All IPs > Analog & Mixed Signal > Oversampling Modulator
The Oversampling Modulator category within Silicon Hub's Analog & Mixed Signal section houses a comprehensive range of semiconductor IPs specially designed to improve signal resolution and processing in high-performance integrated circuits. These IP solutions are integral in the conversion of analog signals into digital formats, utilizing advanced techniques to achieve superior resolution and reduce quantization noise. An oversampling modulator essentially increases the signal-to-noise ratio (SNR) by sampling the signal at a higher rate than the Nyquist frequency, which is paramount for applications requiring high fidelity data conversion.
Oversampling modulators are a critical component in the design and development of devices that demand precise digital representation of analog inputs, such as in high-end audio equipment, instrumentation, and communications systems. These systems often require robust performance characteristics to handle complex signals with minimal distortion and loss. By utilizing semiconductor IPs in this category, developers can streamline their design process, reduce time-to-market, and optimize the performance of their signal processing applications.
In products ranging from digital audio converters to advanced communication transceivers, oversampling modulator semiconductor IPs provide the necessary tools for achieving precise analog-to-digital and digital-to-analog conversion, while maintaining data integrity. They are particularly useful in applications that necessitate the suppression of noise and the enhancement of dynamic range, where audio and data quality are paramount. In addition, these modulators can also play a role in reducing system power consumption, thus contributing to the development of energy-efficient solutions.
Our selection of oversampling modulator semiconductor IPs at Silicon Hub caters to a broad spectrum of needs within various industries. Whether you are developing consumer electronics, automotive systems, or medical devices, our library of IPs offers versatile solutions capable of adapting to the unique requirements of specialized applications. Empower your development projects with our state-of-the-art modulator IP offerings to ensure exceptional signal processing and conversion capabilities in your innovative designs.
This innovative chiplet offers a complete transmission solution, integrating a 16-channel 112G modulator and driver. The chip is designed for optimal performance in transmitting optical signals and features advanced digital control for precision tuning and stability. It is built to support systems requiring high bandwidth and efficient modulation, making it ideal for deployment in next-generation telecommunication networks. The combination of integrated modulator and driver ensures reduced power consumption and higher signal integrity, addressing the needs of modern data center applications.
The MVDP2000 series is engineered to deliver high sensitivity in differential pressure measurement using proprietary capacitive technology. This series is specifically designed for applications that demand precision and low power use, excelling in environments such as healthcare, HVAC, and industrial settings. It provides fast and accurate pressure readings while maintaining low energy consumption, making it suitable for portable and OEM devices where efficiency and quick response are essential.
The TW330 Image Warping IP utilizes advanced GPU processing technology to offer high-performance image distortion correction. It features extensive capabilities including coordinate transformation, any-shape image transformations, and supports resolutions up to 16K x 16K for both RGB and YUV formats. Ideal for digitally correcting images distorted by wide-angle or fish-eye lenses on various devices, this technology is key in fields such as automotive display systems, VR/AR devices, and high-definition projectors. It makes real-time, on-the-fly image correction feasible, elevating the quality of visual outputs for demanding applications. Through its flexible and efficient design, TW330 enables seamless integration into systems requiring dynamic and precise image modification capabilities, paving the way for developing more interactive and immersive visual experiences.
ISPido is a robust and fully configurable Image Signal Processing (ISP) pipeline designed for high-end image processing needs. It is implemented in RTL and utilizes the AXI4-LITE protocol for flexibility. The pipeline is equipped with comprehensive features including defective pixel correction, color filter array interpolation, and color space conversion. It supports resolutions up to 7680×7680 and complies with AMBA AXI4 standards, addressing modern image processing challenges efficiently. This ISP handles inputs of 8, 10, or 12 bits depth, making it highly adaptable to different processing requirements. It features modules for statistics collection, auto-white balance, gamma correction, and high dynamic range (HDR) support. These enhancements enable users to achieve precise and accurate image quality with maximum efficiency. Furthermore, the ISPido pipeline supports YUV color conversion and chroma subsampling, ensuring compatibility with various output formats like 4:2:2 and 4:2:0. Its design ensures seamless integration into existing systems, optimizing resources while offering high-quality image output.
Presto Engineering offers a comprehensive range of foundational and platform-specific semiconductor IPs designed to meet diverse application needs. The Foundation IP includes a wide array of vital circuit blocks, such as high-accuracy sensors, digital controllers, and interface blocks. These fundamental IPs aim to reduce ASIC development risks by leveraging proven components like secure encryption blocks with low power consumption or analog front ends with enhanced specific capabilities. The Platform IPs, on the other hand, provide extensive customization options from functional design to optimized power efficiency. Users can expect specialized analog front ends tailored to demanding specifications such as high-dynamic optical handling, ultra-low-power motion ISP, and MCU integration. Moreover, RFID/NFC/UHF/ISM connectivity solutions are part of this lineup, all of which contribute to efficient energy management and harvesting applications. Presto Engineering's semiconductor IP offerings are geared towards enabling rapid development and ensuring cost-effective project realization, which in turn helps firms achieve faster market entry. By providing validated and efficiently designed IPs, Presto supports clients in overcoming both technical hurdles and market competition, facilitating successful product integration and implementation.
The Hyperspectral Imaging System developed by IMEC revolutionizes the observation capabilities of a wide spectrum of wavelengths in just one frame. This system taps into the potential of spectral imaging, advancing Earth and space exploration through its ability to capture detailed environmental data. The hyperspectral imaging system, being chip-based, ensures enhanced efficiency and precision while lowering the energy footprint compared to traditional methods. This cutting-edge technology is capable of transcending applications from Earth monitoring, where it aids in identifying and assessing natural resources, to next-generation satellite observation. By employing advanced methodologies for data acquisition and processing, the hyperspectral imaging system enhances the quality and accuracy of images captured from diverse environments. Moreover, its compact and efficient form factor makes it adaptable for integration into various imaging platforms, providing unparalleled insights with high fidelity. Furthering the realm of optical imaging, IMEC's system is designed for broad adaptability across sectors like agriculture, forestry, and urban planning, facilitating an in-depth understanding of ecological and environmental dynamics. The seamless integration with machine learning algorithms allows for the conversion of vast spectral data into actionable insights, providing users with the tools needed to make informed decisions on conservation, resource management, and urban development. Combining state-of-the-art sensor technologies with robust computing abilities, IMEC's Hyperspectral Imaging System stands as a cornerstone of modern observational science.
Pacific MicroCHIP's XCM_64X64_A is a sophisticated cross-correlator ASIC, comprising an array of 128 ADCs each running at 1GSps. It is optimized for radar receivers and spectrometers, delivering low power consumption and supporting bandwidths from 10MHz to 500MHz.
The XCM_64X64 from Pacific MicroCHIP is an advanced cross-correlation system with a complete 64 by 2-channel configuration, suitable for synthetic radar and spectrometric applications. It minimizes power use while offering high-speed processing capabilities over a wide frequency range.
Designed for high-performance image warping, the TW220/240 IP offers distortion correction and various transformations such as scaling and rotation. It supports resolutions up to 4K x 4K in RGB and YUV formats, facilitating high-quality image outputs. This IP is particularly suited for compact, but high-resolution processing needs found in automotive, VR, and digital camera applications. With GPU-accelerated processing, it ensures efficient alteration of images in real-time, meeting the demands of modern visual technologies. Whether for innovation in automotive mirror systems or in enhancing VR headset displays, TW220/240 stands as an essential asset. It provides the technical prowess required to handle intricate image processing with accuracy and speed.
Tower Semiconductor’s CMOS Image Sensor technology stands as an industry leader, driven by its advanced pixel design and high-end imaging solutions. This technology caters to an ever-growing demand for quality image sensing in a variety of fields including automotive, industrial, and medical applications. Utilizing innovative pixel technology, Tower Semiconductor excels in producing sensors that promise superior image sharpness and low-light performance, crucial for high-definition imaging systems. The company's CMOS Image Sensors deliver unparalleled customization capabilities, ensuring each sensor meets precise application requirements. By offering robust manufacturing processes and distinct pixel architectures, Tower Semiconductor provides customers with personalized solutions that enhance their product performance and market competitiveness. Advanced features include backside illumination and stitching technology, which cater to a variety of imaging needs from small handheld devices to large-format applications. Tower Semiconductor maintains its edge through significant R&D in sensor technology, ensuring their image sensors embody the latest technological advancements. The process is available on 8” and 12” wafers, allowing for extensive versatility in device fabrication and facilitating large-scale production for leading global markets, reinforcing their commitment to quality and innovation in imaging systems.
ELFIS2 is a versatile image sensor designed to cope with challenging environments, with its high reliance on radiation-hardened features. This sensor is characterized by its true high dynamic range (HDR) capabilities, making it optimal for applications requiring accurate light detection across a broad range of intensities. The ELFIS2 features motion artifact-free (MAF) operation, a critical attribute for high-fidelity imaging. Built with a global shutter and back-side illumination (BSI), the sensor ensures all pixels capture light simultaneously, which is vital for sharp images devoid of motion blur. The BSI technology further enhances its sensitivity by allowing more light to reach the photodiode, a crucial feature for low-light conditions or fast imaging demands. With its SEL/SEU radiation-hardened design, the ELFIS2 is tailored for environments exposed to high radiation levels, like space or certain industrial settings. This resiliency, coupled with its innovative design, makes ELFIS2 suitable for complex imaging tasks, capturing high-quality images without compromising performance.
The 16x112G Rx Chiplet integrates a complete photodetection and amplification solution, supporting up to 16 channels at 112G each. It features a built-in photodetector and transimpedance amplifier (TIA) to efficiently convert optical signals into electrical outputs. This chiplet is geared towards high-speed, high-throughput applications requiring robust signal processing capabilities. With its digital control interface, the chip provides seamless integration into complex systems, ensuring smooth operation across various frequencies and conditions.
The Pipeline ADC offering by ASIC North showcases the company's expertise in developing state-of-the-art data conversion technologies. Designed to cater to high-speed analog-to-digital conversion needs, this ADC is a crucial component in systems requiring precise and rapid data processing capabilities. With its capacity to handle multiple channels and high sampling rates, the Pipeline ADC is integral to applications such as telecommunication systems and advanced signal processing.<br><br>ASIC North ensures that each Pipeline ADC is meticulously calibrated for optimal performance, adhering to stringent industry requirements. This precision in design allows for minimal delay and maximum accuracy, making it ideal for applications that demand high throughput and reliability. The versatility of this ADC enables it to be effectively integrated into a wide range of digital systems, contributing to their enhanced performance and efficiency.<br><br>Through continuous innovation and dedication to quality, ASIC North's Pipeline ADCs remain ahead in the technology curve, providing robust solutions that anticipate and fulfill complex conversion needs. These ADCs are engineered to work seamlessly within larger systems, offering scalable performance that aligns with technological advancements.
Operating as a low-power, single-bit switched capacitor Sigma-Delta modulator, this device suits the needs for Nyquist-rate conversions ranging from 7.8125kHz to 62.5kHz. Its robust design using TSMC 180nm technology, offers 13-bit performance, crucial for sensor interfaces and IoT systems. Its efficient power use and compact 0.15 sq-mm area make it a strategic choice for fine-line instrumentation applications, catering to precise conformance and data accuracy in demanding environments. With silicon proven readiness, integration is seamless for developers.
This ADC is a 1.8V low-power single-bit switched-capacitor Sigma-Delta modulator-based device, designed for frequencies from 7.8125kHz to 62.5kHz at the Nyquist rate, with programmable decimation rate. Implemented on TSMC's 180nm low-power technology, it excels in applications such as wireless/wireline sensor interfaces and IoT devices, offering 13-bit performance. Its small form factor and power efficiency make it ideal for modern, compact, high-performance systems requiring precise data transference and management.
The logiREF-ACAP-VDF is a comprehensive framework designed to simplify the development of multi-camera vision applications using the AMD Versal Adaptive SoC VCK190 Evaluation Kit. It provides a robust design package that includes pre-verified reference designs, facilitating efficient project development and reducing the complexities involved in integrated camera applications. Particularly useful in applications such as advanced driver assistance systems (ADAS) and machine vision, this framework supports the rapid prototyping and deployment of sophisticated camera systems, enabling developers to focus on enhancing application-specific functionalities. Its integration capabilities ensure compatibility with camera-to-display setups and LIDAR visualization sequences, expanding its utility across varied industrial domains. Built on the robust Versal Adaptive SoC platform, the logiREF-ACAP-VDF framework promises unmatched performance and ease of use, making it a valuable asset for developers seeking to reduce design cycles and enhance project outcomes.
logiISP-UHD is an ultra-high-definition image signal processing pipeline designed for advanced video inputs in embedded systems based on AMD SoC and FPGA platforms. This core delivers stellar performance for UHD video, including 4K2Kp60, ensuring superior image quality enhancements for demanding video applications. This IP core is especially suited for applications requiring precise digital signal processing, such as broadcasting, security cameras, and advanced driver assistance systems. By supporting various AMD platforms, it ensures compatibility and ease of integration, facilitating rapid development cycles while maintaining high-quality video processing standards. Developers benefit from logiISP-UHD's comprehensive SDKs and support, enabling them to push the boundaries of video processing technology effortlessly. Its design ensures streamlined pipelines capable of handling intensive video tasks with minimal lag, offering scalability across a broad range of industries and applications.