stability while accommodating application-specific add-ons. This core excels in settings spanning aerospace, automotive, and industrial controls, thanks to its proven compliance and reliability. Its plug-and-play design allows for straightforward system-on-chip integrations, distinguishing it in competitive environments. Moreover, the core's rigorous verification process ensures it performs optimally in both FPGA and ASIC deployments. CANmodule-III manages message transactions efficiently with its mailbox architecture, which supports up to 32 transmit and receive configurations. The smart interface design aids in system integration, reducing development cycles and expediting product deployment. Partners utilizing this core enjoy the benefits of rapid time-to-market and minimized design risks.
An interconnect component connects multi initiators and multi targets in a system. A single initiator system simply requires a decoder and multiplexor.
The Ultra-Low Latency 10G Ethernet MAC from Chevin Technology is engineered to provide exceptional performance in demanding environments. This IP core achieves ultra-low latency without compromising on data throughput, making it ideal for real-time applications where timing is critical. It simplifies integration, offering an all-logic architecture that eliminates the need for additional computing power, thereby enhancing efficiency and lowering operational costs.
The CT25203 represents a key building block designed for creating PMD transceivers compliant with the OA TC14 specification. It partners seamlessly with the CT25205 to communicate over the OA 3-pin interface with host MCUs, Zonal Gateway Controllers, or Ethernet switches integrated with a 10BASE-T1S digital PHY. This IP core supports high-performance transceivers encased in compact 8-pin packages. Manufactured with high-voltage process technology, it ensures top-tier electromagnetic compatibility. This capability makes the CT25203 an ideal choice for industrial and automotive applications where reliable communication and exceptional EMC performance are crucial.
The AXI4 DMA Controller from Digital Blocks is engineered to handle 1 to 16 independent data transfers concurrently, making it ideal for environments demanding robust data throughput. This controller supports diverse AXI data widths, including 8- to 1024-bit configurations, and facilitates scatter-gather linked-list control of data transfers. Designed for adaptability, it caters to both small-scale and extensive data sets, providing users with the capability to optimize data handling based on specific application needs.
The Titanium Ti375 FPGA presents an advanced solution ideal for developers seeking high-density, low-power configurations. Within its design is Efinix's Quantum compute fabric, which offers superior computational efficiency bundled with a robust I/O interface. Highlighting its versatility, the Ti375 incorporates a hardened RISC-V block, facilitating complex data processing tasks without confining power usage. Additionally, features such as a SerDes transceiver and LPDDR4 DRAM controller mark it as a powerful asset in high-demand environments, ensuring smooth and reliable data transactions. Further empowering its capability is an integrated MIPI D-PHY, making it particularly well-suited for modern applications demanding high-speed data exchange and connectivity.
The Ethernet Real-Time Publish-Subscribe IP Core provides an advanced hardware solution designed to facilitate real-time data exchange over Ethernet networks. This core supports the RTPS protocol, which is essential for applications requiring timely and deterministic data distribution. Engineered for seamless integration, the RTPS IP Core is an ideal choice for systems needing reliable and efficient data communication, such as in aerospace and defense environments. It enables fast, high-quality data transactions while reducing latency, ensuring that information is transmitted as intended under critical conditions. Coupling a robust framework with flexible configuration options, the Ethernet RTPS core excels in synchronizing data exchanges and maintaining communication integrity. Its architecture supports the demands of mission-critical applications, enhancing the performance and reliability of system operations.
The Network Protocol Accelerator Platform (NPAP) by Missing Link Electronics is engineered to significantly enhance network protocol processing. This platform leverages MLE's innovative patented and patent-pending technologies to boost the speed of data transmission within FPGAs, achieving impressive rates of up to 100 Gbps. The NPAP provides a robust, efficient solution for offloading processing tasks, leading to superior networking efficiency. MLE's NPAP facilitates multiple high-speed connections and can manage large volumes of data effectively, incorporating support for a variety of network protocols. The design ensures that users benefit from reduced latency and improved data throughput, making it an ideal choice for network-intensive applications. MLE’s expertise in integrating high-performance networking capabilities into FPGA environments comes to the forefront with this product, providing users with a dependable tool for optimizing their network infrastructures.
The C100 is a highly integrated SoC designed for IoT applications, boasting efficient control and connectivity features. It is powered by an enhanced 32-bit RISC-V CPU running at up to 1.5GHz, making it capable of tackling demanding processing tasks while maintaining low power consumption. The inclusion of embedded RAM and ROM further enriches its computational prowess and operational efficiency. Equipped with integrated Wi-Fi, the C100 facilitates seamless wireless communication, making it ideal for varied IoT applications. It supports multiple types of transmission interfaces and features key components such as an ADC and LDO, enhancing its versatility. The C100 also offers built-in temperature sensors, providing higher integration levels for simplified product designs across security systems, smart homes, toys, healthcare, and more. Aiming to offer a compact form factor without compromising on performance, the C100 is engineered to help developers rapidly prototype and bring to market devices that are safe, stable, and efficient. Whether for audio, video, or edge computing tasks, this single-chip solution embodies the essence of Chipchain's commitment to pioneering in the IoT domain.
The CANmodule-IIIx represents a sophisticated version of CAN controllers tailored for system-wide communication. Building upon its predecessors, this version supports an impressive 32 receive and 32 transmit mailboxes, maximizing message handling efficiency. It retains compliance with CAN2.0B standards, confirming its robustness and reliability across industries. Designed for seamless integration into system-on-chip environments, the CANmodule-IIIx offers a customizable design architecture where additional features enhance without disrupting core functionalities. The controller's flexibility makes it suitable for diverse applications, including telecommunications, network systems, and automotive technologies. Its smart architecture ensures ease of integration, while the structured design methodology guarantees technology independence and reusability. For developers, this means more efficient design cycles, reduced risk, and a streamlined path to market.
Digital Blocks' DB9000AXI Display Controller is a sophisticated solution for driving a wide spectrum of display resolutions including standard Full HD and up to advanced 4K and 8K panels. Built on the AMBA AXI Protocol, this controller interfaces seamlessly with Frame Buffer Memory to deliver high-quality images via display panels. Users benefit from diverse programmable features such as overlay window composition, along with color space conversion, allowing detailed image processing that enriches display presentations.
Topaz FPGAs are engineered to be a go-to solution for industries requiring a swift scale-up to volume production without compromising on performance or efficiency. Centered around an efficient architectural framework, these FPGAs deliver the power and functionality needed to address mainstream applications. They are renowned for their innovative fabric, which optimizes both die area and performance metrics. As such, Topaz FPGAs are indispensable for projects ranging from consumer electronics to automotive solutions, ensuring adaptability and scalability along evolving technological paths. Furthermore, with their seamless system integration capability, these FPGAs significantly shorten the development cycle, facilitating a faster go-to-market strategy while maintaining the high standards Efinix is known for.
The THOR platform is a versatile tool for developing application-specific NFC sensor and data logging solutions. It incorporates silicon-proven IP blocks, creating a comprehensive ASIC platform suitable for rigorous monitoring and continuous data logging applications across various industries. THOR is designed for accelerated development timelines, leveraging low power and high-security features. Equipped with multi-protocol NFC capabilities and integrated temperature sensors, the THOR platform supports a wide range of external sensors, enhancing its adaptability to diverse monitoring needs. Its energy-efficient design allows operations via energy harvesting or battery power, ensuring sustainability in its applications. This platform finds particular utility in sectors demanding precise environmental monitoring and data management, such as logistics, pharmaceuticals, and industrial automation. The platform's capacity for AES/DES encrypted data logging ensures secure data handling, making it a reliable choice for sectors with stringent data protection needs.
An innovative solution in Intilop's IP product lineup, the UDP Offload Engine (UOE) enhances network performance by transferring UDP packet handling from the CPU to dedicated hardware. This process significantly reduces latency and power usage, making it an invaluable addition to high-demand network environments. The UOE is designed to handle 1G to 10G network speeds efficiently, supporting vast numbers of UDP sessions concurrently with minimal delay.\n\nThis engine stands out due to its flexible integration capabilities, allowing it to be used across a variety of platforms including cloud computing environments and high-performance enterprise networks. With support for comprehensive checksum offloads and direct interface to packet buffers, the UOE efficiently manages data flow, ensuring that application workloads can be streamlined without sacrificing performance.\n\nCustomers deploying the UOE can expect enhancements in bandwidth utilization and system resource allocation, as it offloads network processing tasks that traditionally would consume significant CPU bandwidth. The UOE comes with extensive features that enable it to adapt to varied networking demands while maintaining a very low impact on system resources, thereby delivering enhanced network infrastructure efficiency.
The Time-Triggered Protocol (TTP) is an innovative real-time communications protocol used primarily in space and aviation networks. TTP ensures synchronized communication across various nodes in a network, providing deterministic message delivery, which is crucial in systems where timing and reliability are critical. By supporting highly dependable system architectures, it aids in achieving high safety levels required in critical aerospace applications.
The DisplayPort 1.4 is an advanced IP core solution, ideal for fulfilling modern DisplayPort requirements. Available as both a source (DPTX) and a sink (DPRX), it caters to a variety of link rates including 1.62, 2.7, 5.4, and 8.1 Gbps—covering eDP rates as well. Offering support for 1, 2, and 4 DP lanes, this IP core features Native video and AXI stream video interfaces. This IP core supports Single Stream Transport (SST) and Multiple Stream Transport (MST), along with dual and quad pixel clocks for 8 and 10-bit video in RGB, YCbCr 4:4:4, YCbCr 4:2:2, and YCbCr 4:2:0 colorspaces. It also incorporates a secondary data packet interface conducive for audio and metadata transport. To facilitate video processing, the IP comes with a Video Toolbox (VTB), equipped with a timing generator, test pattern generator, and video clock recovery. Its design ensures broad FPGA adaptability, working seamlessly with a variety of devices including AMD UltraScale+, AMD Artix-7, Intel Cyclone 10 GX, Intel Arria 10 GX, and Lattice CertusPro-NX.
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