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The KL730 is a third-generation AI chip that integrates advanced reconfigurable NPU architecture, delivering up to 8 TOPS of computing power. This cutting-edge technology enhances computational efficiency across a range of applications, including CNN and transformer networks, while minimizing DDR bandwidth requirements. The KL730 also boasts enhanced video processing capabilities, supporting 4K 60FPS outputs. With expertise spanning over a decade in ISP technology, the KL730 stands out with its noise reduction, wide dynamic range, fisheye correction, and low-light imaging performance. It caters to markets like intelligent security, autonomous vehicles, video conferencing, and industrial camera systems, among others.
The Akida 2nd Generation represents a leap forward in the realm of AI processing, enhancing upon its predecessor with greater flexibility and improved efficiency. This advanced neural processor core is tailored for modern applications demanding real-time response and ultra-low power consumption, making it ideal for compact and battery-operated devices. Akida 2nd Generation supports various programming configurations, including 8-, 4-, and 1-bit weights and activations, thus providing developers with the versatility to optimize performance versus power consumption to meet specific application needs. Its architecture is fully digital and silicon-proven, ensuring reliable deployment across diverse hardware setups. With features such as programmable activation functions and support for sophisticated neural network models, Akida 2nd Generation enables a broad spectrum of AI tasks. From object detection in cameras to sophisticated audio sensing, this iteration of the Akida processor is built to handle the most demanding edge applications while sustaining BrainChip's hallmark efficiency in processing power per watt.
Addressing the need for high-performance AI processing, the Metis AIPU PCIe AI Accelerator Card from Axelera AI offers an outstanding blend of speed, efficiency, and power. Designed to boost AI workloads significantly, this PCIe card leverages the prowess of the Metis AI Processing Unit (AIPU) to deliver unparalleled AI inference capabilities for enterprise and industrial applications. The card excels in handling complex AI models and large-scale data processing tasks, significantly enhancing the efficiency of computational tasks within various edge settings. The Metis AIPU embedded within the PCIe card delivers high TOPs (Tera Operations Per Second), allowing it to execute multiple AI tasks concurrently with remarkable speed and precision. This makes it exceptionally suitable for applications such as video analytics, autonomous driving simulations, and real-time data processing in industrial environments. The card's robust architecture reduces the load on general-purpose processors by offloading AI tasks, resulting in optimized system performance and lower energy consumption. With easy integration capabilities supported by the state-of-the-art Voyager SDK, the Metis AIPU PCIe AI Accelerator Card ensures seamless deployment of AI models across various platforms. The SDK facilitates efficient model optimization and tuning, supporting a wide range of neural network models and enhancing overall system capabilities. Enterprises leveraging this card can see significant improvements in their AI processing efficiency, leading to faster, smarter, and more efficient operations across different sectors.
The Mixel MIPI C-PHY IP (MXL-CPHY) is a high-frequency, low-power, low cost, physical layer. (Learn more about Mixel’s MIPI ecosystem at Mixel MIPI Central which gives you access to Mixel’s best of class MIPI ecosystem supply chain partners.) The C-PHY configuration consists of up to three lane modules and is based on 3-Phase symbol encoding technology, delivering 2.28 bits per symbol over three-wire trios and targeting a maximum rate of 2.5 Gsps, 5.7Gbps. The C-PHY is partitioned into a digital module – CIL (Control and Interface Logic) and a mixed-signal module. The PHY IP is provided as a combination of soft IP views (RTL, and STA Constraints) for the digital module, and hard IP views (GDSII/CDL/LEF/LIB) for the mixed-signal module. This unique offering of both soft and hard IP permits architectural design flexibility and seamless implementation in customer-specific design flow. The CIL module interfaces with the protocol layer and determines the global operation of the module. The interface between the PHY and the protocol is using the PHY-Protocol Interface (PPI). The mixed-signal module includes high-speed signaling mode for fast-data traffic and low-power signaling mode for control purposes. During normal operation, a lane switches between low-power and high-speed mode. Bidirectional lanes can also switch communication direction. The change of operating mode or direction requires enabling and disabling of certain electrical functions. These enable and disable events do not cause glitches on the lines that would result in a detection of incorrect signal levels. All mode and direction changes are smooth to always ensure a proper detection of the line signals. Mixel’s C-PHY is a complete PHY, silicon-proven at multiple foundries and multiple nodes. It is built to support the MIPI Camera Serial Interface (CSI) and Display Serial Interface (DSI).
Overview: CMOS Image Sensors (CIS) often suffer from base noise, such as Additive White Gaussian Noise (AWGN), which deteriorates image quality in low-light environments. Traditional noise reduction methods include mask filters for still images and temporal noise data accumulation for video streams. However, these methods can lead to ghosting artifacts in sequential images due to inconsistent signal processing. To address this, this IP offers advanced noise reduction techniques and features a specific Anti-ghost Block to minimize ghosting effects. Specifications:  Maximum Resolution o Image : 13MP o Video : 13MP@30fps  -Input formats : YUV422–8 bits  -Output formats o DVP : YUV422-8 bits o AXI : YUV420, YUV422  -8 bits-Interface o ARM® AMBA APB BUS interface for ISP system control o ARM® AMBA AXI interface for data o Direct connection to sensor stream data (DVP) Features:  Base Noise Correction: AWGN reduction for improved image quality  Mask Filter: Convolution-based noise reduction for still images  Temporal Noise Data Accumulation: Gaussian Distribution-based noise reduction for video streams using 2 frames of images  3D Noise Reduction (3DNR): Sequential image noise reduction with Anti-ghost Block  Motion Estimation and Adaptive: Suppresses ghosting artifacts during noise reduction  Real-Time Processing: Supports Digital Video Port (DVP) and AXI interfaces for seamless integration  Anti-Ghost  Real time De-noising output
The 1G to 224G SerDes technology by Alphawave Semi is a robust connectivity solution designed for high-speed data transmission. It integrates seamlessly into various applications including Ethernet, PCI Express, and die-to-die connections, enabling fast and reliable data transfer. This technology supports a broad spectrum of signaling schemes such as PAM2, PAM4, PAM6, and PAM8, ensuring compatibility with over 30 different industry protocols and standards. As the demand for high-performance data centers and networking solutions increases, the 1G to 224G SerDes proves indispensable, delivering the speed and bandwidth required by modern systems. Alphawave Semi's SerDes supports data rates from as low as 1Gbps to a staggering 224Gbps, making it highly versatile for a multitude of configurations. Its application extends beyond traditional data centers, also covering areas like AI and 5G communication networks where latency and data throughput are critical. This flexibility is further enhanced by its low power consumption, which is essential for efficient data processing in today's power-conscious technological environment. Incorporating the 1G to 224G SerDes into your chip designs guarantees reduced latency and increased data throughput, which is vital for applications that demand real-time data processing. By ensuring high data integrity and reducing signal degradation, this SerDes solution aids in maintaining steadfast connectivity, even under heavy data loads, promising a future-ready component in the evolving tech landscape.
**Ceva-Waves Links** is a growing family of multi-standard wireless platforms. By optimizing connectivity support for various combinations of **Wi-Fi, Bluetooth, 802.15.4, and ultra-wideband (UWB)**, the Ceva-Waves Links family provides preconfigured, optimized solutions for SoCs requiring multiple connectivity standards. All Ceva-Waves Links configurations are based on field-proven Ceva-Waves hardware IP and software stacks. Unique Ceva coexistence algorithms ensure efficient and interference-free operation of multiple connections while sharing one radio. The **Ceva-Waves Links family** offers combinations of Ceva-Waves Wi-Fi, Ceva-Waves Bluetooth, 802.15.4 (supporting protocols such as Thread, Matter and Zigbee), and Ceva-Waves UWB hardware IP, integrated with Ceva or third-party radios and CPU- and OS-agnostic software stacks. New platforms will be introduced to address market trends or customers’ demands. [**Learn more about Ceva-Waves Links family solution>**](https://www.ceva-ip.com/product/ceva-waves-links/?utm_source=silicon_hub&utm_medium=ip_listing&utm_campaign=ceva_waves_links_page)
KPIT Technologies leads in the development of Advanced Driver Assistance Systems (ADAS) and autonomous driving solutions, building systems that enhance vehicle safety, comfort, and performance. These innovations extend across various aspects of vehicle automation, leveraging AI-driven data analytics and sensor fusion technologies to enable intelligent driving functions. KPIT's ADAS offerings are designed to assist drivers in complex traffic situations, reduce collision risks, and enhance the overall driving experience through adaptive, high-precision control systems. Central to KPIT's efforts in this space is the integration of state-of-the-art technologies, including machine learning algorithms and real-time data processing capabilities. These complement their extensive industry knowledge to deliver robust, scalable, and interoperable solutions that adhere to the latest automotive safety standards. Emphasizing modular design, KPIT ensures that automakers can easily integrate these technologies into existing and new vehicle platforms. KPIT's expertise extends to collaborating with automakers on developing sophisticated autonomous systems that promise to redefine the future of personal and commercial mobility. By partnering with leading automotive companies, KPIT continues to pioneer advancements in vehicular autonomy, ensuring greater safety and efficiency on roads worldwide.
Focused on image quality enhancement, WAVE-N is a specialized neural processing unit developed by Chips&Media. It employs advanced algorithms to deliver superior resolutions, transitioning from 2K to 4K at 60fps, while also offering effective noise reduction at similar frame rates. WAVE-N is particularly tailored for CNN-based image processing applications, featuring a fully programmable core that utilizes Chips&Media's proprietary ISA. Notably, WAVE-N's design emphasizes efficiency by minimizing bandwidth consumption, boasting over 50% MAC utilization in intensive computing tasks. This NPU excels in applications requiring high detail visual output, such as automotive displays and high-definition broadcasting.
The **Ceva-Waves Bluetooth platform** includes field-proven hardware IP for baseband controller, modem, and 2.4 GHz RF transceiver functions, and allows use of many third-party radio IPs as well. The platform includes optimized baseband controller hardware and software, and above the Host Controller Interface (HCI) a host-agnostic software protocol stack supporting all major Bluetooth profiles. The built-in 802.15.4 add-on suite shares the same Bluetooth radio, and includes IEEE 802.15.4 MAC & modem hardware IP and software, and is compatible with Zigbee, Thread and Matter host protocol stacks. The Ceva-Waves Bluetooth platform is also available as part of the **Ceva-Waves Links family** of multi-protocol turnkey platforms, including with optimized Wi-Fi & Bluetooth co-existence interface and packet traffic arbiter. The Ceva-Waves Bluetooth platforms also comprises a state-of-the-art radio in TSMC 12nm FFC+ supporting all the latest Bluetooth 6.0 dual mode features, along with next gen Bluetooth High Data Throughput and IEEE 802.15.4. Its innovative architecture provides best in class performance in term of power consumption, die size, sensitivity and output power. [**Learn more about Ceva's Bluetooth solution>**](https://www.ceva-ip.com/product/ceva-waves-bluetooth/?utm_source=silicon_hub&utm_medium=ip_listing&utm_campaign=ceva_waves_bluetooth_page)
Overview: The UCIe IP supports multiple protocols (CXL/PCIe/Streaming) to connect chiplets, reducing overall development cycles for IPs and SOCs. With flexible application and PHY interfaces, The UCIe IP is ideal for SOCs and chiplets. Key Features:  Supports UCIe 1.0 Specification  Supports CXL 2.0 and CXL 3.0 Specifications  Supports PCIe Gen6 Specification  Supports PCIe Gen5 and older versions of PCIe specifications  Supports single and two-stack modules  Supports CXL 2.0 68Byte flit mode with Fallback mode for PCIe non-flit mode transfers  Supports CXL 3.0 256Byte flit mode  Supports PCIe Gen6 flit mode  Configurable up to 64-lane configuration for Advanced UCIe modules and 16 lanes for Standard UCIe modules  Supports sideband and Mainband signals  Supports Lane repair handling  Data to clock point training and eye width sweep support from transmitter and receiver ends  UCIe controller can work as Downstream or Upstream  Main Band Lane reversal supported  Dynamic sense of normal and redundant clock and data lines activation  UCIe enumeration through DVSEC  Error logging and reporting supported  Error injection supported through Register programming  RDI/FDI PM entry, Exit, Abort flows supported  Dynamic clock gang at adapter supported Configurable Options:  Maximum link width (x1, x2, x4, x8, x16)  MPS (128B to 4KB)  MRRS (128B to 4KB)  Transmit retry/Receive buffer size  Number of Virtual Channels  L1 PM substate support  Optional Capability Features can be Configured  Number of PF/VFDMA configurable Options  AXI MAX payload size Variations  Multiple CPI Interfaces (Configurable)  Cache/memory configurable  Type 0/1/2 device configurable
0.75V ESD power protection. The ESD clamp is designed to provide protection for 0.75 V Analog and Core domain using 0.75V FinFet transistors in TSMC N3E process. The target ESD robustness can be selected.
**Ceva-XC21** is the most efficient vector DSP core available today for communications applications. The Ceva-XC21 DSP is designed for low-power, cost- and size-optimized cellular IoT modems, NTN VSAT terminals, eMBB and uRLLC applications. Ceva-XC21 offers scalable architecture and dual thread design with support for AI, addressing growing demand for smarter, yet more cost and power efficient cellular devices. Targeted for 5G and 5G-Advanced workloads, the Ceva-XC21 has multiple products configurations enabling system designers to optimize the size and cost to their specific application needs. The Ceva-XC21, based on the advanced Ceva-XC20 architecture, features a product line of 3 vector DSP cores. Each of the cores offers a unique performance & area configuration with a SW compatibility between them. The different cores span across single thread or dual thread configurations, and 32 or 64 16bits x 16bits MACs. The Ceva-XC212, the highest performing variant of the Ceva-XC21 delivers up to 1.8x times the performance of Ceva’s previous-generation Ceva-XC4500 architecture, while reducing the core area. Ceva-XC210, the smallest configuration of the Ceva-XC21, enables system designers to reduce the core die size in 48% compared with the previous generation. Ceva-XC211 offers the same performance envelope compared with the previous generation at 63% of the area. [**Learn more about Ceva-XC21>**](https://www.ceva-ip.com/product/ceva-xc21/?utm_source=silicon_hub&utm_medium=ip_listing&utm_campaign=ceva_xc21_page)
The Mixel MIPI C/D-PHY combo IP (MXL-CPHY-DPHY) is a high-frequency low-power, low cost, physical layer compliant with the MIPI® Alliance Standard for C-PHY and D-PHY. (Learn more about Mixel’s MIPI ecosystem at Mixel MIPI Central which gives you access to Mixel’s best of class MIPI ecosystem supply chain partners.) The PHY can be configured as a MIPI Master or MIPI Slave, supporting camera interface CSI-2 v1.2 or display interface DSI v1.3 applications in the D-PHY mode. It also supports camera interface CSI-2 v1.3 and display interface DSI-2 v1.0 applications in the C-PHY mode. The high-speed signals have a low voltage swing, while low-power signals have large swing. High-Speed functions are used for high-speed data traffic while low-power functions are mostly used for control. The C-PHY is based on 3-Phase symbol encoding technology, delivering 2.28 bits per symbol over three-wire trios, operating with a symbol rate range of 80 to 4500 Msps per lane, which is the equivalent of about 182.8 to 10260 Mbps per lane. The D-PHY supports a bit rate range of 80 to 1500 Mbps per Lane without deskew calibration, and up to 4500 Mbps with deskew calibration. The low-power mode and escape mode are the same in both the D-PHY and C-PHY modes. To minimize EMI, the drivers for low-power mode are slew-rate controlled and current limited. The data rate in low-power mode is 10 Mbps. For a fixed clock frequency, the available data capacity of a PHY configuration can be increased by using more lanes. Effective data throughput can be reduced by employing burst mode communication. Mixel’s C-PHY/D-PHY combo is a complete PHY, silicon-proven at multiple foundries and multiple nodes. The C/D-PHY is fully integrated and has analog circuitry, digital, and synthesizable logic.
The Akida IP is an advanced processor core designed to mimic the efficient processing characteristics of the human brain. Inspired by neuromorphic engineering principles, it delivers real-time AI performance while maintaining a low power profile. The architecture of the Akida IP is sophisticated, allowing seamless integration into existing systems without the need for continuous external computation. Equipped with capabilities for processing vision, audio, and sensor data, the Akida IP stands out by being able to handle complex AI tasks directly on the device. This is done by utilizing a flexible mesh of nodes that efficiently distribute cognitive computing tasks, enabling a scalable approach to machine learning applications. Each node supports hundreds of MAC operations and can be configured to adapt to various computational requirements, making it a versatile choice for AI-centric endeavors. Moreover, the Akida IP is particularly beneficial for edge applications where low latency, high efficiency, and security are paramount. With capabilities for event-based processing and on-chip learning, it enhances response times and reduces data transfer needs, thereby bolstering device autonomy. This solidifies its position as a leading solution for embedding AI into devices across multiple industries.
**Ceva-Waves UWB platform** cuts the development time and risk for implementing a wide range of UWB functionality in SoCs. It provides optimized MAC and PHY hardware IP and supporting software for secure and accurate ranging, and Doppler Radar presence detection applications. It can be implemented in an SoC independently or in conjunction with the Ceva-Waves Bluetooth platform, as well as part of the Ceva-Waves Links family of multiprotocol platforms. The Ceva-Waves UWB platform includes hardware IP for an optimized UWB MAC and PHY meeting 802.15.4 HRP, FiRa 3.0, and the Car Connectivity Consortium Digital Key 3.0 (CCC DK3.0) requirements. The platform includes advanced Wi-Fi interference suppression. A comprehensive suite of CPU-agnostic software stacks that support FiRa 3.0 MAC, CCC DK3.0 MAC, and radar for implementing applications such as automotive digital keys and in-cabin child-presence detection (CPD), general power-saving presence detection in laptops, TVs and smart buildings, asset tracking tags, real-time location services (RTLS), and tap-free payment. [**Learn more about our UWB soluion>**](https://www.ceva-ip.com/product/ceva-waves-uwb/?utm_source=silicon_hub&utm_medium=ip_listing&utm_campaign=ceva_waves_uwb_page)
Primesoc's PCIE GEn7 IP is dual mode controller , supporting upto 128Gbps per lane data rate , which can work as root complex or as an endpoint. This is a soft IP which can support serdes and non serdes architectures and PIPE interface of 64bit and lanes configurable from 1/2/4/8/16.
The GL3590-S is a USB 3.2 Gen 2 hub controller that features integrated support for USB Type-C connections and multiple upstream ports. This product is engineered to enhance connectivity by providing efficient data transfer speeds up to 10 Gbps, facilitating rapid communication across various peripherals. It supports advanced power management capabilities, allowing devices to negotiate power delivery efficiently. Additionally, the GL3590-S incorporates robust security protocols to ensure data integrity during transmission. This controller is ideal for applications needing versatile USB connectivity with high-speed data transfers. It can be utilized in computing setups, where the demand for reliable and fast data exchanges is paramount. Moreover, its compatibility with USB Type-C enables seamless integration with a wide array of modern devices, enhancing its applicability in contemporary technological environments. In terms of technical advancements, the GL3590-S simplifies the integration process by supporting multiple upstream ports, making it easier for developers to utilize its capabilities in complex designs. Furthermore, the energy-efficient design reduces power consumption, making it a sustainable choice for manufacturers looking to include environmentally friendly components in their products. Thanks to its advanced features, the GL3590-S is an attractive option for any stakeholder in need of high-speed data management and efficient power usage. Its adaptability and performance make it a cornerstone in the development of innovative USB solutions.
Designed for memory-coherent systems, the Coherent Network-on-Chip (NOC) by SkyeChip is a scalable, efficient interconnect solution that minimizes routing congestion in large-scale designs. It supports ACE4, ACE5, and CHI protocols, providing robust interconnect options that enhance many-core system performance. Moreover, it is built to support up to 2GHz operating frequencies and seamlessly integrates with non-coherent NOC setups, enhancing connectivity in diverse semiconductor applications.
The Low Density Parity Check (LDPC) codes are powerful, capacity approaching channel codes and have exceptional error correction capabilities. The high degree of parallelism that they offer enables efficient, high throughput hardware architectures. The ntLDPC_WiFi6 IP Core is based on an implementation of QC-LDPC Quasi-Cyclic LDPC Codes and is fully compliant with IEEE 802.11 n/ac/ax standard. The Quasi-Cyclic LDPC codes are based on block-structured LDPC codes with circular block matrices. The entire parity check matrix can be partitioned into an array of block matrices; each block matrix is either a zero matrix or a right cyclic shift of an identity matrix. The parity check matrix designed in this way can be conveniently represented by a base matrix represented by cyclic shifts. The main advantage of this feature is that they offer high throughput at low implementation complexity. The ntLDPC_WiFi6 decoder IP Core may optionally implement one of two approximations of the log-domain LDPC iterative decoding algorithm (Belief propagation) known as either Layered Normalized Offset Min-Sum Algorithm or Layered Lambda-min Algorithm. Selecting between the two algorithms presents a decoding performance .vs. system resources utilization trade-off. The core is highly reconfigurable and fully compliant to the IEEE 802.11 n/ac/ax Wi-Fi4, Wi-Fi5 and Wi-Fi 6 standards. The ntLDPC_WiFi6 encoder IP implements a 81-bit parallel systematic LDPC encoder. An off-line profiling Matlab script processes the original matrices and produces a set of constants that are associated with the matrix and hardcoded in the RTL encoder.
Overview: Cybersecurity IPs offer a range of essential security features to protect your digital assets and sensitive information. From True Random Number Generators (TRNG) to advanced encryption algorithms like AES, DES, 3DES, and cryptographic hash functions like SHA, as well as RSA for secure key exchange and digital signatures, the IPs provide a comprehensive suite of tools to safeguard your data. Key Features:  True Random Number Generator (TRNG): Generates unpredictable and unbiased random numbers for cryptographic applications.  Advanced Encryption Standard (AES): Provides robust encryption with symmetric key algorithms for securing data.  Data Encryption Standard (DES) and Triple DES (3DES): Implement legacy encryption algorithms for data protection.  Hash Functions: Includes secure cryptographic hash functions like SHA (Secure Hash Algorithm) for data integrity verification.  RSA: Enables secure key exchange, encryption, and digital signatures for secure communication. These cybersecurity IPs are designed to meet the stringent security requirements of modern applications, ensuring the confidentiality, integrity, and authenticity of your data.
The Universal Chiplet Interconnect Express (UCIe) by EXTOLL is a cutting-edge interconnect framework designed to revolutionize chip-to-chip communication within heterogeneous systems. This product exemplifies the shift towards chiplet architecture, a modular approach enabling enhanced performance and flexibility in semiconductor designs. UCIe offers an open and customizable platform that supports a wide range of technology nodes, particularly excelling in the 12nm to 28nm range. This adaptability ensures it can meet the diverse needs of modern semiconductor applications, providing a bridge that enhances integration across various chiplet components. Such capabilities make it ideal for applications requiring high bandwidth and low latency. The design of UCIe focuses on minimizing power consumption while maximizing data throughput, aligning with EXTOLL’s objective of delivering eco-efficient technology. It empowers manufacturers to forge robust connections between chiplets, allowing optimized performance and scalability in data-intensive environments like data centers and advanced consumer electronics.
The Yitian 710 Processor is a landmark server chip released by T-Head Semiconductor, representing a breakthrough in high-performance computing. This chip is designed with cutting-edge architecture that utilizes advanced Armv9 structure, accommodating a range of demanding applications. Engineered by T-Head's dedicated research team, Yitian 710 integrates high efficiency and bandwidth properties into a unique 2.5D package, housing two dies and a staggering 60 billion transistors. The Yitian 710 encompasses 128 Armv9 high-performance cores, each equipped with 64KB L1 instruction cache, 64KB L1 data cache, and 1MB L2 cache, further amplified by a collective on-chip system cache of 128MB. These configurations enable optimal data processing and retrieval speeds, making it suitable for data-intensive tasks. Furthermore, the memory subsystem stands out with its 8-channel DDR5 support, reaching peak bandwidths of 281GB/s. In terms of connectivity, the Yitian 710's I/O system includes 96 PCIe 5.0 channels with a bidirectional theoretical total bandwidth of 768GB/s, streamlining high-speed data transfer critical for server operations. Its architecture is not only poised to meet the current demands of data centers and cloud services but also adaptable for future advancements in AI inference and multimedia processing tasks.
Overview: Lens distortion is a common issue in cameras, especially with wide-angle or fisheye lenses, causing straight lines to appear curved. Radial distortion, where the image is expanded or reduced radially from the center, is the most prominent type. Failure to correct distortion can lead to issues in digital image analysis. The solution involves mathematically modeling and correcting distortion by estimating parameters that determine the degree of distortion and applying inverse transformations. Automotive systems often require additional image processing features, such as de-warping, for front/rear view cameras. The Lens Distortion Correction H/W IP comprises 3 blocks for coordinate generation, data caching, and interpolation, providing de-warping capabilities for accurate image correction. Specifications:  Maximum Resolution: o Image: 8MP (3840x2160) o Video: 8MP @ 60fps  Input Formats: YUV422 - 8 bits  Output Formats: o AXI: YUV420, YUV422, RGB888 - 8 bits  Interface: o ARM® AMBA APB BUS interface for system control o ARM® AMBA AXI interface for data Features:  Programmable Window Size and Position  Barrel Distortion Correction Support  Wide Angle Correction up to 192°  De-warping Modes: o Zoom o Tilt o Pan o Rotate o Side-view  Programmable Parameters: o Zoom Factor: controls Distance from the Image Plane to the Camera (Sensor)
iWave Global introduces the ARINC 818 Switch, a pivotal component in the management and routing of video data within avionics systems. Designed for applications that require efficient video data distribution and management, the switch is optimized for performance in environments with stringent data handling requirements. The switch's architecture supports a high level of bandwidth, allowing for the smooth routing of multiple video streams in real-time. Its design includes advanced features that ensure low-latency, error-free data transfer, integral to maintaining the integrity and reliability of video data in critical applications. Featuring robust interoperability characteristics, the ARINC 818 Switch easily integrates into existing systems, facilitating modular expansion and adaptability to new technological standards. It is indispensable for any aerospace project that involves complex video data management, providing a stable platform for video data routing and switching.
The AI Camera Module from Altek is a versatile, high-performance component designed to meet the increasing demand for smart vision solutions. This module features a rich integration of imaging lens design and combines both hardware and software capacities to create a seamless operational experience. Its design is reinforced by Altek's deep collaboration with leading global brands, ensuring a top-tier product capable of handling diverse market requirements. Equipped to cater to AI and IoT interplays, the module delivers outstanding capabilities that align with the expectations for high-resolution imaging, making it suitable for edge computing applications. The AI Camera Module ensures that end-user diversity is meaningfully addressed, offering customization in device functionality which supports advanced processing requirements such as 2K and 4K video quality. This module showcases Altek's prowess in providing comprehensive, all-in-one camera solutions which leverage sophisticated imaging and rapid processing to handle challenging conditions and demands. The AI Camera's technical blueprint supports complex AI algorithms, enhancing not just image quality but also the device's interactive capacity through facial recognition and image tracking technology.
This LVDS IP offers seamless transmission solutions for high-speed data in digital systems. Its design allows for minimized electromagnetic interference while maintaining signal integrity. Often used in video and graphic applications, the LVDS IP ensures efficient data handling, making it a critical component in complex electronic interfaces.
Speedcore embedded FPGA (eFPGA) IP represents a notable advancement in integrating programmable logic into ASICs and SoCs. Unlike standalone FPGAs, eFPGA IP lets designers tailor the exact dimensions of logic, DSP, and memory needed for their applications, making it an ideal choice for areas like AI, ML, 5G wireless, and more. Speedcore eFPGA can significantly reduce system costs, power requirements, and board space while maintaining flexibility by embedding only the necessary features into production. This IP is programmable using the same Achronix Tool Suite employed for standalone FPGAs. The Speedcore design process is supported by comprehensive resources and guidance, ensuring efficient integration into various semiconductor projects.
KPIT Technologies is a leader in providing AUTOSAR and Adaptive AUTOSAR solutions, facilitating the development of software architectures that standardize interoperability across the automotive industry. Designed to support the increasing complexity of modern vehicle electronic infrastructures, KPIT's solutions enable seamless integration of software components, promoting scalability and reliability. AUTOSAR (Automotive Open System Architecture) is essential for developing modular and flexible software systems, allowing automakers to focus on innovative application features while ensuring software compatibility and integration ease. KPIT offers a comprehensive range of services, from basic software to complex component development, tailored to fit specific industry needs. With Adaptive AUTOSAR, KPIT accelerates the transition to software-defined vehicles by providing flexible, scalable, and upgradable software solutions that cater to the dynamic requirements of connected and autonomous vehicles. By aligning with industry standards, KPIT’s AUTOSAR solutions ensure cost efficiency, reduce development time, and enhance the overall quality and functionality of automotive software systems.
The NVMe Host Controller from iWave Global offers an advanced solution for managing NVMe drive interfaces in computing systems. This controller is designed to facilitate the high-speed data exchange that NVMe drives demand, streamlining operations across data-centric applications. Engineered for scalability and performance, the NVMe Host Controller supports high data throughput, ensuring quick access and transfer of data between storage devices and host systems. Its design caters to the demands of modern computational environments where rapid data retrieval and storage are critical. The controller is integral in systems requiring high-performance storage solutions, and its support for multiple interfaces underscores its adaptability and broad applicability in data-intensive industries such as enterprise storage and high-performance computing.
The Aries fgOTN processor family is engineered according to the ITU-T G.709.20 fgOTN standard. This line of processors handles a variety of signals, including E1/T1, FE/GE, and STM1/STM4, effectively monitoring and managing alarms and performance metrics. Aries processors excel at fine-grain traffic aggregation, efficiently channeling fgODUflex traffic across OTN lines to support Ethernet, SDH, PDH client services. Their capacity to map signals to fgODUflex containers, which are then multiplexed into higher order OTN signals, demonstrates their versatility and efficiency. By allowing cascaded configurations with other Aries devices or Apodis processors, Aries products optimize traffic routes through OTN infrastructures, positioning them as essential components in optical networking and next-generation access scenarios.
**Ceva-PentaG2** is a complete IP platform for implementing a wide range of user-equipment and IoT cellular modems. The platform includes a variety of DSPs, modem hardware modules, software libraries, and simulation tools. Capabilities of the Ceva-PentaG2 include New Radio (NR) physical layer design ranging across all 3GPP profiles from RedCap IoT and mMTC, through eMBB up to ultra-reliable low-latency communications (URLLC). The platform has two base configurations. Ceva-PentaG2 Max emphasizes performance and scalability for enhanced mobile broadband (eMBB) and future proofing design for next generation 5G-Advanced releases. Ceva-PentaG2 Lite emphasizes extreme energy and area efficiency for lower-throughput applications such as LTE Cat 1, RedCap, and optimized cellular IoT applications. The PentaG2 platform comprises a set of Ceva DSP cores, optimized fixed-function hardware accelerators, and proven, optimized software modules. By using this platform, designers can implement optimized, hardware-accelerated processing chains for all main modem functions. In the selection process, designers can tune their design for any point across a huge space of area, power consumption, latency, throughput, and channel counts. Solutions can fit applications ranging from powerful eMBB for mobile and Fixed Wireless Access (FWA) devices to connected vehicles, cellular IoT modules, and even smart watches. System-C models in Ceva’s Virtual Platform Simulator (VPS) aid architectural exploration and system tuning, while an FPGA-based emulation kit speeds SoC integration. [**Learn more about Ceva-PentaG2 solution>**](https://www.ceva-ip.com/product/ceva-pentag2/?utm_source=silicon_hub&utm_medium=ip_listing&utm_campaign=ceva_pentag2_page)
The Mixel MIPI D-PHY IP (MXL-DPHY) is a high-frequency low-power, low cost, source-synchronous, physical layer compliant with the MIPI® Alliance Standard for D-PHY. (Learn more about Mixel’s MIPI ecosystem at Mixel MIPI Central which gives you access to Mixel’s best of class MIPI ecosystem supply chain partners.) Although primarily used for connecting cameras and display devices to a core processor, this MIPI PHY can also be used for many other applications. It is used in a master-slave configuration, where high-speed signals have a low voltage swing, and low-power signals have large swing. High-speed functions are used for high-speed data traffic while low-power functions are mostly used for control. The D-PHY is partitioned into a Digital Module – CIL (Control and Interface Logic) and a Mixed Signal Module. It is provided as a combination of Soft IP views (RTL, and STA Constraints) for Digital Module, and Hard IP views (GDSII/CDL/LEF/LIB) for the Mixed Signal Module. This unique offering of Soft and Hard IP permits architectural design flexibility and seamless implementation in customer-specific design flow. The CIL module interfaces with the protocol layer and determines the global operation of the lane module. The interface between the D-PHY and the protocol is called the PHY-Protocol Interface (PPI). During normal operation, the data lane switches between low-power mode and high-speed mode. Bidirectional lanes can also switch communication direction. The change of operating mode or direction requires enabling and disabling certain electrical functions. These enable and disable events do not cause glitches on the lines that would otherwise result in detections of incorrect signal levels. Therefore, all mode and direction changes occur smoothly, ensuring proper detection of the line signals. Mixel’s D-PHY is a complete PHY, silicon-proven at multiple foundries and multiple nodes. This MIPI PHY is fully integrated and has analog circuitry, digital, and synthesizable logic. Our D-PHY is built to support the MIPI Camera Serial Interface (CSI) and Display Serial Interface (DSI) using the PHY Protocol Interface (PPI). Mixel has provided this IP in many different configurations to accommodate different applications. The Universal Lane configuration can be used to support any allowed use-case, while other configurations are optimized for many different use cases such as Transmit only, Receive only, DSI, CSI, TX+ and RX+. Both TX+ and RX+ configurations support full-speed loopback operation without the extra area associated with a universal lane configuration.
The SPD5 Hub Function IP has been developed to interface I3C/I2C Host Bus and it allows an isolation of local devices like Temperature Sensor(TS), from master host bus. This SPD5 has Two wire serial interface like SCL, SDA
The agilePMU Subsystem is an efficient and highly integrated power management unit for SoCs/ASICs. Featuring a power-on-reset, multiple low drop-out regulators, and an associated reference generator. The agilePMU Subsystem is designed to ensure low power consumption while providing optimal power management capabilities. Equipped with an integrated digital controller, the agilePMU Subsystem offers precise control over start-up and shutdown, supports supply sequencing, and allows for individual programmable output voltage for each LDO. Status monitors provide real-time feedback on the current state of the subsystem, ensuring optimal system performance. Agile Analog designs are based on tried and tested architectures to ensure reliability and functionality. Our automated design methodology is programmatic, systematic and repeatable leading to analog IP that is more verifiable, more robust and more reliable. Our methodology also allows us to quickly re-target our IP to different process options. Our highly configurable and multi-node analog IP products are developed to meet the customer’s exact requirements. These digitally-wrapped and verified solutions can be seamlessly integrated into any SoC, significantly reducing complexity, time and costs.
The Veyron V2 CPU represents Ventana's second-generation RISC-V high-performance processor, designed for cloud, data center, edge, and automotive applications. This processor offers outstanding compute capabilities with its server-class architecture, optimized for handling complex, virtualized, and cloud-native workloads efficiently. The Veyron V2 is available as both IP for custom SoCs and as a complete silicon platform, ensuring flexibility for integration into various technological infrastructures. Emphasizing a modern architectural design, it includes full compliance with RISC-V RVA23 specifications, showcasing features like high Instruction Per Clock (IPC) and power-efficient architectures. Comprising of multiple core clusters, this CPU is capable of delivering superior AI and machine learning performance, significantly boosting throughput and energy efficiency. The Veyron V2's advanced fabric interconnects and extensive cache architecture provide the necessary infrastructure for high-performance applications, ensuring broad market adoption and versatile deployment options.
Overview: The DDR5 RCD Controller is a registering clock driver utilized in DDR5 RDIMMs and LRDIMMs. It buffers the Command/Address (CA) bus, chip selects, and clock signals between the host controller and DRAMs. Additionally, it establishes a BCOM bus to control data buffers in LRDIMMs. Key Features:  Compliance with JEDEC's JESD82-511  Maximum SCL Operating speed of 12.5MHz in I3C mode  DDR5 server speeds up to 4800MT/s  Dual-channel configuration with 32-bit data width per channel  Support for power-saving mechanisms  Rank 0 & rank 1 DIMM configurations  Loopback and pass-through modes  BCOM sideband bus for LRDIMM data buffer control  In-band Interrupt support  Packet Error Check (PEC)  CCC Packet Error Handling  Error log register  Parity Error Handling  Interrupt Arbitration  I2C Fast-mode Plus (FM+) and I3C Basic compatibility  Switch between I2C mode and I3C Basic  Clearing of Status Registers  Compliance with JESD82-511 specification  I3C Basic Common Command Codes (CCC) Applications:  RDIMM  LRDIMM  AI (Artificial Intelligence)  HPC (High-Performance Computing)  Data-intensive applications
Overview: The Camera ISP IP is an Image Signal Processing (ISP) IP developed for low-light environments in surveillance and automotive applications, supporting a maximum processing resolution of 13 Mega or 8Mega Pixels (MP) at 60 frames per second (FPS). It offers a configurable ISP pipeline with features such as 18x18 2D/8x6 2D Color Shading Correction, 19-Point Bayer Gamma Correction, Region Color Saturation, Hue, and Delta L Control functions. The ISP IP enhances image quality with optimal low-light Noise/Sharp filters and offers benefits such as low gate size and memory usage through algorithm optimization. The IP is also ARM® AMBA 3 AXI protocol compliant for easy control via an AMBA 3 APB bus interface. Specifications:  Maximum Resolution: o Image: 13MP/8MP o Video: 13MP @ 60fps / 8MP @ 60fps  Input Formats: Bayer-8, 10, 12, 14 bits  Output Formats: o DVP: YUV422, YUV444, RGB888 - 8, 10, 12 bits o AXI: YUV422, YUV444, YUV420, RGB888 - 8, 10, 12 bits  Interface: o ARM® AMBA APB BUS interface for ISP system control o ARM® AMBA AXI interface for data o Direct connection to sensor stream data (DVP) o Features:  Defective Pixel Correction: On-The-Fly Defective Pixel Correction  14-Bit Bayer Channel Gain Support: Up to x4 / x7.99 with Linear Algebra for Input Pixel Level Adjustment  Gb/Gr Unbalance Correction: Maximum Correction Tolerance Gb/Gr Rate of 12.5%  2D Lens-Shading Correction: Supports 18x18 / 8x6 with Normal R/Gb/Gr/B Channel Shading Correction and Color Stain Correction  High-Resolution RGB Interpolation: Utilizes ES/Hue-Med/Average/Non-Directional Based Hybrid Type Algorithm  Color Correction Matrix: 3x3 Matrix  Bayer Gamma Correction: 19 points  RGB Gamma Correction: 19 points  Color Enhancement: Hue/Sat/∆-L Control for R/G/B/C/M/Y Channels  High-Performance Noise Reduction: For Bayer/RGB/YC Domain Noise Reduction  High-Resolution Sharpness Control: Multi-Sharp Filter with Individual Sharp Gain Control  Auto Exposure: Utilizes 16x16 Luminance Weight Window & Pixel Weighting  Auto White Balance: Based on R/G/B Feed-Forward Method  Auto Focus: 2-Type 6-Region AF Value Return
Silicon Creations' SerDes Interfaces are crafted to handle high-speed data transmission challenges over varied processes, ranging from 12nm to 180nm. Addressing multiple protocols such as CPRI, PCIe, and SATA, these interfaces demonstrate flexibility by supporting data transmission speeds from 100 Mbps to beyond 32 Gbps. The architecture incorporates a host of advanced features including adaptive equalization techniques and programmable de-serialization widths, making it stand out in terms of performance and signal integrity even under challenging conditions. With ultra-low latency PMAs, they sustain excellent operational speed and efficiency, imperative for sophisticated communication applications. Moreover, Silicon Creations partners with leading entities to provide comprehensive solutions, including complete PCIe PHY integrations. This synergy ensures that SerDes Interfaces are fully optimized for operational excellence, delivering stable and reliable communication signals. With an emphasis on low power and minimized area requirements, they cater to burgeoning industry needs for power-efficient and space-conservative designs.
Silicon Creations delivers precision LC-PLLs designed for ultra-low jitter applications requiring high-end performance. These LC-tank PLLs are equipped with advanced digital architectures supporting wide frequency tuning capabilities, primarily suited for converter and PHY applications. They ensure exceptional jitter performance, maintaining values well below 300fs RMS. The LC-PLLs from Silicon Creations are characterized by their capacity to handle fractional-N operations, with active noise cancellation features allowing for clean signal synthesis free of unwanted spurs. This architecture leads to significant power efficiencies, with some IPs consuming less than 10mW. Their low footprint and high frequency integrative capabilities enable seamless deployments across various chip designs, creating a perfect balance between performance and size. Particular strength lies in these PLLs' ability to meet stringent PCIe6 reference clocking requirements. With programmable loop bandwidth and an impressive tuning range, they offer designers a powerful toolset for achieving precise signal control within cramped system on chip environments. These products highlight Silicon Creations’ commitment to providing industry-leading performance and reliability in semiconductor design.
Advanced Peripheral Bus (APB) is one of the Advanced Microcontroller Bus Architecture (AMBA) family protocols. It is a low-cost interface that is designed for low power consumption and interface simplicity. Unlike AHB, it is a non-pipelined protocol for connecting low-bandwidth peripherals. Mostly used to link external peripherals to the SOC. Every APB transfer requires at least two clock cycles (SETUP Cycle and ACCESS Cycle) to finish. The APB interface is designed for accessing the programmable control registers of peripheral devices. The APB protocol has two independent data buses, one for read data and one for write data. The buses can be 8, 16, or 32 bits wide. The read and write data buses must have the same width. Data transfers cannot occur concurrently because the read data and write data buses do not have their own individual handshake signals.
Leveraging a high-performance RISC architecture, the eSi-3250 32-bit core efficiently integrates instruction and data caches. This makes it compatible with designs utilizing slower on-chip memories such as eFlash. The core not only supports MMU for address translation but also allows for user-defined custom instructions, greatly enhancing its flexibility for specialized and high-performance applications.
Chimera GPNPU is engineered to revolutionize AI/ML computational capabilities on single-core architectures. It efficiently handles matrix, vector, and scalar code, unifying AI inference and traditional C++ processing under one roof. By alleviating the need for partitioning AI workloads between different processors, it streamlines software development and drastically speeds up AI model adaptation and integration. Ideal for SoC designs, the Chimera GPNPU champions an architecture that is both versatile and powerful, handling complex parallel workloads with a single unified binary. This configuration not only boosts software developer productivity but also ensures an enduring flexibility capable of accommodating novel AI model architectures on the horizon. The architectural fabric of the Chimera GPNPU seamlessly blends the high matrix performance of NPUs with C++ programmability found in traditional processors. This core is delivered in a synthesizable RTL form, with scalability options ranging from a single-core to multi-cluster designs to meet various performance benchmarks. As a testament to its adaptability, the Chimera GPNPU can run any AI/ML graph from numerous high-demand application areas such as automotive, mobile, and home digital appliances. Developers seeking optimization in inference performance will find the Chimera GPNPU a pivotal tool in maintaining cutting-edge product offerings. With its focus on simplifying hardware design, optimizing power consumption, and enhancing programmer ease, this processor ensures a sustainable and efficient path for future AI/ML developments.
The A25 processor model is a versatile CPU suitable for a variety of embedded applications. With its 5-stage pipeline and 32/64-bit architecture, it delivers high performance even with a low gate count, which translates to efficiency in power-sensitive environments. The A25 is equipped with Andes Custom Extensions that enable tailored instruction sets for specific application accelerations. Supporting robust high-frequency operations, this model shines in its ability to manage data prefetching and cache coherence in multicore setups, making it adept at handling complex processing tasks within constrained spaces.
Overview: Human eyes have a wider dynamic range than CMOS image sensors (CIS), leading to differences in how objects are perceived in images or videos. To address this, CIS and IP algorithms have been developed to express a higher range of brightness. High Dynamic Range (HDR) based on Single Exposure has limitations in recreating the Saturation Region, prompting the development of Wide Dynamic Range (WDR) using Multi Exposure images. The IP supports PWL companding mode or Linear mode to perform WDR. It analyzes the full-image histogram for global tone mapping and maximizes visible contrast in local areas for enhanced dynamic range. Specifications:  Maximum Resolution: o Image: 13MP o Video: 13MP @ 60fps (Input/Output)  Input Formats (Bayer): o HDR Linear Mode: Max raw 28 bits o Companding Mode: Max PWL compressed raw 24 bits  Output Formats (Bayer): 14 bits  Interface: o ARM® AMBA APB BUS interface for ISP system control o ARM® AMBA AXI interface for data o Video data stream interface Features:  Global Tone Mapping based on histogram analysis o Adaptive global tone mapping per Input Images  Local Tone Mapping for adaptive contrast enhancement  Real-Time WDR Output  Low Power Consumption and Small Gate Count  28-bit Sensor Data Interface
**Ceva-Waves Dragonfly platform** is a turnkey platform with optimized, low-power hardware IP and protocol software for implementing narrow-band IoT (NB-IoT) cellular modem SoCs. Extensions provide support for GNSS such as GPS and BeiDou and for sensor-fusion applications. The Ceva-Waves Dragonfly platform comprises hardware IP with an enhanced Ceva-BX1 processor, specific hardware accelerators, and SoC infrastructure IP. Software includes NB-IoT protocol stack for L1 through L3 functions including encryption and software PHY, a task-optimized RTOS, and optional GNSS receiver and control software, all executing on the Ceva-BX1. Pre-certified for 3GPP Release 15 CAT NB2, the solution is tuned for small footprint and extremely low power, yet has headroom for additional software-defined functions, such as sensor fusion. [**Learn more about Ceva-Waves Dragonfly>**](https://www.ceva-ip.com/product/ceva-waves-dragonfly/?utm_source=silicon_hub&utm_medium=ip_listing&utm_campaign=ceva_waves_dragonfly_page)
aiWare is a high-performance NPU designed to meet the rigorous demands of automotive AI inference, providing a scalable solution for ADAS and AD applications. This hardware IP core is engineered to handle a wide array of AI workloads, including the most advanced neural network structures like CNNs, LSTMs, and RNNs. By integrating cutting-edge efficiency and scalability, aiWare delivers industry-leading neural processing power tailored to automobile-grade specifications.\n\nThe NPU's architecture emphasizes hardware determinism and offers ISO 26262 ASIL-B certification, ensuring that aiWare meets stringent automotive safety standards. Its efficient design also supports up to 256 effective TOPS per core, and can scale to handle thousands of TOPS through multicore integration, minimizing power consumption effectively. The aiWare's system-level optimizations reduce reliance on external memory by leveraging local memory for data management, boosting performance efficiency across varied input data sizes and complexities.\n\naiWare’s development toolkit, aiWare Studio, is distinguished by its innovative ability to optimize neural network execution without the need for manual intervention by software engineers. This empowers ai engineers to focus on refining NNs for production, significantly accelerating iteration cycles. Coupled with aiMotive's aiDrive software suite, aiWare provides an integrated environment for creating highly efficient automotive AI applications, ensuring seamless integration and rapid deployment across multiple vehicle platforms.
Overview: RCCC and RCCB in ISP refer to Red and Blue Color Correction Coefficients, respectively. These coefficients are utilized in Image Signal Processing to enhance red and blue color components for accurate color reproduction and balance. They are essential for color correction and calibration to ensure optimal image quality and color accuracy in photography, video recording, and visual displays. The IP is designed to process RCCC pattern data from sensors, where green and blue pixels are substituted by Clear pixel, resulting in Red or Clear (Monochrome) format after demosaicing. It supports real-time processing with Digital Video Port (DVP) format similar to CIS output. RCCB sensors use Clear pixels instead of Green pixels, enhancing sensitivity and image quality in low-light conditions compared to traditional RGB Bayer sensors. LOTUS converts input from RCCB sensors to a pattern resembling RGB Bayer sensors, providing DVP format interface for real-time processing. Features:  Maximum Resolution: 8MP (3840h x 2160v)  Maximum Input Frame Rate: 30fps  Low Power Consumption  RCCC/RCCB Pattern demosaicing
SAKURA-II AI Accelerator represents EdgeCortix's latest advancement in edge AI processing, offering unparalleled energy efficiency and extensive capabilities for generative AI tasks. This accelerator is designed to manage demanding AI models, including Llama 2, Stable Diffusion, DETR, and ViT, within a slim power envelope of about 8W. With capabilities extending to multi-billion parameter models, SAKURA-II meets a wide range of edge applications in vision, language, and audio. The SAKURA-II's architecture maximizes AI compute efficiency, delivering more than twice the utilization of competitive solutions. It boasts remarkable DRAM bandwidth, essential for large language and vision models, while maintaining low power consumption. The hardware supports real-time Batch=1 processing, demonstrating its edge in performance even in constrained environments, making it a choice solution for diverse industrial AI applications. With 60 TOPS (INT8) and 30 TFLOPS (BF16) in performance metrics, this accelerator is built to exceed expectations in demanding conditions. It features robust memory configurations supporting up to 32GB of DRAM, ideal for processing intricate AI workloads. By leveraging sparse computing techniques, SAKURA-II optimizes its memory and bandwidth usage effectively, ensuring reliable performance across all deployed applications.
xcore.ai is XMOS Semiconductor's innovative programmable chip designed for advanced AI, DSP, and I/O applications. It enables developers to create highly efficient systems without the complexity typical of multi-chip solutions, offering capabilities that integrate AI inference, DSP tasks, and I/O control seamlessly. The chip architecture boasts parallel processing and ultra-low latency, making it ideal for demanding tasks in robotics, automotive systems, and smart consumer devices. It provides the toolset to deploy complex algorithms efficiently while maintaining robust real-time performance. With xcore.ai, system designers can leverage a flexible platform that supports the rapid prototyping and development of intelligent applications. Its performance allows for seamless execution of tasks such as voice recognition and processing, industrial automation, and sensor data integration. The adaptable nature of xcore.ai makes it a versatile solution for managing various inputs and outputs simultaneously, while maintaining high levels of precision and reliability. In automotive and industrial applications, xcore.ai supports real-time control and monitoring tasks, contributing to smarter, safer systems. For consumer electronics, it enhances user experience by enabling responsive voice interfaces and high-definition audio processing. The chip's architecture reduces the need for exterior components, thus simplifying design and reducing overall costs, paving the way for innovative solutions where technology meets efficiency and scalability.
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