The PowerPad Dynamic Power Reduction offers a breakthrough in minimizing power use across integrated circuits. Designed to replace standard IC power and ground bond pads, PowerPad leverages its embedded capabilities to reduce energy consumption without increasing IC footprin significantly. This innovation results in more efficient power usage, making it a valuable asset for electronics seeking to optimize energy consumption on a chip level.
| Foundry | Process Nodes |
|---|---|
| GLOBALFOUNDARIES |
28nm |
| TSMC |
55nm |
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