The Xinglian-700 Interconnect Fabric extends the capabilities of its predecessor by offering high scalability and exceptional performance tailored for extensive multicore systems. Supporting up to 256 CPU cores, this fabric IP is pivotal in building high-density computational infrastructures capable of handling intensive data processing tasks across various domains such as AI, analytics, and enterprise computing.
Engineered to facilitate rapid connectivity and improved throughput, the Xinglian-700 enhances system efficiency by ensuring consistent data flow between CPU clusters, I/O, and DDR components. This interconnect fabric employs a sophisticated network-on-chip (NoC) approach that prioritizes memory coherence and system reliability, even under heavy load conditions.
The fabric's design allows it to support a wide array of technological applications, from large-scale data centers to AI-driven analysis, making it a versatile tool for enterprises aiming to scale their processing capabilities. By optimizing data paths and reducing latency, the Xinglian-700 sets a benchmark for interconnect systems, bolstering the efficiency of complex computational environments.
