ViaExpert is engineered for the 3D full-wave electromagnetic simulation of vias, vital for maintaining signal integrity in high-speed transmission channels. This tool is central to analyzing how vias affect key parameters, including differential and return loss. Built with multiple pre-simulation and layout editing templates, ViaExpert supports the precise modeling of solder balls, teardrops, and other complex via structures. Its ability to modify simulation environments in a 2D window and support for custom restriction zones make it indispensable for detailed via analysis. By integrating FEM3D solvers, it delivers fast, accurate results across varied structural simulations.
