All IPs > Analog & Mixed Signal > Temperature Sensor
The category of Analog & Mixed Signal > Temperature Sensor in the Silicon Hub encompasses a wide range of semiconductor IPs designed to enable precise temperature monitoring within various electronic systems. These IPs are pivotal in ensuring reliable performance of electronic products by providing accurate temperature data, which is essential for maintaining optimal operating conditions and preventing thermal-related failures.
Temperature sensors within this category come in diverse forms, including analog and digital outputs, leveraging innovative mixed signal design techniques to achieve high precision despite varying environmental conditions. Key applications of these semiconductor IPs can be found in sectors such as consumer electronics, automotive, industrial automation, and healthcare devices, where temperature monitoring is critical for operational efficiency and safety.
Integrating temperature sensor IPs into semiconductor designs simplifies system architecture by reducing the need for additional discrete components, thereby saving space and power while enhancing overall functionality. In automotive applications, for example, these sensors are crucial for monitoring engine temperature, battery thermal management, and cabin climate control systems. In consumer electronics, they ensure safe battery operation and efficient thermal management for gadgets like smartphones and laptops.
Overall, temperature sensor semiconductor IPs play a vital role in the development of modern electronic systems by providing the precise temperature measurement capabilities required for various thermal management applications. Silicon Hub offers a comprehensive selection of these IPs, tailored to meet the stringent demands of today’s advanced technology ecosystems, ensuring your products are equipped with the latest in thermal sensing innovation.
The agileTSENSE_D temperature sensor provides a digital output, extending the capabilities of traditional temperature sensing by incorporating digital signal processing. It retains the core analog sensing mechanism but wraps the output in a digital format for easier integration into modern digital systems, including IoT devices and data centers. This product is designed for environments where digital interfacing is critical. With its adaptable architecture, the agileTSENSE_D delivers precision temperature measurements over a broad operational range, ensuring that systems maintain optimal performance and safety. This functionality is crucial for thermal monitoring and management. Agile Analog designs are based on tried and tested architectures to ensure reliability and functionality. Our automated design methodology is programmatic, systematic and repeatable leading to analog IP that is more verifiable, more robust and more reliable. Our methodology also allows us to quickly re-target our IP to different process options. Our highly configurable and multi-node analog IP products are developed to meet the customer’s exact requirements. These digitally-wrapped and verified solutions can be seamlessly integrated into any SoC, significantly reducing complexity, time and costs.
The MVH4000 series is a line of highly precise and fully calibrated humidity and temperature sensors. Utilizing a unique Silicon Carbide MEMS technology, these sensors boast outstanding long-term stability, quick response times, and low power usage. Their compact size makes them ideal for applications where space is at a premium, offering significant advantages in battery-powered and time-sensitive environments. Long-term reliability, minimal power draw, and robustness are key features of the MVH4000 sensors, making them a top choice for demanding applications with critical process controls.
Efinix's Topaz FPGA series is engineered for mass-market applications, delivering a perfect mix of efficiency and adaptability. These FPGAs encapsulate a highly efficient architecture, combined with the industry's essential features and protocols, such as PCIe Gen3, MIPI, and LPDDR4. This configuration allows users to harness substantial performance while maintaining ample room for future innovations. Topaz FPGAs are optimized for high-volume production environments where cost-effectiveness and swift integration are paramount. Their design promotes ease of implementation in various applications, spanning from automotive to deeply embedded systems, where reliability and robustness are key. Featuring a streamlined architecture, Topaz series FPGAs support modern connectivity standards and data processing capabilities. These devices are tailored for industries requiring scalable solutions that can adapt to evolving technological landscapes, ensuring that Efinix customers remain competitive in their respective fields.
The MVT4000D series comprises highly accurate digital temperature sensors, renowned for their robust performance based on the proprietary Silicon Carbide MEMS technology. These sensors feature rapid response times and exceptional long-term stability, with very low power consumption. They are designed to optimize space usage on PCBs with their small form factor, catering to a broad spectrum of industries including medical and automotive. Their precision and reliability make them the sensors of choice for processes requiring tight control.
The agileTSENSE_A is a general-purpose temperature sensor that utilizes a ΔVBE sensing mechanism to amplify and transform temperature-related voltages into a single-ended signal. This sensor is designed to work seamlessly with the agileADC to provide digital outputs with impressive accuracy of +/-0.25°C. It's especially significant for modern SoCs, where thermal management is crucial for power optimization and security threat detection. This sensor covers a wide operating range from -20°C to +100°C. It features a rapid startup time and minimal current consumption, making it apt for SoC integrations where efficiency is key. Further customization options allow for ease of incorporation into diverse systems. Agile Analog designs are based on tried and tested architectures to ensure reliability and functionality. Our automated design methodology is programmatic, systematic and repeatable leading to analog IP that is more verifiable, more robust and more reliable. Our methodology also allows us to quickly re-target our IP to different process options. Our highly configurable and multi-node analog IP products are developed to meet the customer’s exact requirements. These digitally-wrapped and verified solutions can be seamlessly integrated into any SoC, significantly reducing complexity, time and costs.
Thermal Oxide is a foundational dielectric layer utilized in various semiconductor devices. When properly developed using high purity, low defect silicon substrates, Thermal Oxide serves as an excellent insulator. The application of Thermal Oxide includes its use as a 'field oxide', which can electrically isolate different conductive films such as polysilicon and metal from the silicon substrate. Furthermore, it is integral as a 'gate oxide' within devices, providing the necessary dielectric layer.\n\nManufacturing of Thermal Oxide involves oxidizing silicon wafers in high-temperature furnaces, with standard processes occurring between 800 and 1050 degrees Celsius. This method involves housing the wafers in quartz glass tubes that can withstand the high thermal requirements, ensuring minimal risk of cracking or warping during processing due to its inherent stability.\n\nThe Thermal Oxide process at NanoSILICON involves both wet and dry oxidation methods, utilizing ultra-high purity sources. The process enables the precise control of oxide thickness and uniformity, confirmed by advanced measurement tools such as the Nanometrics 210. This ensures that the resulting layers have uniform thickness across and within wafers, critical for the device's performance and reliability.\n\nNanoSILICON's expertise in Thermal Oxide Processing results in layers ranging from 500 to 100,000 Å, with carefully maintained process controls for thickness variation and uniformity. It is integral to various applications in the semiconductor industry, supported by their highly specialized equipment and meticulous quality assurance processes.
The MVWS4000 series provides a comprehensive solution with its three-in-one digital sensors that measure humidity, pressure, and temperature. Designed for high performance, these sensors offer rapid readings and are optimized for battery efficiency. The use of Silicon Carbide technology ensures durability and energy efficiency, making the sensors suitable for battery-powered applications across various markets. Their compact design and multiple accuracy grades make them adaptable to specific client requirements.
The C100 represents an advanced integration of wireless microcontroller capabilities for Internet of Things (IoT) applications. Built around a powerful 32-bit RISC-V CPU operating at speeds up to 1.5GHz, this chip delivers high-efficiency processing and data handling. Embedded with RAM and ROM, the C100 is designed to maintain high performance while minimizing power usage. Complementing its processing power, the C100 integrates extensively with wireless functionalities including Wi-Fi, and supports a multitude of transmission interfaces. Additionally, it includes an Analog-to-Digital Converter (ADC), Low Dropout Regulator (LDO), and a temperature sensor, allowing it to cater to diverse application needs swiftly and efficiently. Its design seeks to offer seamless application development that is broad in range yet simple and fast, making it a perfect choice for developers focused on creating robust IoT solutions. The C100's strength lies not just in its integrated components but also in its ability to adapt to secure, high-performance environments, making it useful for smart home systems, healthcare devices, and more.
Analog Bits offers a comprehensive sensor IP portfolio focused on monitoring PVT (Process, Voltage, Temperature) conditions as well as power supply levels. These sensors, with a small footprint, are silicon-proven at 5nm and are being adapted for 3nm processes. They play a critical role in ensuring the integrity of power subsystems by detecting voltage spikes and monitoring power delivery systems. Fully integrated on-chip, these sensors enable software-driven load balancing for energy efficiency, making them crucial for ensuring robust performance across various applications.
Time-Triggered Protocol is an advanced synchronization mechanism designed for precise communication in networked systems. It establishes a highly predictable framework where data exchange is timed to occur at regular intervals, ensuring timely communication regardless of network load. This deterministic approach guarantees that information is consistently delivered at the right time, which is particularly crucial for applications that demand heightened reliability and precision. This protocol is widely adopted in applications where timing and coordination are critical. By employing a globally synchronized time base across network nodes, the Time-Triggered Protocol minimizes delays and jitter, fostering an environment of high reliability. Its design inherently supports fault-tolerant systems, increasing the dependability of networks deployed in domains such as aerospace, automotive, and industrial automation. One of the key highlights of the Time-Triggered Protocol is its ability to integrate seamlessly with various systems, maintaining synchronization and order even in complex setups. This integration capability supports scalability, allowing systems to expand without compromising the timing accuracy and integrity of communications.
The eSi-Analog portfolio is crafted to integrate vital analog functions into custom ASICs and SoCs, optimized for a variety of applications. This low-power and silicon-proven technology adapts to meet specific project requirements, blending seamlessly with leading foundry processes. The analog IPs can include amplifiers, A/D and D/A converters, and other critical components. These IPs are fully flexible, adaptable, and provided with significant configurability, ensuring that custom specifications can be met with precision. This tailored approach supports a range of sectors from automotive to healthcare, enabling critical analog functionalities in compact and power-efficient designs.
The Human Body Detector from Microdul is specifically crafted to minimize power consumption in electronic devices. This ultra-low-power sensor is designed to detect the presence of a human body efficiently, thereby optimizing the power usage of the device. It excels in applications where energy conservation is crucial, such as in wearables or on-body electronics, which benefit from extended battery life when the device is not in use. This sensor utilizes advanced components that enable it to operate both in dynamic and static modes, ensuring reliability regardless of movement conditions. It is an exemplary solution for extending the operational period of devices dependent on battery power, marking it as an essential component in IoT and energy harvesting technologies.
The Ultra-Low-Power Temperature Sensor by Microdul is a remarkable component tailored for IoT applications, offering exceptional energy efficiency. Its primary function is to monitor temperature variations with precision, facilitating its role in energy harvesting systems where maintaining power efficiency is critical. Each sensor is meticulously built to ensure minimal power draw, which is a substantial benefit for devices needing prolonged battery life or those operating in remote locations without frequent power access. Given its capabilities, this sensor is ideal for deployment in smart home applications, wearables, or any Internet of Things ecosystems where temperature monitoring is conducted continually.
The Linear Temperature Sensor offers precise temperature monitoring with an output voltage linearly proportional to the junction temperature. Designed for on-chip applications, it operates with a single 4V supply and can be trimmed to produce a 2V output at 60°C. This IP is ideal for use in delicate thermal environments where accurate temperature readings are critical. With proven reliability in XFAB's XT018 technology, it can be transferred to other manufacturing processes to suit different design specifications, providing a versatile solution for diverse thermal management needs.
The ADC / Temp. Sensor from M31 Technology offers a SAR ADC setup that delivers resolutions ranging from 10 to 12-bits, operating up to 2.5 MSPS. Designed for flexibility, it supports single-ended and differential input types, making it easier to integrate within ASIC or SoC environments. Its ultra-low-power consumption is ideally suited for applications requiring minimal power draw, such as IoT and battery-operated devices, making it a prime component for modern electronics demanding precision and efficiency.
The CANsec Controller Core serves as a cybersecurity enhancement for controller area networks used in various applications. This core provides essential cryptographic functions for protecting messages transmitted via the CAN bus, mitigating risks associated with unauthorized data access and manipulation. Its architecture allows for seamless integration with existing CAN infrastructures, providing an upgrade path for enhancing security without overhauling legacy systems. This feature-rich core is tailored for industries where data integrity and confidentiality are paramount, ensuring robust protection of sensitive communications. Optimized for performance, the CANsec Controller Core balances high security with low latency, enhancing the reliability of secure message transmission across networked devices.
The CM6216ea temperature sensor offers ultra-low power operation combined with high precision, making it an excellent choice for monitoring temperature in various applications. With an extended temperature range and a high measurement accuracy of 0.1°C, this sensor is designed to provide reliable data for thermal management systems. Currently under development, it promises advancements in ensuring the efficient design of systems requiring precise thermal regulation. Its design is aimed at minimizing energy consumption, supporting extended battery life in portable and energy-sensitive devices.
Maxvy's Temperature Sensor, specifically models TS5111 and TS5110, offers thermal sensing capabilities suited for memory module applications. Utilizing a two-wire interface, this sensor can communicate over I2C or I3C protocols, with operational speeds of up to 12.5 MHz on I3C and 1 MHz on I2C buses. These sensors are designed to handle specific pre-defined device selection codes, facilitating easy integration into established systems. Capable of reporting precise thermal data, these sensors support features such as error checking and error logging, making them indispensable for temperature-critical environments.
Designed with precision, the SAR ADC with Temperature Sensor from ShortLink offers an integrated mixed-signal ADC that is ideal for low-frequency measurements such as temperature and voltage monitoring. This 12-bit SAR ADC operates at 20 kSPS, with a temperature range of -40° to +125°C, making it highly suitable for environmental sensing applications. What sets this ADC apart is the inclusion of a built-in temperature sensor, providing comprehensive monitoring capabilities within a single chip. Its single-point temperature calibration ensures accuracy at room temperature, contributing to its reliability across various environments. The integration of a built-in bandgap reference voltage further simplifies its integration process, lowering system costs and design complexity. Manufactured using an 180 nm high-voltage process, the ADC offers other process nodes like the TSMC 40 nm upon request. Ideal for power-conscious designs, this ADC fits well in applications where precise voltage and temperature tracking are necessary, leveraging ShortLink's legacy in high-performance analog design.