All IPs > Analog & Mixed Signal > Analog Subsystems
Analog subsystems are a critical component in modern semiconductor IPs, offering essential functions for converting real-world signals into a form that digital systems can process. These modules are responsible for amplifying, filtering, and converting analog signals, ensuring that they are suitable for further digital processing. At Silicon Hub, our catalog of analog subsystem IPs provides the building blocks needed to develop sophisticated electronic systems, facilitating seamless integration with digital components.
Incorporating analog subsystems is pivotal in a wide array of electronics, from consumer gadgets like smartphones and tablets to industrial devices and automotive systems. These subsystems are crucial in handling audio signals, managing sensor inputs, and processing power management tasks. Analog to Digital Converters (ADCs), Digital to Analog Converters (DACs), Phase-Locked Loops (PLLs), and Voltage Regulators are just a few examples of the integral components you can find within our analog subsystem offerings.
The complexity of analog design can often present challenges, which is why opting for pre-designed analog subsystem semiconductor IP can significantly reduce development time, lower costs, and improve reliability. By utilizing these specialized IPs, designers can focus on optimizing the digital sections of their projects, knowing that the analog components are robust and optimized for performance. This integration allows for faster time-to-market and aligns with the increasing demand for highly integrated, mixed-signal systems.
In the dynamic field of electronics design, analog subsystems semiconductor IPs play a vital role in bridging the gap between the analog world and digital processing realms, ensuring that the signals are accurately sampled and reproduced for high-fidelity applications. Silicon Hub provides a comprehensive selection of these critical components, essential for any modern electronic design aiming for excellence in both performance and efficiency.
The agilePMU Subsystem is an efficient and highly integrated power management unit for SoCs/ASICs. Featuring a power-on-reset, multiple low drop-out regulators, and an associated reference generator. The agilePMU Subsystem is designed to ensure low power consumption while providing optimal power management capabilities. Equipped with an integrated digital controller, the agilePMU Subsystem offers precise control over start-up and shutdown, supports supply sequencing, and allows for individual programmable output voltage for each LDO. Status monitors provide real-time feedback on the current state of the subsystem, ensuring optimal system performance. Agile Analog designs are based on tried and tested architectures to ensure reliability and functionality. Our automated design methodology is programmatic, systematic and repeatable leading to analog IP that is more verifiable, more robust and more reliable. Our methodology also allows us to quickly re-target our IP to different process options. Our highly configurable and multi-node analog IP products are developed to meet the customer’s exact requirements. These digitally-wrapped and verified solutions can be seamlessly integrated into any SoC, significantly reducing complexity, time and costs.
Silicon Creations' Analog Glue solutions provide essential analog functionalities to complete custom SoC designs seamlessly. These functional blocks, which constitute buffer and bandgap reference circuits, are vital for seamless on-chip clock distribution and ensure low-jitter operations. Analog Glue includes crucial components such as power-on reset (POR) generators and bridging circuits to support various protocols and interfaces within SoCs. These supplementary macros are crafted to complement existing PLLs and facilities like SerDes, securing reliable signal transmission under varied operating circumstances. Serving as the unsung heroes of chip integration, these Analog Glue functions mitigate the inevitable risks of complex SoC designs, supporting efficient design flows and effective population of chip real estate. Thus, by emphasizing critical system coherency, they enhance overall component functionality, providing a stable infrastructure upon which additional system insights can be leveraged.
This ADC features a 12-bit resolution and a sampling rate up to 1 MSPS, making it suitable for precise analog-to-digital conversions in various applications. It is designed to deliver high-performance data acquisition while maintaining power efficiency. This single-channel converter supports enhanced signal processing capabilities, catering to applications that demand reliable and accurate digital representation of analog signals. The ADC integrates seamlessly into custom IC designs and can be utilized in sectors such as industrial automation and medical devices.
The Bandgap offering from SkyeChip is a precise voltage reference circuit aimed at maintaining stability across variations in temperature and power supply. This analog IP delivers a consistent output voltage of about 0.9V with minimal deviation, making it crucial for applications requiring stability across a wide temperature range from -40C to 125C. Its low power consumption and robust design suit a variety of circuits where voltage stability is critical. The Bandgap circuit ensures effective performance in diverse conditions, contributing to the reliability and accuracy of the systems it supports.
The AFX010x Product Family is a sophisticated lineup of analog front-end ICs designed for benchtop and portable data-acquisition systems. Each product within this family boasts up to four channels, delivering resolutions up to 16-bit and sampling rates up to 5 GS/s. A key feature is the digitally-selectable 3dB bandwidth, ranging up to 300MHz, complemented by an integrated single-to-differential amplifier and offset DAC. This family represents cutting-edge innovation, tailored for applications demanding minimal power consumption, superior signal fidelity, high sampling frequencies, broad bandwidth, and heightened integration levels. Each channel is meticulously designed, encompassing programmable input capacitance, a programmable gain amplifier (PGA) for single-ended to differential outputs, an offset DAC, an ADC, and an integrated digital processor. The compact design of these solutions, housed in a standard 12 mm × 12 mm, 196-Ball BGA package, ensures easy integration with existing systems. An integral part of these products is the SCCORETM technology, which significantly cuts down on PCB space and slashes power requirements by up to 50%. These AFEs achieve standardization with features such as an on-chip clock synthesizer and voltage reference, combined with low power usage of 425 mW per channel at peak sampling rates. They support various high-resolution data acquisition applications, enabling versatile use in USB & PC-based oscilloscopes, benchtop digital storage oscilloscopes, and more complex diagnostic tools.
The Aeonic Integrated Droop Response System is designed to enhance droop and DVFS response for integrated circuits. It includes multi-threshold droop detection and fast adaptation times, ensuring power savings and optimal system performance. This technology provides extensive observability and integrates standard interfaces like APB & JTAG, aiding silicon health management by delivering data-driven insights for lifecycle analytics.
Vantablack S-VIS is a revolutionary space-qualified coating renowned for its unparalleled ability to suppress stray light. This is crucial for enhancing the performance and precision of optical instruments used in space applications. With its spectrally flat absorption capabilities extending from the UV range to the near-millimeter (THz) range, Vantablack S-VIS significantly improves light absorption, reducing interference and enhancing image quality. The coating has demonstrated exceptional performance in harsh environments, thriving under the intensity of solar, lunar, and terrestrial light in a zero-gravity context. Its deployment has resulted in lighter and smaller calibration systems and baffles, which is critical for space-bound equipment where size and weight are significant constraints. These coatings enhance emissivity across the IR spectrum, making them ideal for blackbody calibration in IR cameras and other sensitive optical systems. Since its initial deployment in low Earth orbit, the Vantablack S-VIS has amassed a significant track record of success in space missions. It possesses excellent thermal stability and is resistant to radiation and extreme vibrational forces, ensuring reliability and longevity in challenging space conditions. These attributes, coupled with its lightweight nature, make Vantablack S-VIS an optimal choice for advanced space imaging technologies.
Thermal Oxide is a foundational dielectric layer utilized in various semiconductor devices. When properly developed using high purity, low defect silicon substrates, Thermal Oxide serves as an excellent insulator. The application of Thermal Oxide includes its use as a 'field oxide', which can electrically isolate different conductive films such as polysilicon and metal from the silicon substrate. Furthermore, it is integral as a 'gate oxide' within devices, providing the necessary dielectric layer.\n\nManufacturing of Thermal Oxide involves oxidizing silicon wafers in high-temperature furnaces, with standard processes occurring between 800 and 1050 degrees Celsius. This method involves housing the wafers in quartz glass tubes that can withstand the high thermal requirements, ensuring minimal risk of cracking or warping during processing due to its inherent stability.\n\nThe Thermal Oxide process at NanoSILICON involves both wet and dry oxidation methods, utilizing ultra-high purity sources. The process enables the precise control of oxide thickness and uniformity, confirmed by advanced measurement tools such as the Nanometrics 210. This ensures that the resulting layers have uniform thickness across and within wafers, critical for the device's performance and reliability.\n\nNanoSILICON's expertise in Thermal Oxide Processing results in layers ranging from 500 to 100,000 Å, with carefully maintained process controls for thickness variation and uniformity. It is integral to various applications in the semiconductor industry, supported by their highly specialized equipment and meticulous quality assurance processes.
The Analog I/O solutions from Certus Semiconductor are crafted to deliver exceptional performance in handling a wide range of electronic signals. These solutions provide ultra-low capacitance and robust ultra ESD protection, essential for safeguarding sensitive components against electrostatic discharge while maintaining signal integrity. Such protection is vital for high-speed data transfers and RF applications, where it minimizes impedance mismatches and maintains accurate signal transmission. Certus Semiconductor's Analog I/O offerings include comprehensive ESD and power clamp integrations, essential for high-frequency and power-efficiency demand in various applications. These include GSG/GSPSG RF macro cells, which offer tolerance for wide signal swings, crucial for maintaining performance in high-frequency domains and fluctuating environments. Designed with versatility in mind, these Analog I/O solutions are adaptable for integration into a broad array of processes and platforms, ranging from low- to high-voltage applications. The capability to integrate into RF networks while ensuring minimal interference with existing signal paths makes these solutions a preferred choice for engineers looking to enhance signal performance and reliability.
The agilePVT Sensor Subsystem is a low power integrated macro consisting of Process, Voltage and Temperature sensors, and associated reference generator, for on-chip monitoring of a device's physical, environmental, and electrical characteristics. The monitoring of process, voltage and temperature variations are critical to optimize power and performance for modern SoCs/ASICs, especially for advanced node and FinFET processes. Equipped with an integrated digital controller, the agilePVT Subsystem offers precise control over start-up and shutdown. Status monitors provide real-time feedback on the current state of the subsystem, ensuring optimal system performance over the full product lifecycle. Agile Analog designs are based on tried and tested architectures to ensure reliability and functionality. Our automated design methodology is programmatic, systematic and repeatable leading to analog IP that is more verifiable, more robust and more reliable. Our methodology also allows us to quickly re-target our IP to different process options. Our highly configurable and multi-node analog IP products are developed to meet the customer’s exact requirements. These digitally-wrapped and verified solutions can be seamlessly integrated into any SoC, significantly reducing complexity, time and costs.
The aLFA-C product is an advanced interfacing ASIC designed for space applications, specifically for infrared readout ICs (ROICs) and other image sensors. It integrates much of the typical front-end electronics infrastructure in a single solution, offering versatility through features such as operation on a single unregulated supply using onboard LDOs and regulators, and compatibility with external clocks or crystal oscillators. Communication with external devices is achieved via a SpaceWire interface, and a programmable sequencer with 8 levels of nesting enhances the control towards the ROIC. Capable of handling 32 programmable digital outputs, the aLFA-C also allows the customization of input thresholds and output formats, supporting CMOS, LVDS, and CML. Its analog acquisition system includes 32 signal channels plus 4 reference channels, each with differential or single-ended input capability and 16-bit ADC resolution. The ADCs are equipped with features like calibration and post-correction, supporting various configurations for enhanced speed and performance. Additionally, the aLFA-C provides several programmable voltage sources and current outputs, accompanied by measurement capabilities for resistance, voltage, and current, making it extremely flexible for a wide range of applications. Its design is robust against radiation, exhibiting tolerance against TID, SEU, and SEL, and operates efficiently in temperatures from 35K to 330K, making it ideal for the harsh environments of space.
The eSi-Analog portfolio is crafted to integrate vital analog functions into custom ASICs and SoCs, optimized for a variety of applications. This low-power and silicon-proven technology adapts to meet specific project requirements, blending seamlessly with leading foundry processes. The analog IPs can include amplifiers, A/D and D/A converters, and other critical components. These IPs are fully flexible, adaptable, and provided with significant configurability, ensuring that custom specifications can be met with precision. This tailored approach supports a range of sectors from automotive to healthcare, enabling critical analog functionalities in compact and power-efficient designs.
The Terefilm Photopolymer is a groundbreaking material designed to tackle key challenges in semiconductor manufacturing, such as precision mass transfer and high-resolution photolithography. This innovative material balances precise patternability with clean decomposition, making it ideal for applications that demand high accuracy and stringent cleanliness standards in production. Terefilm offers exceptional thermal stability, remaining intact at temperatures up to 180°C before UV exposure. Once exposed to low-energy UV irradiation, the decomposition temperature drops significantly, facilitating a low-energy vaporization process. This unique feature allows Terefilm to integrate seamlessly into high-temperature process flows, making it incredibly versatile in manufacturing settings. One of the key advantages of Terefilm is its ability to decompose completely into gaseous products, leaving no residue. This results in a cleaner and more efficient manufacturing process, eliminating the need for subsequent cleaning steps commonly associated with other solutions. Terefilm's precise patterning capabilities allow for controlled decomposition, ensuring uniform activation and vaporization over targeted areas, which is essential for reliable and repeatable semiconductor manufacturing processes.
The agileSensorIF Subsystem is an efficient and highly integrated sensor interface for SoCs/ASICs. Featuring multiple Analog-to-Digital converters (agileADC), Digital-to-Analog converter (agileDAC), low-power programmable analog comparators (agileCMP_LP), and an associated reference generator (agileREF). The agileSensorIF Subsystem enables easy interaction with the analog world. The components within the subsystem can be customized to suit a variety of applications. This includes selecting the number of agileADC, agileDAC and agileCMP_LP blocks, as well as their bit depth and sample rate. This allows the agileSensorIF Subsystem to be perfectly tailored to your exact needs and use case. Status monitors provide real-time feedback on the current state of the subsystem, ensuring optimal system performance. Agile Analog designs are based on tried and tested architectures to ensure reliability and functionality. Our automated design methodology is programmatic, systematic and repeatable leading to analog IP that is more verifiable, more robust and more reliable. Our methodology also allows us to quickly re-target our IP to different process options. Our highly configurable and multi-node analog IP products are developed to meet the customer’s exact requirements. These digitally-wrapped and verified solutions can be seamlessly integrated into any SoC, significantly reducing complexity, time and costs.
The agileSMU Subsystem is a low power integrated macro consisting of the essential IP blocks required to securely manage waking up a SoC from sleep mode. Typically containing a programmable oscillator for low frequency SoC operation including a RTC, a number of low power comparators which can be used to initiate the wake-up sequence, and a power-on-reset which provides a robust, start-up reset to the SoC. Equipped with an integrated digital controller, the agileSMU Subsystem offers precise control over wake-up commands and sequencing. Status monitors provide real-time feedback on the current state of the subsystem, ensuring optimal system performance over the full product lifecycle. Agile Analog designs are based on tried and tested architectures to ensure reliability and functionality. Our automated design methodology is programmatic, systematic and repeatable leading to analog IP that is more verifiable, more robust and more reliable. Our methodology also allows us to quickly re-target our IP to different process options. Our highly configurable and multi-node analog IP products are developed to meet the customer’s exact requirements. These digitally-wrapped and verified solutions can be seamlessly integrated into any SoC, significantly reducing complexity, time and costs.
The SMS Fully Integrated Gigabit Ethernet & Fibre Channel Transceiver Core offers a highly efficient PHY solution for high-speed data transmission. It is designed with a versatile architecture that supports gigabit Ethernet and Fibre Channel standards, focusing on achieving low latency and high data integrity. This core showcases comprehensive integrated systems, including high-speed drivers and clock recovery techniques, which are crucial for achieving optimal signal clarity and reducing jitter. A key aspect of this transceiver is its compatibility with IEEE 802.3z standards for gigabit Ethernet, making it an ideal choice for applications requiring robust connectivity solutions. The design leverages advanced phase detectors and proprietary signal processing methods to enhance performance by minimizing errors and noise in the transmission path. This core is particularly suitable for environments that demand high reliability and performance consistency, such as data centers and network infrastructure. The SMS transceiver also supports a wide range of operational conditions, thanks to its flexible interface design and low power consumption. Its modular architecture allows easy customization to meet specific application needs, ensuring it can be seamlessly integrated into larger system-on-chip (SoC) applications. This transceiver core represents a blend of cutting-edge technology and practical application design, aiding in the deployment of next-generation communication systems.
IMEC's Monolithic Microsystems offer a leap forward in integrating complex electronic systems onto a single chip. These systems are developed to meet the growing demand for miniaturization, performance, and multifunctionality in electronics, particularly significant for industries looking to enhance device sophistication without expanding physical footprint. Monolithic Microsystems are pivotal in applications ranging from consumer electronics to industrial automation, where space efficiency and performance are key. The innovation lies in the seamless integration of multiple components into a single monolith, significantly reducing interconnections and enhancing signal integrity. This approach not only streamlines the manufacturing process but also boosts reliability and enhances the system’s overall performance. The small form factor and high functionality make it a preferred choice for developing smarter, interconnected devices across various high-tech sectors. These microsystems are specifically engineered to cater to advanced applications such as wearable technology, smart medical devices, and sophisticated sensors. By marrying advanced materials with innovative design paradigms, IMEC ensures that these microsystems can withstand challenging operating conditions, offering robustness and longevity. Further, the monolithic integration allows for new levels of device intelligence and integration, facilitating the growth of next-generation electronics tailored to specific industry needs.
This integrated solution combines a 24-bit sigma-delta ADC with an analog front-end (AFE), designed for high-precision data conversion with minimal signal distortion. Such a configuration excels in applications that demand high-fidelity audio processing or precise sensor data acquisition. The sigma-delta architecture of the ADC ensures excellent resolution and accuracy, which is vital for capturing subtle changes in the input signal. Meanwhile, the integrated AFE allows for flexible interfacing with a variety of sensor types, reducing the complexity and cost of external circuitry.
ELFIS2 is a versatile image sensor designed to cope with challenging environments, with its high reliance on radiation-hardened features. This sensor is characterized by its true high dynamic range (HDR) capabilities, making it optimal for applications requiring accurate light detection across a broad range of intensities. The ELFIS2 features motion artifact-free (MAF) operation, a critical attribute for high-fidelity imaging. Built with a global shutter and back-side illumination (BSI), the sensor ensures all pixels capture light simultaneously, which is vital for sharp images devoid of motion blur. The BSI technology further enhances its sensitivity by allowing more light to reach the photodiode, a crucial feature for low-light conditions or fast imaging demands. With its SEL/SEU radiation-hardened design, the ELFIS2 is tailored for environments exposed to high radiation levels, like space or certain industrial settings. This resiliency, coupled with its innovative design, makes ELFIS2 suitable for complex imaging tasks, capturing high-quality images without compromising performance.
ParkerVision's Energy Sampling Technology is built on its revolutionary RF receiver solutions, which are pivotal in transforming traditional super-heterodyne approaches to more efficient direct conversion methodologies. This technology is designed to offer exceptional sensitivity, bandwidth, and dynamic range while minimizing the need for RF signal division. As a result, it reduces power consumption and improves demodulation accuracy. The technology's compact design is well-suited for integration into CMOS technologies, enabling further miniaturization and cost reduction of RF components. The use of energy sampling allows for more precise signal processing, which is crucial for maintaining high data rates and robust operation under varying environmental conditions. Technologies utilizing this approach can efficiently operate across a broad spectrum of signal strengths, which is ideal for devices moving between different network zones. Given its adaptability, the Energy Sampling Technology is applicable in various sectors, including mobile handsets, modems, and tablets, supporting multiple standards like GSM, EDGE, CDMA, UMTS, and LTE. By pioneering a matched-filter correlator for frequency down-conversion, ParkerVision's technology provides unparalleled performance in selectivity and interference rejection. The removal of redundancy in signal processing pathways facilitates a reduction in silicon area used, further optimizing costs and efficiency in the design of modern wireless devices, making it indispensable for next-generation communication products.
This Analog Front End (AFE) supports the EPC Gen 2 UHF standard, providing the necessary interface for analog signal processing in RFID systems. The AFE manages essential tasks such as modulation and demodulation, signal amplification, and data conversion, ensuring seamless interaction with the digital protocol engine. Its ability to maintain signal integrity and quality across varying conditions makes it a critical component in the reliable operation of RFID technologies.
Support Circuit solutions from Analog Circuit Works are pivotal for facilitating robust design within integrated circuits, ensuring early success right from the transistor level. This technology includes an array of customizable support systems rapidly tailored to specific project needs. Offering reliability and precision, these circuits seamlessly integrate with other IP options from Analog Circuit Works, guaranteeing comprehensive solutions that deliver first silicon success and augment product viability in the competitive IC market.
This versatile ADC is built on Samsung's 100nm LF6 CMOS technology, providing a wide operating range suitable for various applications. With an input range from the analog ground to the supply voltage, this ADC is ideal for dynamic environments. It supports a conversion rate of 1 MHz at supply voltages between 3.6V and 5.5V, scaling down to 400 kHz at lower supply levels. This ADC also features 16-channel single-ended inputs and delivers exceptional signal integrity with an SFDR of 83.6dB.
This RF front-end is tailored for satellite reception beam-forming applications in the Ku band, operating between 11-13 GHz. It offers exceptional performance in terms of precision and efficiency, crucial for satellite communication systems that require robust signal processing capabilities. The design integrates seamlessly into phased array systems, ensuring reliable operation across various environmental conditions. Notably, this front-end module is engineered to support high integration levels, reducing space and power requirements while maintaining superior performance. By optimizing the signal reception process, it minimizes noise and signal loss, which are vital for achieving high-quality data transmission and reception. Utilized in advanced communication systems, this RF front-end leverages cutting-edge RFIC technology, positioning itself as an essential component for modern satellite communications that demand uncompromising signal clarity and operational accuracy.
The Analog/Mixed-Signal IC from Akronic is designed to meet the evolving demands of modern telecommunication and radar systems. This product excels in integrating various signal conversion and frequency synthesis functions, which are crucial for high-capacity data transmission and precise signal modulation. The IC employs sophisticated low-pass filters like Chebyshev and Butterworth to ensure optimal signal integrity and minimal distortion across a wide range of frequencies. Akronic's Analog/Mixed-Signal IC is notable for its versatile performance in base-band functions such as voltage references and gain-control operations. This versatility is underpinned by advanced components like power detectors and RSSI AGC loops, which contribute to maintaining consistent signal quality. The IC is also adept at handling high-speed ADCs and DACs, with a focus on achieving high cut-off frequencies exceeding 1GHz. One of the defining features of this IC is its frequency synthesis capability, supported by both fractional and integer-N PLLs and various reference divide and multiplier configurations. The IC's design incorporates multi-modulus prescalers, MASH, PFDs, and sophisticated loop filters, alongside highly stable VCOs and advanced ALC mechanisms. With these features, Akronic offers a robust solution for applications requiring precise frequency control and modulation.
The Bandgap Voltage Reference is a pivotal component in ensuring stable voltage outputs across a range of environmental conditions. Delivering a precise reference output of 1.2V, the design focuses on achieving high stability by compensating for temperature variations and line voltage shifts, thus ensuring consistency in reference accuracy. Integrated into multiple voltage and node applications, this reference is tailored to support diverse circuits requiring precise voltage regulation. Its design incorporates output current capability and temperature compensation, making it adaptable to various configurations. Suitable for a spectrum of applications, from consumer electronics to automotive systems, this bandgap reference integrates seamlessly into environments where short-term response and long-term stability are crucial, helping to maintain operational reliability and efficiency in complex systems.
This programmable low-noise 0.55V Band-Gap Reference is developed using TSMC 40nm technology, focusing on providing stable voltage with minimal noise interference. Its small area of 0.03 sq-mm and consumption of 0.5 mA makes it suitable for portable devices and systems where energy efficiency is critical. This GDSII-ready component underscores Tetrivis's commitment to creating components that enhance circuit reliability and performance.
The OT0120t180 is a micro power bandgap reference intended for TSMC's 180nm technology. This IP delivers precision voltage reference outputs, crucial for various analog and mixed-signal IC applications. With a focus on ultra-low power consumption, it ensures minimal supply current usage, which is critical for battery-operated and low-power electronic devices. Its design is optimized for stability under temperature variations, maintaining accuracy across a wide range of operating conditions. The IP is well-suited for integration in complex systems requiring dependable reference voltages, such as in sensor interfaces and power management circuits. The OT0120t180 features a scalable architecture to fit diverse product needs while ensuring compatibility with TSMC's widely used 180nm process. This makes it an adaptable component for designers seeking to incorporate precise reference voltage solutions into their semiconductor designs.
GreenPAK products are versatile and cost-effective non-volatile memory programmable devices that are designed to minimize the component count, conserve board space, and reduce power consumption in electronic circuits. With the use of GreenPAK Designer Software and its Development Kit, designers have the capability to swiftly design and program a variety of custom circuit solutions. GreenPAK represents a step forward in programmable mixed-signal integrated circuits, offering unprecedented flexibility for custom designs. Renesas' GreenPAK portfolio includes a wide array of configurable mixed-signal ICs that enable sophisticated data processing and design customization. These devices provide superior analog features such as ADCs (analog-to-digital converters) and DACs (digital-to-analog converters), which are crucial in mixed-signal design scenarios. By incorporating these elements, GreenPAK devices cater to a multitude of applications in a compact and efficient form. The GreenPAK series is designed with an emphasis on user-friendliness and versatility, allowing companies to innovate quickly without the need for extensive hardware alterations. This not only facilitates rapid prototyping but also significantly reduces time to market, giving businesses a competitive edge in cost-sensitive applications.
IQ Analog offers a suite of advanced digital transceiver technology IP cores designed to achieve exceptional performance with lower power consumption. These cores are integral components of larger, multi-core macros that combine functionalities like Analog-to-Digital Conversion, Digital-to-Analog Conversion, Phase-Locked Loops, Power Supply Regulation, and Digital Signal Processing. By integrating these mixed-signal functions, IQ Analog creates comprehensive solutions that clients can license and integrate into their own System-on-Chip products. The IP cores are designed to address the needs of the future, providing significant performance gains and cost benefits for emerging technologies. Particularly relevant for both defense radar and commercial 5G markets, these cores enable faster market deployment of high-performance solutions. The company emphasizes its commitment to using its IP to enhance bandwidth capabilities and increase sample rates, in line with the demands of modern communication systems. IQ Analog's data conversion IP cores are part of an ongoing commitment to digital innovation, offering customers access to the world's highest performance options in their field. The integration into larger mixed-signal solutions exemplifies the company's strategic approach to IP development, ensuring that they remain at the forefront of semiconductor technology innovations.
logiISP-UHD is an ultra-high-definition image signal processing pipeline designed for advanced video inputs in embedded systems based on AMD SoC and FPGA platforms. This core delivers stellar performance for UHD video, including 4K2Kp60, ensuring superior image quality enhancements for demanding video applications. This IP core is especially suited for applications requiring precise digital signal processing, such as broadcasting, security cameras, and advanced driver assistance systems. By supporting various AMD platforms, it ensures compatibility and ease of integration, facilitating rapid development cycles while maintaining high-quality video processing standards. Developers benefit from logiISP-UHD's comprehensive SDKs and support, enabling them to push the boundaries of video processing technology effortlessly. Its design ensures streamlined pipelines capable of handling intensive video tasks with minimal lag, offering scalability across a broad range of industries and applications.