All IPs > Interface Controller & PHY > D2D
Device-to-Device (D2D) communication is a critical component in modern electronics, enabling direct interaction between devices without intermediary network infrastructure. Within our Interface Controller & PHY category, the D2D segment offers specialized semiconductor IPs designed to streamline and enhance these direct connections. These IPs are indispensable in creating an efficient communication link that can handle the increasing data demands seen in consumer electronics, automotive systems, and IoT devices.
Our D2D semiconductor IPs consist of essential building blocks such as interface controllers and Physical Layer (PHY) IP cores. These components are engineered to facilitate seamless communication between devices, whether it be for transferring data, synchronizing functions, or sharing resources in real-time. By leveraging these IPs, manufacturers can achieve low latency, high-speed data transfer, and robust connectivity, making these components suitable for applications requiring precise and rapid interaction.
Incorporating D2D IPs into your design allows for efficient use of bandwidth and power, critical factors in battery-operated or compact devices. The versatility of these semiconductor IPs makes them a popular choice in developing smart home devices, wearables, and vehicle infotainment systems, where direct and reliable device-to-device communication is paramount. These IPs also help minimize reliance on external network structures, providing a more secure and localized network environment.
The D2D interface controller and PHY IPs in our collection are developed to cater to the demanding needs of modern technological solutions. Whether you are designing a new IoT ecosystem or enhancing an automobile's connectivity suite, selecting the right D2D IP core can significantly impact your product’s performance and user experience. Explore our offerings to find the IP solutions that best align with your innovation goals, ensuring your devices communicate effectively and efficiently.
MAXVY UCIe VIP , a state-of-the-art solution that offers a comprehensive set of features and capabilities to ensure the quality and performance of your UCIe designs. MAXVY UCIe VIP is fully compliant with UCIe Specification version 1.0 and supports all the layers of the UCIe stack, such as FDI, RDI, LogPHY, PCIe, and CXL protocols. MAXVY UCIe VIP is also very user-friendly and flexible, with simple APIs, easy integrations, and configurable parameters. You can easily customize and control the UCIe functionality according to your needs. MAXVY UCIe VIP also provides a rich set of verification capabilities, such as protocol checks, functional coverage, traffic generation, error injection, and debug tools. You can easily monitor, detect, and report any issues or violations in your UCIe designs. MAXVY UCIe VIP is compatible with the industry-standard Universal Verification Methodology (UVM) and supports all leading simulators. With MAXVY UCIe VIP, very flexible for unit level testing, you can achieve faster verification closure and higher quality of your UCIe designs.
The Die-to-Die (D2D) Interconnect solution by SkyeChip is a comprehensive technology facilitating high-speed data transfer between dies. Compliant with the UCIe 2.0 specification, it provides high bandwidth and minimal power overhead making it ideal for chiplet-based architectures. This lightweight interconnect supports diverse protocols such as PCIe and CXL, allowing adaptability to numerous communication requirements. It is designed to support major packaging technologies, ensuring flexibility and robustness in post-package yields and supporting loopback tests for integrity assurance.
The AXI Bridge for PCIe is a versatile Smartlogic solution featuring up to four AXI4 interfaces. This IP core seamlessly translates AXI read and write commands into PCIe Transaction Layer Packets, maintaining continuous parallel operations across all interfaces with zero interference. Unused interfaces can be deactivated to conserve logical resources, highlighting its efficiency-oriented design. The inclusion of a high-performance kernel mode driver enhances its operability on Windows and Linux systems, paving the way for easy software integration. This characteristic allows users to transfer payloads without delving into the complexities of PCIe packet formation. Ideal for various applications, especially in networking, this component provides dependable solutions where high throughput and low-latency data interactions are essential. It stands out for its ability to support dynamic Ethernet applications, ensuring that network environments function optimally at all times.
The ePHY-5616 product is crafted to handle data rates from 1 to 56Gbps. Operating prominently on 16 and 12nm technology nodes, this solution is ideal for applications that demand scalable insertion loss and data rate adaptability. The architecture is robust, leveraging advanced DSP techniques to provide exceptional clock data recovery and superior BER (Bit Error Rate), catering to both enterprise and data center needs. Its utility extends to routers, switches, and other critical data infrastructure components.
The Multi-Channel Flex DMA IP Core offers an adaptable solution for handling up to 16 streaming channels, each managed independently to prevent mutual obstruction. Users can customize the data rate for each channel to optimize interfacing simplicity while incorporating prioritized FIFO buffers to ensure crucial data streams maintain supremacy. Designed with streaming and co-processor applications in mind, this IP core reads data from any source, processes it, and disseminates it to designated targets. Additionally, the core includes mechanisms for monitoring CRC errors along PCI Express links, enabling the prompt identification and exclusion of assemblies with subpar signal integrity during production testing. This core is paramount in safety-critical applications, where signal integrity and real-time data management are vital, offering high reliability and responsiveness in demanding environments. Its blend of efficiency and precision makes it a favorite for being able to swiftly adapt to varied processing needs without compromising on performance quality.
Eliyan's NuLink Die-to-Die PHY for standard packaging is a technological innovation designed to enhance chiplet interconnectivity within conventional package forms. Tailored to seamlessly integrate with both silicon bridges and organic package substrates, this product eliminates the need for advanced packaging solutions while matching their performance characteristics. By achieving the same remarkable levels of data transfer efficiency and power optimization typically associated with advanced methods, NuLink technology stands out as a cost-effective solution for multi-die integration. Targeted for ASIC designs, the NuLink Die-to-Die PHY is capable of supporting a wide array of industry standards including UCIe and BoW. Its design enables the connection of chiplets in standard packaging without requiring large silicon interposers, ensuring both significant performance gains and cost savings. This flexibility makes it particularly appealing for systems that require mixing and matching of chiplets of varying dimensions. In practical applications, Eliyan’s solution facilitates increased placement flexibility and supports configurations that demand physical separation of components, such as those between hot ASICs and heat-sensitive dies. By leveraging a standard packaging approach, this PHY product provides substantial improvements in thermal management, cost efficiency, and production timelines compared to traditional methods.
The MIPI C-PHY Interface offers a physical channel for the Camera Serial Interface 2 (CSI-2), providing a bandwidth of 5.7 Gbps per lane. By optimizing throughput over channels limited by bandwidth, this technology facilitates increased data transmission without demanding a higher signaling clock rate, making it highly efficient for next-gen applications.
The Multi-Channel AXI DMA Engine excels in bridging AXI Stream and AXI Memory mapped operations, managed by a potent DMA engine. Capable of processing data from 16 AXI Stream Slave inputs, it ensures efficient data writing and reading into DDR memories. AXI Stream Masters can extract information, enabling further DSP processing across multiple streams. The inclusion of programmable address generators allows non-linear data storage, simplifying the retrieval process for algorithmic units by categorizing data in easily manageable sections or Regions of Interest (ROI). This functionality greatly aids subsequent data sorting and processing activities. By facilitating compatibility with GStreamer and offering Linux driver support, this IP core is versatile for use in SoC-based environments that demand seamless data handling and processing. Its adaptability extends to non-SoC FPGAs requiring efficient DDR data buffering, making it indispensable for a wide array of data-intensive digital environments.
The ePHY-11207 marks the frontier of eTopus's high-speed SerDes capabilities, facilitating data rates from 1 to 112Gbps. This 7nm nodal innovation is particularly significant in environments where latency precision and bandwidth are critical, such as in advanced networking interfaces and server applications. It integrates seamlessly with the existing network fabric, supporting high throughput demands and lower latency metrics, bolstered by eTopus's proprietary algorithms.
YouSerdes is designed to deliver high-speed, multi-rate serial data communication, operating in the range of 2.5 to 32Gbps, which is critical for today's data-intensive environments. It integrates multiple SERDES channels, combining superior performance with efficient space and power usage. The architecture ensures that signal integrity is maintained across diverse conditions, making it a preferred choice for high-speed data transmission tasks. The design ethos of YouSerdes revolves around maximizing bandwidth and minimizing latency. This makes it suitable for integration in products that require rapid data processing and transmission, such as telecommunication infrastructure and high-performance computing systems. By ensuring consistent results across various deployment conditions, YouSerdes supports diverse application needs while offering flexibility in system design. Moreover, YouSerdes emphasizes power efficiency and high area performance, which are achieved through advanced architectural optimizations. These enhancements deliver crucial advantages in designing systems that require both speed and efficiency, reinforcing its importance in data-centric industries.
YouSerdes is designed to deliver high-speed, multi-rate serial data communication, operating in the range of 2.5 to 32Gbps, which is critical for today's data-intensive environments. It integrates multiple SERDES channels, combining superior performance with efficient space and power usage. The architecture ensures that signal integrity is maintained across diverse conditions, making it a preferred choice for high-speed data transmission tasks. The design ethos of YouSerdes revolves around maximizing bandwidth and minimizing latency. This makes it suitable for integration in products that require rapid data processing and transmission, such as telecommunication infrastructure and high-performance computing systems. By ensuring consistent results across various deployment conditions, YouSerdes supports diverse application needs while offering flexibility in system design. Moreover, YouSerdes emphasizes power efficiency and high area performance, which are achieved through advanced architectural optimizations. These enhancements deliver crucial advantages in designing systems that require both speed and efficiency, reinforcing its importance in data-centric industries.
The AXI Bridge with DMA for PCIe from Smartlogic is engineered for high-performance data transfer applications, providing an array of industry-standard AXI interfaces. Designed to handle complex data streaming from FPGA to Host or vice versa, this IP core supports concurrent operations across all interfaces without interference. Its smart design allows for easy access to remote memory locations for shared and peer-to-peer memory applications. This product is notable for its ability to manage continuous data flow effectively, making it ideal for developers crafting sophisticated PCIe endpoints without deep protocol expertise. The inclusion of a kernel mode driver for Windows and Linux ensures smooth software integration, simplifying the deployment in diverse operating systems. Such integration allows developers to focus on transmitting raw data rather than crafting compliant PCIe packets, reducing complexity and development time. The core is especially valuable in network applications, where seamless Ethernet compatibility is crucial. Its robustness makes it well-suited for applications needing reliable data exchange and control over extensive data transactions, particularly in environments demanding high processing throughput and modular expansion capabilities.
The ARINC 818 Streaming core is engineered to facilitate real-time streaming by converting pixel bus data into ARINC 818 formatted Fibre Channel serial data streams and vice versa. It is specially tailored for aerospace and defense applications that rely on precise data formatting and high-quality data exchange standards. This core efficiently manages data frame conversion, ensuring that video and graphical data conform to ARINC 818 standards. By managing both pixel-to-FC data conversion and vice versa, it provides comprehensive support for video streaming in complex avionic systems. Its design minimizes latency and ensures high fidelity and reliability. Optimized for ease of integration, this core supports high-speed data transfers essential for real-time processing needs. It is perfectly suited for environments that demand stringent data exchange protocols and have zero tolerance for errors or delays. Its robust architecture makes it an asset for mission-critical aerospace applications.
The High-Channel-Count DMA IP Core is specialized for memory-intensive applications demanding high throughput, accommodating up to 64 data streams. It efficiently allocates streams within distinct host memory regions via DMA while facilitating user logic interfacing through up to 8 AXI4 (Full/Lite) masters. In addition to supporting data reading with up to 16 AXI Stream masters, this core simplifies the development of complex PCIe endpoints by enabling users to focus solely on data payloads, eliminating the need for intricate PCIe packet management. This capability makes it ideal for data-intensive operations such as streaming, Ethernet applications, and high-level computations. The IP core is equipped for Ethernet compatibility and comes with a detailed schematic to assist in implementation, ensuring that network congestion or interruptions have minimal impact on its performance. It is designed to support high-performance data handling and fast processing for real-time applications.
The ARINC 818 DMA core is designed to provide a holistic solution for the receipt and transmission of ARINC 818 protocols. It maximizes efficiency by offloading critical tasks such as formatting, timing, and buffer management from the host processor, thereby optimizing resource use and performance in embedded environments. This core is well-suited for aerospace systems, where efficient data handling is paramount. By providing robust support for the ARINC 818 data interface, the core ensures high data integrity and low latency, indispensable for maintaining system reliability. Its architecture is engineered to handle complex data structures and formats, facilitating seamless data transfer between subsystems. The DMA functionality ensures consistent performance under demanding operating conditions, catering to both legacy and modern platform requirements.
The BlueLynx Chiplet Interconnect offers an advanced die-to-die interconnect solution, tailored to meet the rigorous demands of contemporary chiplet designs. With support for Universal Chiplet Interconnect Express (UCIe) and the Open Compute Project's Bunch of Wires (BoW), this IP establishes a robust physical and link layer interface for chiplet communications. It's built to connect efficiently with on-die bus standards like AMBA AXI and ACE, streamlining the process of linking chiplets within advanced package configurations. Technologically sophisticated, BlueLynx supports a variety of fabrication nodes ranging from 16nm down to 3nm, ensuring compatibility across multiple semiconductor foundries. This interconnect solution is silicon-proven and enables not only rapid development but also minimizes the traditional risks associated with new designs. Clients receive a comprehensive ASIC integration package, including platform software and design references, which allows for swift silicon bring-up and ensures that first-pass silicon achieves expected operational standards. The architecture of BlueLynx is designed to be both customizable and efficient. With data rates stretching from 2 Gb/s up to over 40 Gb/s, and low power consumption underpinning its design, BlueLynx manages to provide a high bandwidth density of over 15 Tbps/mm². This results in optimal performance scaling across diverse applications while accommodating advanced 3D packaging options. The PHY component of the IP is specifically designed for high compatibility and minimal latency, built on the architecture that supports configurable serialization and deserialization ratios, multiple PHY slices, along with detailed specifications for bump pitch and package applications.
The Universal Chiplet Interconnect Express (UCIe) developed by Extoll represents a significant advancement in interconnect technology for chiplet architectures. This innovative solution facilitates seamless integration and communication between chiplets, achieving ultra-fast data transfer with the lowest possible power consumption. Built to serve as the foundational interconnect for diverse platforms, UCIe emphasizes scalability and performance, proving essential in large, complex semiconductor systems. Designed to fit a wide range of industries, this UCIe solution supports the seamless assembly of multi-vendor chiplets, ensuring compatibility and performance across various technical ecosystems. This flexibility makes it a preferred choice for developers aiming to create cutting-edge systems with exceptional integration capabilities. The UCIe ensures that the maximum bandwidth is maintained, critical for high-performance applications and computing tasks. As semiconductor industries move towards more modular and flexible system designs, Extoll's UCIe stands out as a pivotal technology that addresses the need for efficient and reliable communication channels. By fostering interoperability and efficient chiplet integration, the UCIe gives manufacturers the tools needed to innovate consistently and maintain a competitive edge in a rapidly evolving marketplace.
The FPGA Pre-Trade Risk Check IP by Algo-Logic is engineered to perform lightning-fast, real-time risk analyses prior to trade execution. This solution is tailored for financial institutions that need to adhere to strict compliance mandates while executing trades at speeds that approach the limits of current technology. By integrating directly into trading systems, the IP enables pre-trade checks without compromising speed, offering a significant advantage in the fast-paced environment of financial trading. Designed for use with FPGA technology, this risk check system provides an infrastructure for reducing the lag associated with traditional software-based risk assessments. It allows firms to verify parameters and assess risks instantly as trades are enqueued, enhancing both the speed and accuracy of trade verifications. The Pre-Trade Risk Check system built on FPGAs benefits from low-latency processing and high-determinism, crucial for maintaining a competitive edge in the trading industry. By leveraging this IP, firms can better manage operational risks and maintain regulatory compliance more efficiently.
Designed to cater to modern high-speed data applications, the ePHY-5607 offers impressive performance across data rates from 1Gbps to 56Gbps utilizing a highly efficient 7nm process node. Its design is finely tuned for power, performance, and area (PPA) optimization, making it suitable for an array of applications such as data centers, smart NICs, and AI storage. Benefitting from eTopus's sophisticated DSP-based receiver architecture, it is equipped to handle a wide range of insertion losses while maintaining low latency.
InnoSilicon's 56G SerDes Solution provides a high-speed interface offering breathtaking transmission rates of up to 56Gbps per channel. Supporting both PAM-4 and NRZ modulation schemes, it adapts easily to various high-speed protocols to serve diverse applications like data center network systems and telecom infrastructure. This IP reinforces robust signal integrity and low power consumption, making it suitable for advanced ESD and BIST functionalities. Its flexible architecture meets modern network demands, ensuring future-proof customization opportunities.
The SerDes offering from KNiulink is engineered to meet the demanding requirements of bandwidth-heavy applications. It supports a variety of protocols including PCI Express, Rapid IO, SATA/SAS, JESD204, and USB interface standards. With support for up to 112G, this high-speed receiver-transceiver solution incorporates advanced techniques to optimize both power efficiency and signal integrity. It's specifically tailored for applications requiring reduced power consumption without sacrificing data throughput, making it an ideal choice for data centers, communication networks, and AI applications. The flexibility of the SerDes architecture allows it to be configured according to specific customer requirements, facilitating seamless integration into logic circuits and larger System on Chip (SoC) designs. This adaptability is complemented by cutting-edge CMOS technology which further enhances its performance metrics. SerDes is integral to the creation of high-performance virtual and physical environments, ensuring future-proof scalability with low latency and high reliability. Engineered for superior configurability and performance, KNiulink's SerDes ensures that high-speed communication can be managed effectively even in the most challenging environments, offering solutions that are tailored to bridge the gap between current needs and future technological developments.
The Speedster7t FPGAs are renowned for their optimization for high-data-rate applications. Engineered to overcome the limitations faced by conventional FPGA architectures, they provide significant enhancements in bandwidth, making them ideal for complex, data-intensive tasks. The unique architecture of Speedster7t mitigates traditional bottlenecks by incorporating features such as PCIe Gen5, 400G Ethernet, and support for the latest memory interfaces like DDR4 and GDDR6, ensuring swift processing and data transfer for demanding applications. These FPGAs cater to a range of fields including AI, machine learning, networking, and 5G infrastructure. Their design includes an innovative Network-on-Chip (NoC) architecture that effectively manages data communication internally, ensuring higher throughput and lower latency. This makes Speedster7t devices particularly suited for applications requiring extensive data crunching and fast interconnectivity. Furthermore, Speedster7t FPGAs are built to accommodate modern design challenges. They integrate seamlessly with Achronix's ACE design tools, providing users with a cohesive environment for developing high-performance systems. The FPGAs are supported by extensive documentation and technical support, making them an accessible choice for industries aiming for robust, scalable solutions in high-performance computing contexts.
The CXL IP from XtremeSilica facilitates memory coherency between CPUs and accelerators, optimizing computing resources for enhanced speed and efficiency. Ideal for high-performance compute environments, it supports increased bandwidth and reduced latency, crucial for complex computing tasks.
The Glasswing Ultra-Short Reach SerDes represents a pioneering development in chip-to-chip communication, leveraging Chord Signaling to provide exceptional bandwidth and energy efficiency. By using CNRZ-5 signaling, Glasswing can deliver twice the bit rate of traditional NRZ solutions while consuming significantly less power. Glasswing is designed for high-performance applications such as AI, machine learning, and complex semiconductor systems, offering a high degree of flexibility and reliability. It supports high-density multi-chip modules (MCMs), making it ideal for integrating complex designs with multiple dies. The product's innovative design reduces the overall footprint and increases yield by eliminating the need for silicon interposers. This PHY solution is equipped with advanced diagnostics like EyeScope for real-time signal monitoring, ensuring robust data throughput and minimized error rates. With its superb diagnostics and bandwidth delivery, Glasswing is a definitive choice for technology leaders aiming to push the boundaries of chip interconnect performance.
Extoll's High-Speed SerDes for Chiplets is engineered to enhance data transmission rates across chiplets, making it a cornerstone technology in the realm of high-performance computing. Designed for ultra-low power consumption, this SerDes solution ensures that high-speed data pathways are maintained without sacrificing efficiency or incurring additional power costs. With compatibility across a range of technology nodes from 12nm to 28nm, this product offers flexibility and scalability for diverse applications. This SerDes technology is instrumental in enabling seamless communication within chiplet architectures, supporting the industry's shift towards more modular and scalable systems structures. By integrating their innovative digital-centric architecture, Extoll ensures that the SerDes delivers not only in speed but also in the reliability required for modern semiconductor designs. The use of these interconnects enables the creation of complex, multi-chiplet environments where data can flow effortlessly between components. Manufacturers leveraging this SerDes technology can expect to see improvements in overall system performance, particularly in environments demanding high data throughput and minimal latency. It is an essential component for companies looking to stay ahead in a technological landscape that is rapidly embracing chiplet-based designs, contributing significantly to their ability to innovate and perform.
The VITA 17.3 Serial FPDP Gen3 Solution represents an advanced iteration of the Serial FPDP protocols, designed to deliver even faster data transfer rates while supporting more extensive feature sets. This solution addresses the need for higher bandwidth in data-intensive operations and is integral to modern communication infrastructures. It supports a maximum throughput that significantly enhances performance benchmarks, essential for real-time data applications. The IP is particularly beneficial in environments where large volumes of data must be moved swiftly and efficiently, such as in signal intelligence and large-scale data acquisition systems. Moreover, the VITA 17.3 Gen3 protocol offers enhanced error-checking capabilities ensuring data integrity even in challenging operating conditions. Its modular design aids in seamless integration and deployment across different platforms, making it a preferred choice for system architects aiming to leverage cutting-edge communication technologies.
The nxAccess Trading Engine by Enyx is a sophisticated trading platform equipped with FPGA algo sandboxes, preloading hardware orders to facilitate ultra-low latency trading operations. It uniquely balances hardware efficiency and software adaptability, catering to market making and arbitrage strategies that demand high performance with cost-efficiency. The system includes both hardware and software pathways for sending orders, ensuring flexibility and performance. In nxAccess, operations such as preloading, triggering, updating, and sending orders are streamlined through hardware, maintaining deterministic performance. This enables users to preload orders in preparation for market data arrivals, quickly adapting to market moves. The tool is geared towards boosting the strategies without intensive investment in FPGA technology. Moreover, its execution engine can handle both market data internally and externally, providing dual pathways to manage latency-sensitive logic in hardware while handling complex transactions in the software. The innovative design of nxAccess allows firms to engage in high-frequency trading with maximum efficiency and minimal delays.
Photowave is Lightelligence's contribution to the realm of optical communications, specifically designed for connectivity solutions like PCIe and Compute Express Link (CXL). This optical hardware capitalizes on the inherent low latency and energy-saving attributes of photonics, allowing for extensive scalability across server racks, crucial to modern data centers. Photowave is a trailblazer, marking the first optical interconnect tailored for CXL setups, providing a remarkable latency of less than 1 nanosecond in Active Optical Cables and slightly more in other configurations. It supports advanced CXL standards and PCIe 5.0 speeds, making it a desirable choice for future-proofing data center infrastructures. Additionally, Photowave proves advantageous in AI data centers, demonstrating significant throughput improvements in memory-intensive tasks such as large language model applications. Through its robust construction and innovative use of multi-mode fibers, Photowave assures a 2.4x improved performance in memory offloading tasks, offering constant high performance levels not seen in traditional disk-based architectures.
InnoSilicon's UCIe Chiplet Interconnect offers a state-of-the-art solution for high-speed chiplet data transfer, optimizing latency and power efficiency. Utilizing advanced connection technology, these chiplets enable massive energy-efficient data operations simulating single-board performance across multiple chips seamlessly. The interconnect allows for frictionless communications between smaller package dies, facilitated by InnoSilicon's proprietary chiplet IP. Ideal for data-heavy sectors such as high-performance computing, 5G, and AI, users benefit from agile and cost-saving scalability.
Eliyan's NuLink Die-to-Memory PHY technology stands as a testament to the company's innovative approach toward enhancing semiconductor performance without resorting to advanced packaging. This IP solution offers low-power, high-performance connectivity capabilities for die-to-memory interconnects, utilizing the same foundational NuLink technology adapted for unique applications. Unlike traditional unidirectional designs, this PHY provides a more fluid data transfer, supporting a diverse range of industry standards while maintaining efficiency and adaptability. The NuLink Die-to-Memory PHY product allows integrations on both standard and advanced packaging, delivering exceptional performance metrics. In contrast to established methods that often necessitate complex silicon interposers, Eliyan’s solution is able to provide equivalent, if not superior, results using standard packaging techniques. Its structure is geared towards minimizing power consumption and maximizing data throughput, thus enabling the realization of more powerful and efficient semiconductors. This technology is particularly beneficial for applications requiring dynamic interfacing between dies and memory, making it viable for a multitude of cutting-edge electronic devices. By offering scalable and effective solutions, Eliyan facilitates advancements in both traditional memory coupling and emerging semiconductor technologies.
This core facilitates precise and fault-tolerant networking, essential for environments requiring consistent timing and reliability, such as automotive and industrial applications. It supports scalable network speeds from 1Gbps to 10Gbps and includes features like babbling protection and anti-masquerading functionalities. The AXI standard interface simplifies integration, ensuring this core remains user-friendly and versatile.
The JESD204B Multi-Channel PHY is a high-speed interface core designed to facilitate data transfer rates up to 12.5Gbps. It adheres to the JESD204B standard, which aims for deterministic latency and the synchronization feature SYSREF. The core is architected to support complex data flow management involving packet grouping and scrambling with 8b/10b encoding and decoding. Furthermore, it offers standalone configuration for transmitter and receiver operations, enhancing flexibility in design. This PHY core is engineered with compatibility across multiple fabrication processes, including 65nm, 55nm, 40nm, and 28nm technologies. This broad range of compatibility ensures easy integration into various system architectures, thus accommodating diverse applications and reducing development time. The design's robustness and comprehensive support for multiple channels make it suitable for demanding environments requiring rapid and reliable data throughput. The JESD204B Multi-Channel PHY not only complies with industry standards but also maximizes efficiency in communication pathways. Its design integrates seamlessly into existing hardware infrastructures, providing enhanced performance without the need for significant overhauls. The PHY’s high adaptability and optimized configurations pave the way for versatile applications in sectors such as telecommunications and data processing, ensuring that systems can meet growing data demands swiftly and efficiently.
The VITA 17.1 Serial FPDP Solution offers a high-speed digital communication protocol designed for demanding environments. This product provides robust and efficient data transfer capabilities, ideal for applications in aerospace and defense. Featuring a serial point-to-point link, it enables direct communication between systems, minimizing latency and maximizing data throughput. Engineers favor this solution for its scalability and compatibility with existing and emerging technologies, ensuring a secure investment in future-proofing their systems. The VITA 17.1 standard's interoperability with various platforms highlights its versatility, making it suitable for a broad array of mission-critical applications. With support for different data transfer speeds and modes, this solution can be tailored to fit specific requirements, guaranteeing optimal performance under varying operational conditions.
The CXL 3.0 solution from Rapid Silicon is an advanced Controller IP designed to enhance your FPGA design with superior performance and flexibility. This IP is compliant with CXL specifications up to version 3.0, along with support for earlier versions 2.0, 1.1, and 1.0. It offers seamless integration capabilities with PCIe, standing up to PCIe 6.0 and ensuring backward compatibility. The architecture of the CXL Controller IP is highly configurable, providing adaptability for specific application requirements, including lane configurations, datapath widths, and efficiency in power management. One of the standout features of the CXL 3.0 IP is its support for advanced functionalities such as lane bonding, multicast, and robust error correction mechanisms. These features ensure the IP delivers reliable and efficient performance in diverse environments. Ideal for critical data-intensive tasks, the IP is suited for telecommunications, industrial applications, and more, where data throughput and protocol bridging are crucial. With its focus on delivering unmatched speed, efficiency, and scalability, the CXL 3.0 IP from Rapid Silicon is positioned as a key component for enabling sophisticated FPGA designs tailored to meet modern technology demands. Its architecture is crafted to support the burgeoning needs of applications that require high degrees of data handling and processing accuracy, making it a preferred choice in the semiconductor industry.
The Interconnect Generator developed by Dyumnin Semiconductors is designed to construct protocol-agnostic interconnects capable of supporting AXI and OCP master/slave configurations. This generator allows for flexibility in the creation of interconnects that can be simple, pipelined, or crossbar. Additionally, it manages varying protocol behaviors, ranging from atomic transactions to split transactions with independent address and data phases. The built-in reorder buffer provides configurable depth, allowing for multiple outstanding requests while ensuring data is delivered in sequence.
The Prodigy FPGA-Based Emulator serves as an invaluable resource for product evaluation, providing a functional representation of the Prodigy Universal Processor. Ideal for software development, debugging, and compatibility testing, this emulator comprises several FPGA and I/O boards interlinked within a rack, enabling accurate performance measurements. This emulator is an integral tool for developers and partners, offering eight full processor cores per board, inclusive of vector and matrix fixed and floating-point processing capabilities. These capabilities facilitate a range of software evaluations, allowing for precise and efficient development processes. Users can access the Prodigy FPGA's potential, leveraging its hardware to mimic real-world operation conditions, thereby ensuring rigorous testing before full-scale deployment. Although orders for Prodigy prototypes concluded in mid-2023, the hardware remains accessible for collaborative testing within Tachyum's facilities. Through the ongoing use of this emulator, Tachyum enables developers to explore Prodigy's capabilities, ensuring smooth transitions and effective performance tuning in readiness for market-wide implementation and adoption.
FireCore PHY & Link Layer Solutions provide a comprehensive approach to integrating IEEE-1394 and AS5643 functionalities into FPGA platforms, addressing the diverse needs of modern avionics applications. These solutions combine the physical and link layers, ensuring seamless operation at transmission speeds from S100 to S3200, pushing the boundaries of what is achievable with conventional technology. DapTechnology's FireCore solutions are meticulously designed to support multipoint FPGA families, offering a blend of configurability and performance that meets stringent aerospace standards. By inheriting the capabilities of both link and PHY layers, these solutions provide a resilient backbone for sophisticated data transmission and processing. Equipped to handle advanced technological challenges, these solutions offer features such as error injection, bit error rate testing, and resource management, ensuring systems are not only powerful but also adaptable. This makes FireCore indispensible for developers looking to employ robust serial bus technologies in their designs.
Credo Semiconductor's SerDes PHY solutions are at the forefront of connectivity technologies, designed for seamless integration into next-generation ASICs. These SerDes products strike a balance between optimal performance and cost-efficiency by utilizing innovative mixed signal DSP architectures. Credo's offerings can be integrated into multichip module systems-on-chip (MCM SoC) and 2.5D Silicon Interposer designs, featuring adaptability to varying manufacturing processes without sacrificing efficiency. The flexibility inherent in these products allows for integration of tens to hundreds of SerDes lanes, catering to different application scales and ensuring they meet diverse customer needs. Their design supports both high-performance and power-efficient requirements, with solutions available across mature process nodes. This adaptability ensures that Credo's SerDes PHY solutions provide robust, consistent performance, helping to minimize the risks associated with new technology deployments. They are particularly suited for high-performance computing and AI ASIC applications, where they enable rapid data transfer speeds with minimal latency, critical in today's data-driven computational environments.
Zetti PCIe Gen 5 Compatible Switch sets a new benchmark in connectivity, offering small-scale integration with full backwards compatibility for Gen 1 to 4 devices. It is adept at managing multiple peripherals with varying speeds, thus setting new standards for multi-functional devices. The switch supports one upstream port and up to six downstream ports, each operating independently and efficiently. Notable features include Hot Plug and Peer to Peer support, which enhance multitasking abilities and reduce CPU workload. As the first PCIe Gen 5 switch to operate on a small scale, Zetti addresses the growing demands of IoT, telecom, and smart home devices. Zetti is equipped with advanced diagnostic tools, including on-chip logic analyzers, providing insightful debugging capabilities. These features ensure minimal latency and power consumption, promoting efficient data transmission and energy conservation. Applications range from enhancing everyday electronics to complex industrial PCs, making Zetti a versatile solution in the innovation landscape.
The 5G ORAN Base Station is designed to advance mobile networking by offering solutions that vastly improve wireless data capacity, paving the way for new wireless applications. Capitalizing on the latest advancements in 5G technology, this product is at the forefront of modern telecommunications, destined to transform communication methods with higher data throughput and reduced latency. Businesses looking to capitalize on the growing demand for robust mobile communications infrastructures will find this product's capabilities beneficial. Faststream Technologies bridges the gap between existing mobile technologies and the revolutionary potentials of 5G, making seamless connections and smart integrations possible. It supports application development and deploys effective strategies to leverage the new potential of 5G networks effectively. This system promotes not only the enhancement of current network operations but also sparks innovation in the development of emerging technologies and new business models in telecommunications. The ORAN architecture at the heart of this 5G Base Station promises flexible network configurations, enabling businesses to tailor their communications solutions according to unique operational needs. This adaptability ensures the scalability required to support increasing digital traffic, fortified by a vendor-agnostic approach aligned with trends towards open, integrated, and programmable networks.
The Truechip PCIe Gen4 Controller delivers high-speed connectivity and performance, essential for data-intensive applications. This controller is compatible with the PCIe Gen4 standard, providing advanced features like low-latency transactions and streamlined data flow. The controller enhances throughput and ensures robust communication, driving efficiency in computational systems. With its robust configuration options, this controller seamlessly integrates into diverse applications, supporting various bandwidth requirements and ensuring compatibility with evolving technological standards.
The Regli PCIe Retimer is an advanced, high-performance component designed to optimize signal integrity and reduce latency in PCIe networks. Ideal for systems where every nanosecond is crucial, it operates with a latency of under 10 nanoseconds and an impressive error rate of up to 1E-12. The solution offers key features such as bifurcation and on-chip diagnostics, making it a favorite among system designers for its reliability and fit. This retimer supports PCIe 5.0, accommodating speeds up to 32 GT/s over x16/x8/x4 bidirectional lanes, and is compatible with CXL 2.0. The Regli PCIe Retimer enhances system reach and simplifies design while providing multiple control interfaces and secure boot features. Its power supply requirements include 0.9V, 1.2V/1.5V, and 1.8V, ensuring adaptability in various applications. Applications of the Regli PCIe Retimer include enhancing PCIe/CXL storage solutions, supporting servers and workstations, and facilitating 5G infrastructure. Its ultra-low bit error rate and extended system reach make it a crucial component for modern data centers and high-speed networking equipment, ensuring seamless connections and improved data transfer.
ALSE's Aurora 8B/10B IP Core serves as an efficient and fast serial communication protocol designed for chip-to-chip and board-to-board applications. Known for its lightweight structure and low latency, this IP is compatible with Intel and other FPGA platforms, making it a versatile choice for engineering teams. With support for operations at high speeds across transceiver lanes, it caters to the needs of advanced digital systems. This IP product capitalizes on the robust fast-communication features of the Aurora protocol, enabling cost-effective and high-performance data transfer solutions for an array of projects.
The Aurora 64B/66B IP Core by ALSE utilizes a lightweight and adaptable serial communication protocol ideal for high-speed transmission in scenarios such as chip-to-chip or board-to-board connections. This solution is highly optimized for seamless integration with FPGAs, and ensures full interoperability with similar Xilinx IPs. Key benefits include achieving high lane speeds with approximately 97% bandwidth efficiency. The IP is available for all top-tier Intel FPGAs and promises robust connectivity performance across multiple platforms, demonstrating ALSE's capability in delivering superior data transmission solutions that meet sophisticated industry needs.
AresCORE focuses on high-bandwidth, low-latency interconnects between multiple dies within a package. It supports configurations conducive to advanced packaging techniques, ensuring high data rate transfers and low energy consumption. Primarily aimed at cutting-edge fields such as AI and high-performance computing, it extends chip designers the opportunity to surpass reticle limits by embracing multi-die packaging solutions.
Neuron IP's chiplet interface solutions include the UCIe PHY and D2D Adapter IP, offering advanced and standard cores compliant with the latest UCIe v1.1 specification. These IPs are ideal for chiplet products requiring differentiated PPA architectures, designed to achieve superior performance across various application sectors. The UCIe PHY & D2D adapters operate at 32Gbps, providing robust connectivity solutions essential for chiplet systems that demand low latency and high efficiency. Their architecture ensures a balance between power, performance, and area (PPA), maximizing the functionality of integrated chiplet environments. These solutions are engineered to support modern semiconductor integration strategies, focusing on the critical aspects of signal and power integrity in die-to-die interfaces. By enhancing microprocessor performance in ultra-low latency interfaces, Neuron IP's chiplet solutions are central to evolving semiconductor technologies.
GammaCORE is a customizable controller IP complete with a Streaming and Adapter Layer for seamless data transmission across UCIe links. Its adaptable nature allows it to address various SOC interfaces, contributing to widespread applicability in complex systems. With proven silicon validation, this controller addresses advanced connectivity demands in integrated chip systems, providing robust solutions for emerging AI needs.
Aragio's LVDS (Low Voltage Differential Signaling) solutions are optimized for high-speed data transmission, capable of operating at frequencies up to 1.2 GHz. These I/Os are built around a three-module design comprising input, output, and reference blocks, designed to support differential termination of 50Ω or 100Ω. The LVDS I/O adheres to IEEE standards and is engineered for low power consumption and minimal skew between differential pairs. With support spanning multiple voltage supplies and a wide range of technologies, these solutions are well-suited for applications requiring high-speed, low-jitter signal integrity.
The SerDes IP solution provided by Actt covers high-speed serialization and deserialization for various protocol interfaces such as USB, PCIe, and SATA. This offering emphasizes low power operation alongside high data transfer rates, optimizing it for integration in sophisticated digital designs requiring efficient data communication.