All IPs > Memory & Logic Library > Embedded Memories
Embedded memories play a crucial role in the architecture of modern electronic devices, offering storage and retrieval capabilities that are integral to processor function and data management. In Silicon Hub's Memory & Logic Library, the Embedded Memories category encompasses a wide variety of semiconductor IPs designed to meet these needs in diverse applications, from consumer electronics to industrial systems.
The primary function of embedded memories is to store and manage data internally within a device, which is essential for efficient processing and quick data access. These semiconductor IPs are typically integrated within a system on chip (SoC) to optimize performance and minimize latency compared to off-chip memory solutions. This integration helps improve overall device performance, reduce power consumption, and enhance the speed of data processing.
Common types of embedded memories available in this category include SRAM (Static Random Access Memory), DRAM (Dynamic Random Access Memory), MRAM (Magnetic Random Access Memory), and non-volatile memory types like Flash and EEPROM. Each type offers distinct advantages, such as high speed in SRAM, lower power consumption in DRAM, or the ability to retain data without power in non-volatile memories. These memory IPs are utilized in a plethora of products from smartphones and tablets to automotive systems and IoT devices, where compact, reliable, and efficient memory solutions are paramount.
Developers seeking to enhance computational efficiency and data handling capabilities in their designs will find this category indispensable. By choosing the right embedded memory IP from our Memory & Logic Library, manufacturers can create products that meet the demanding requirements of modern applications, ensuring reliability and excellent performance in a competitive market.
DenseMem doubles the memory capacity for computing systems linked through CXL, advancing efficiency in managing large-scale data activities. This IP is pivotal in extending capabilities within cloud and enterprise data centers where memory demands are escalating. By seamlessly increasing memory availability, DenseMem supports greater data throughput and processing power, essential for modern data management. Optimizing the memory layout, DenseMem ensures that systems can handle larger datasets with remarkable ease, which is particularly beneficial in data-intensive applications such as big data analytics, machine learning, and real-time processing. This enhancement leads to reduced bottlenecks and improved system responsiveness, making it an essential asset for operations requiring high-level data manipulation. Moreover, DenseMem is crucial for businesses aiming to leverage enhanced data processing without necessitating extensive physical infrastructure upgrades. The efficient management of memory prescribes a balanced approach to scaling operations, contributing to both cost savings and resource conservation within expanding digital environments.
Dolphin Technology offers a comprehensive range of memory IP products, catering to diverse requirements in semiconductor design. These products include a variety of memory compilers, specialty memory, and robust memory test and repair solutions such as Memory BIST. Designed to meet the demands of contemporary low-power and high-density applications, these IPs are built to work across a broad spectrum of process technologies. Advanced power management features, like light and deep sleep modes and dual rails, enable these products to tackle even the toughest low-leakage challenges. What sets these products apart is their flexibility and adaptability, evident in the support for different memory types and process nodes. Dolphin Technology’s memory IPs benefit from seasoned design teams that have proven their mettle in silicon across several generations. Thus, these IPs are not only versatile but also reliable in serving a wide variety of industry needs for technology firms worldwide. Clients can expect memory solutions that are fine-tuned for both power efficiency and performance. Additional capabilities such as power gating cater to ultra-low power devices while achieving a high level of device integration and compatibility. The specialized focus on low noise and rapid cycle times makes these memory solutions highly effective for performance-driven applications. These features collectively make Dolphin Technology’s memory IP an invaluable asset for semiconductor designers striving for innovation and excellence.
LEE Flash G1, Floadia's innovative Sony's Non-Oxide Semiconductor (SONOS) Flash IP, is a cost-efficient memory solution targeted at applications requiring medium memory capacity, reaching up to several hundred kilobytes. It's designed to accommodate automotive-grade specifications, maintaining quality under high temperatures and ensuring long data retention. G1's architecture allows for the seamless reuse of existing CMOS platform designs without altering logic characteristics, thereby reducing development overhead. With a focus on reducing chip costs, LEE Flash G1 minimizes testing and baking times and requires only 2-3 additional masks. Its low power consumption during program and erase cycles is particularly beneficial for power-sensitive applications. The IP is especially adept at scenarios demanding robust performance under extreme conditions, offering significant advantages in automotive and sensor-driven applications. Manufacturers benefit from the architecture's compatibility with industry-standard CMOS processes, ensuring that the integration of G1 does not involve extensive modifications or added costs. This makes LEE Flash G1 a versatile and economically viable choice for a broad range of industry applications where eFlash technology can be effectively employed.
The AndeShape Platforms are designed to streamline system development by providing a diverse suite of IP solutions for SoC architecture. These platforms encompass a variety of product categories, including the AE210P for microcontroller applications, AE300 and AE350 AXI fabric packages for scalable SoCs, and AE250 AHB platform IP. These solutions facilitate efficient system integration with Andes processors. Furthermore, AndeShape offers a sophisticated range of development platforms and debugging tools, such as ADP-XC7K160/410, which reinforce the system design and verification processes, providing a comprehensive environment for the innovative realization of IoT and other embedded applications.
This memory module designed for AHB-Lite masters is fully parameterized, ensuring flexibility and efficiency in hardware designs. It allows for seamless integration of on-chip memory solutions, vital for high-performance applications requiring local data storage. The module supports a wide range of configurations to match specific processing needs.
The CodaCache Last-Level Cache by Arteris provides an optimized caching solution to enhance SoC performance by actively managing memory-related issues like latency and power efficiency. With its configurable architecture, CodaCache allows SoC developers to fine-tune cache settings to unlock performance potential in scenarios requiring intensive data reuse and access. By addressing optimization and integration demands, CodaCache plays a pivotal role in easing challenges such as scalability, timing closure, and layout congestion. This IP effectively supports seamless communication and software integration through AXI support, facilitating efficient data handling. CodaCache capacitates system enhancement with its features, including flexible physical organization, performance monitoring, and cache partitioning. Incorporating it in conjunction with FlexNoC and FlexWay networks, it aids in delivering composite solutions that meet the high-performance requirements of sophisticated SoC designs while simultaneously reducing development time and risk.
The xT CDx is an advanced FDA-approved assay designed for tumor and normal DNA sequencing. Incorporating a comprehensive 648-gene panel, this assay provides critical insights for diagnosing and treating solid tumors, with specific functions in guiding targeted therapies in colorectal cancer patients. The test includes a thorough mutation profiling system that allows healthcare professionals to analyze substitutions, insertions, and deletions, delivering a powerful means to refine treatment options. Beyond the standard, the xT CDx offers tumor and normal matched sequencing to distinguish somatic alterations, reducing false-positive results and improving accuracy in clinical assessments. Its integration into clinical practices is supported by its compatibility with various companion diagnostic claims, making it an essential tool for aligning treatment decisions with approved therapeutic products. By utilizing next-generation sequencing technologies, the xT CDx supports the optimization of treatment pathways and enhances patient care through detailed molecular insights. With the capacity to perform detailed analyses on formalin-fixed paraffin-embedded tumor tissues and matched normal samples, this assay promises high specificity and sensitivity in tumor profiling. Leveraging Tempus' cutting-edge bioinformatics infrastructure, the xT CDx ensures healthcare providers can make informed decisions supported by rich genetic data, setting a transformative benchmark in precision oncology.
Secure OTP is designed to offer superior data protection through anti-fuse OTP technology. This IP provides comprehensive security for embedded non-volatile memory, suitable for CMOS technologies with robust anti-tamper features. Secure OTP simplifies integration for use across multiple IC markets, offering the ability to secure keys and boot code in major applications like SSDs and smart TVs. The IP leverages a 1024-bit PUF for superior data scrambling and secure memory access, thereby safeguarding critical information present in semiconductor devices. Secure OTP is built to address increasing IoT security concerns and stands out for its versatile application across ASIC and SoC platforms.
DXCorr's Static Random-Access Memory (SRAM) offers a critical balance of speed and power consumption, crucial for a multitude of applications in the semiconductor industry. These SRAM designs are highly regarded for their ability to provide fast access times, making them ideal for use in cache memory contexts and other high-speed data applications. They are built to optimize space and performance, catering well to applications that require reliable and quick storage. These SRAMs are tailored to support varied design requirements, with capabilities that span across different process nodes and technologies. By leveraging cutting-edge techniques, DXCorr ensures that their SRAM solutions are power-efficient and robust, even in dual-port SRAM applications that demand concurrent reading and writing operations. This adaptability is especially significant for networking and computing where performance and reliability are paramount. The integration of advanced design methodologies allows these SRAMs to meet stringent industry standards while offering scalability for future demands. Thus, they play a crucial role in modern electronics, assisting devices to maintain lower power profiles while ensuring the highest performance levels.
The Trion FPGA family by Efinix addresses the dynamic needs of edge computing and IoT applications. These devices range from 4K to 120K logic elements, balancing computational capability with efficient power usage for a wide range of general-purpose applications. Trion FPGAs are designed to empower edge devices with rapid processing capabilities and flexible interfacing. They support a diverse array of use-cases, from industrial automation systems to consumable electronics requiring enhanced connectivity and real-time data processing. Offering a pragmatic solution for designers, Trion FPGAs integrate seamlessly into existing systems, facilitating swift development and deployment. They provide unparalleled adaptability to meet the intricate demands of modern technological environments, thereby enabling innovative edge and IoT solutions to flourish.
Designed as an Anti-Fuse One Time Programmable (OTP) memory, LEE Fuse ZA caters to trimming applications and redundancy requirements in memory systems. It stands out by offering high retention life and temperature resilience, indispensable in stringent automotive sectors where dependability is crucial. LEE Fuse ZA is optimized for easy implementation, requiring no additional masks or process modifications. It's an adaptable solution compatible with processes from as wide as 180nm down to advanced sub-10nm nodes, showcasing its versatility across generations of technology. This IP allows for programming at the production line or in-field, adding a layer of flexibility in product customization and post-deployment adjustments. Consequently, it's particularly well-suited for dynamic environments where in-field updates and tweaks might be necessary.
Efinix's Topaz FPGA series is engineered for mass-market applications, delivering a perfect mix of efficiency and adaptability. These FPGAs encapsulate a highly efficient architecture, combined with the industry's essential features and protocols, such as PCIe Gen3, MIPI, and LPDDR4. This configuration allows users to harness substantial performance while maintaining ample room for future innovations. Topaz FPGAs are optimized for high-volume production environments where cost-effectiveness and swift integration are paramount. Their design promotes ease of implementation in various applications, spanning from automotive to deeply embedded systems, where reliability and robustness are key. Featuring a streamlined architecture, Topaz series FPGAs support modern connectivity standards and data processing capabilities. These devices are tailored for industries requiring scalable solutions that can adapt to evolving technological landscapes, ensuring that Efinix customers remain competitive in their respective fields.
Floadia's LEE Flash G2 builds upon the foundational architecture of LEE Flash G1, offering unique enhancements that further broaden its application scope. Notably, this IP iteration requires no high voltage for read operations, a feature that simplifies integration with logic circuits by eliminating isolation areas. It operates efficiently across broader temperature ranges, making it perfect for automotive and other high-precision environments. LEE Flash G2 supports more significant memory capacity, stretching its utility across applications that necessitate storage reaching megabytes. Its compatibility with standard CMOS platforms is a hallmark, underscoring its adaptability and ease of use without impacting pre-existing design parameters or necessitating extensive redesigns. Moreover, the G2 design leverages an innovative power scheme that reduces electrical consumption during both program and erase cycles. This significantly decreases operational costs and enhances testing procedures by reducing test times to a minimum, thereby positioning it as a robust solution for industries seeking efficient, scalable memory solutions.
Silvaco's Embedded Memory Compilers provide leading-edge solutions for high-performance and low-power applications. These compilers are engineered to deliver flexibility and adaptability, accommodating a range of design requirements across various industry applications. The memory compilers are equipped with an advanced architecture that includes options for dual power rails, enhancing operational efficiency and offering improved power management capabilities. The architecture supports extensive yield management strategies, ensuring reliability across multiple process technologies. Silvaco offers a wide array of configurations, from SRAM and ROM to register files, each optimized for minimizing leakage and maximizing performance. These products are proven in hundreds of designs, ensuring they meet the rigorous demands of both consumer electronics and high-performance computing applications.
PermSRAM is an adaptable nonvolatile memory macro compatible with the standard CMOS platform, functioning across process nodes from 180nm to 22nm and potentially beyond. It offers diverse nonvolatile memory capabilities, including one-time programmable ROM and pseudo multi-time PROM, supported by a multi-page configuration. This memory series accommodates a wide range from 64 bits to 512K bits in size. PermSRAM is secured by a hardware safety lock, which ensures the non-rewriteability of sensitive security codes. The macro's design focuses on stability and offers high performance, making it an optimal choice for applications requiring secure code storage.
The xSPI MRAM product family from Everspin is crafted for Industrial IoT and embedded systems, using their proprietary STT MRAM technology. These devices adapt the Expanded Serial Peripheral Interface standard, offering high-speed, low pin count communication with a frequency up to 200 MHz. Operating on a single 1.8V supply, xSPI MRAMs deliver a throughput up to 400MBps, perfect for applications replacing legacy SRAMs, NVSRAMs, or NOR Flash. This range targets diverse sectors including automotive, gaming, and industrial automation.
Analog Bits offers a diverse range of low-power I/O solutions designed to accommodate die-to-die communication needs. These solutions are silicon-proven at 5nm and are in the process of being adapted to 3nm technologies. They feature differential clocking and signaling with crystal oscillators, tailored to provide the highest signaling quality using the fewest transistors. As designed by a reputable company, these customizable IPs are available in high-volume production, backed by support from leading fabs and foundries. Ideal for various semiconductor applications, the I/O solutions provide flexibility and reliability.
DRAM modules are essential components used in a range of electronics, from gaming machines to medical devices. Avant's DRAM offerings are particularly noted for their compliance with JEDEC standards, which ensures interoperability and reliability across different systems and environments. Available in various configurations and designed to manage both low voltage and high power demands, Avant's DRAM caters to industrial, commercial, and consumer needs. Their embedded series of DIMMs offers extensive options, enabling a wide application spectrum, including use in point-of-sale and automation systems.
Specializing as a Zero Additional Mask Multi-Time Programmable (MTP) solution, LEE Flash ZT is engineered for applications requiring high endurance and reliability, particularly in automotive environments. This Flash technology achieves a high level of quality without necessitating additional manufacturing process steps or masks, making it an easy-to-integrate choice for companies looking to minimize production cost while ensuring superior performance. The architecture supports long-term data retention and endures thousands of program/erase cycles, suitable for environments like automotive where rigorous reliability standards are mandatory. Its design employs standard CMOS processes, guaranteeing that existing assets and expertise are leveraged effectively while simplifying deployment and integration. LEE Flash ZT's proven automotive-grade credentials make it an ideal choice for sensor-based applications, where precision and reliability are paramount. This IP supports field programmability, allowing systems to be configured post-production, thereby offering flexibility in deployment.
The Parallel Interface MRAM from Everspin is designed to be SRAM compatible while ensuring non-volatility. Available in configurations supporting both 8-bit and 16-bit parallel interfaces, these MRAMs are tailored to provide high-speed access times of 35 to 45 nanoseconds and unlimited endurance. A protective mechanism prevents unintentional write operations under low power situations, ensuring data reliability over its extended 20-year lifespan. This makes them ideal for applications requiring dependable data retention and quick access.
RADX's Trifecta-SSD-RAID is engineered to satisfy the rigorous data storage demands of PXIe/CPCIe applications, where efficiency and performance are paramount. It excels in providing high-capacity, high-speed data storage ideal for RF and microwave recording, playback, and sustained data transfer activities, achieving up to 7 GB/Sec in sequential read and write speeds. This efficiency ensures that operational performance doesn’t stumble due to SSD write inconsistencies. The modular design of the Trifecta-SSD-RAID allows it to house up to eight M.2 NVMe SSDs within a single PXIe/CPCIe slot, representing a significant leap in storage capacity—ranging from 8TB to 64TB per slot. This makes it a reliable choice for extensive RF/IF data streaming and long-duration data logging systems, thus supporting the most data-intensive applications with ease and speed. Furthermore, the Trifecta-SSD-RAID is built with compliance to crucial international standards and is easily integrated into varied operating environments, supporting 64-bit Windows and select Linux systems. Its performance metrics not only provide high return on investment but also ensure that industries relying on rapid, heavy data traffic have a sustainable and scalable storage solution.
NRAM Technology represents a breakthrough in memory storage that utilizes carbon nanotubes to achieve unprecedented speed and density. At its core, NRAM combines the swift data access of DRAM with the endurance and cost efficiency of emerging memory technology. Non-volatile and highly scalable, this memory solution remains stable and functional even in the most demanding environments, including extreme temperatures and radiance. The innovative approach of using CNTs, or carbon nanotubes, contributes to NRAM's robust performance, allowing it to operate in dual resistive states, representing binary data. Through this method, it achieves lower power consumption during standby and quicker 'instant on' capabilities than existing flash memory systems. Additionally, its construction is compatible with standard CMOS fabrication, eliminating the need for new manufacturing tools, which further reduces cost and complexity. What sets NRAM apart is its potential for scalability beyond 5nm, making it suitable for future technological demands. It can be integrated into various electronic devices, from consumer electronics to enterprise systems, offering high-speed data handling and energy efficiency. This impressive synergy between cost, reliability, performance, and environmental resilience positions NRAM as a transformative memory solution, ready to set new industry standards.
EverOn is a sophisticated ultra-low voltage SRAM solution that provides up to 80% savings in dynamic power consumption and reduces static power by up to 75%. Proven on the 40ULP BULK CMOS process, EverOn operates at unprecedented low voltages, starting at 0.6V, expanding the horizons for IoT and wearable devices in terms of efficiency and performance. EverOn’s architecture supports dynamic voltage and frequency scaling, leveraging SureCore's patented SMART-Assist technology to ensure robust functionality at various supply voltages. This enables device manufacturers to develop products with extended battery lives, crucial in today's competitive market. By offering both architectural innovations and power reduction capabilities, EverOn positions itself as a leader in cutting-edge memory solutions. The product supports extensive memory configurations and banks, further enhancing its flexibility and suitability for next-generation applications. SureCore continues to push the boundaries of design with EverOn, making it a valuable component for developers targeting ultra-low power consumption platforms.
NuRAM Low Power Memory represents a breakthrough in memory technology, utilizing the reliable MRAM architecture to deliver fast access times while significantly reducing leakage power. This IP is a compelling choice for system designs looking to upgrade from traditional SRAM or nvRAM, as well as embedded Flash. Its innovative design allows for substantial size reduction, enabling more efficient memory footprints, which translates into reduced power needs and potentially minimal DDR memory access. Furthermore, the memory can be completely powered down without losing stored data, offering impressive power and latency optimizations that are critical for modern digital systems.
Crossbar's ReRAM Memory represents a revolutionary leap in non-volatile memory technology. This advanced memory solution is distinguished by its simple structure and adaptability, allowing it to scale effectively to sizes smaller than 10nm while maintaining high performance and low power consumption. ReRAM is designed to tackle the intensive demands of modern computational needs, ranging from artificial intelligence to data storage, providing substantial improvements in energy efficiency, writing speeds, and latency. At the core of its operation, ReRAM uses a resistive switching mechanism enabled by a three-layer structure that forms a filament when voltage is applied, facilitating robust and reliable storage solutions. This memory technology is not only about speed and efficiency; it also offers the benefits of integration, with its ability to be incorporated directly with logic circuits within the same foundry process, making it extremely versatile for use in System-on-Chip (SoC) designs and standalone applications. With proven stability across a wide range of temperatures and a remarkable endurance exceeding one million write cycles, Crossbar's ReRAM stands as a viable alternative to traditional flash memory, driving forward the next generation of memory solutions that redefine possibilities in mobile computing, secure IoT, and data center operations.
Spin-transfer Torque MRAM (STT-MRAM) by Everspin harnesses the manipulation of electron spins to create high-efficiency memory solutions. Providing significant energy savings over traditional MRAM models, STT-MRAM offers scalability for high-density applications. It features a perpendicular magnetic tunnel junction which ensures data retention and high endurance, suitable for industrial IoT and enterprise storage uses. The advanced ST-DDR4 interface of STT-MRAM aligns with DDR4 protocols, enhancing its usability in demanding data workloads and environments.
SystemBIST represents a comprehensive plug-and-play device enhancing FPGA configurations and embedded JTAG testing methodologies on PCBs. This sophisticated module allows for seamless FPGA device programming and reconfiguration in-field, supporting IEEE 1532 and IEEE 1149.1 standards. Designed with a vendor-independent approach, SystemBIST offers scalable configurations for both flash memory and CPLD devices, integrating built-in self-tests (BIST) that utilize stored test patterns in flash memory. This product simplifies the traditional complex methods of FPGA configuration, removing the need for large PROM parts and streamlining production concerns with its cost-effective design, widening its appeal across sectors needing flexible, reliable re-programmable solutions.
Providing a versatile and high-performance storage solution, RADX’s Trifecta-SSD-RM serves both PXIe and CPCIe systems well with its M.2 NVMe SSD Data Cartridges that can be easily interchanged. Its design supports breakthrough data speeds of up to 3.5 GB/Sec using PCIe Gen3 interfaces, ensuring quick access to and recording of large volumes of data, critical for intensive data acquisition undertakings. Available in a range of capacities from 1TB to 8TB, the Trifecta-SSD-RM delivers multiple times the capacity of conventional embedded controllers. This module stands out not only for its speed but for its cost efficiency. It is an optimal upgrade path for both existing and new PXIe infrastructures, particularly where security level adaptations and rapid backup investigations are necessary. Notably, this module facilitates software RAID configurations to further enhance data reliability and performance. This adaptability makes the Trifecta-SSD-RM particularly suited to enterprises striving for improved output with robust data collection capabilities, without compromising on economic viability.
TySOM boards are embedded system prototyping platforms that integrate high-performance FPGAs, including Xilinx Zynq and Microchip PolarFire SoCs. These boards are ideal for developing applications like automotive ADAS, AI, and industrial automation. By leveraging industry-standard interfaces, TySOM boards ensure versatility and wide compatibility, making them a cornerstone in rapid application development.
Flash Protection Series extends security frameworks within SoCs, safeguarding critical assets across different types of flash memory like embedded and external NAND/NOR flash. The series utilizes PUF technology to create a secure boundary, preventing intellectual property theft and information breaches. This comprehensive suite supports real-time encryption for secure data execution and caters to multiple memory configurations, adding an additional security layer against potential attacks. With Flash Protection Series, SoCs are better equipped to stall unauthorized access, using innovative asset management techniques standard in critical industry sectors.
Optimized for Intel and AMD FPGAs, the Stream Buffer Controller from Enclustra facilitates efficient data transfer by bridging streams to memory-mapped DMA. This versatile IP core supports up to 16 independent streams, offering a virtual FIFO capability up to 4GB of buffer memory. It utilizes AMBA AXI4-Stream interfaces, enhancing data throughput and flexibility in various data-intensive applications. The core is highly configurable, allowing adjustments in buffer size and addressing to meet specific project needs. Operating modes for each channel include FIFO, write, read, and ROM, providing tailored memory access solutions. This configuration is managed through a memory-mapped slave interface, making it adaptable for use with an embedded CPU or a dedicated stream configuration controller. With support for multiple operational modes, data width conversions, and a unified bus interface, the Stream Buffer Controller is ideal for complex data handling applications like image processing and embedded systems. Its stand-alone capability makes it particularly attractive for projects aiming to minimize additional processing overhead, with a clear layout for straightforward integration into larger system designs.
I-fuse Replaser technology brings a new dimension to fuse-based memory solutions. Tailored to address complex data storage and retrieval needs, it offers heightened performance for high-density applications.\n\nThis IP is characterized by its remarkable capacity for adaptability, supporting seamless integration across multifunctional platforms that require superior data precision and reliability. Such an innovative solution is essential for industries demanding leading-edge memory solutions capable of withstanding intensive data tasks. \n\nThe versatility of this technology spans across industry applications demanding scalability and efficient data processing. By maintaining a continual ability to enhance memory systems, I-fuse Replaser represents the leading edge in cost-effective semiconductor advancements.
Everspin's radiation-resistant MRAM is designed for environments with higher radiation levels such as space applications. This MRAM variant employs advanced magnetic tunnel junctions (MTJs) to provide data resilience against cosmic interference, ensuring reliable performance in space conditions. Everspin stands out by holding extensive test data demonstrating zero hard errors at high-radiation thresholds. These MRAMs are well-suited for aerospace applications where data integrity and retention are critical under adverse conditions.
Intellitech's Fast Access Controller (FAC) is a high-speed, pre-engineered solution tailored for enhancing design-for-test processes, particularly in environments requiring extensive flash programming through FPGA interconnections. The FAC leverages the JTAG standard to offer swift and efficient programming capabilities directly via the 1149.1 bus, reducing overall system programming time and supporting seamless integration with existing computing infrastructure. This controller is engineered for applications demanding quick microcontroller, DSP, or CPU programming in both research and commercial landscapes, facilitating improved design quality and reducing deployment cycles.
SmartMem Subsystem IP enhances ease of use and scalability by optimizing power, performance, and endurance across a variety of memory types, including NuRAM and other MRAM technologies, as well as RRAM, PCRAM, and embedded Flash. This versatile memory subsystem is fully synthesizable and configurable, making it an excellent choice for SOC designs that require customizable compute-in-memory solutions. SmartMem supports high performance in demanding environments, providing essential features for adaptive memory management that greatly improve the deployed memory's operational efficiency and effectiveness. Its value lies in its ability to improve the utility of existing memory technologies while offering a robust framework for new developments.
Xenergic's High-Speed Turbo Memory IP represents a significant evolution in high-speed data processing. This memory architecture leverages predictable access patterns to achieve tremendous reductions in power usage and chip area. By exploiting these predictable patterns, such as those found in AI and graphic processing applications, it manages to operate at double the speed of the fastest current SRAMs available. This solution reduces dynamic power consumption by 80%, diminishes leakage by up to 60%, and minimizes area by 60%, all while maintaining cutting-edge performance capabilities. Its design supports high throughput for applications scalable to large buffer and cache systems, making it perfect for ML, AI, and advanced image processing tasks.
Dedicated to improving one-time programmable memory devices, OTP IP provides extensive configurations that cater to a variety of electronic needs. Central to the function of this IP is its capability to offer robust security measures alongside high-density storage, ensuring data integrity during every use.\n\nBuilt with the latest advancements in process technology, OTP IP supports critical applications such as device calibration and secure boot processes, proving essential for systems where data protection is paramount.\n\nOTP IP's adaptability across multiple platforms makes it a versatile choice for emerging semiconductor needs. Its sophistication allows for integration in complex systems that require stringent reliability and performance benchmarks, demonstrating its worth across multifarious applications.
The EFLX eFPGA is renowned for its capability to provide reconfigurable logic that can be embedded within custom chips. This technology powers advances in various applications, from communication systems to custom ASICs and SoCs, thanks to its high-speed and low-power operation. The flexibility of the EFLX eFPGA makes it a crucial component for industries seeking adaptive solutions to meet specific hardware requirements. Leveraging such technology, companies can future-proof their designs, ensuring continuous compatibility with evolving standards and protocols. Its integration allows for real-time updates and changes, driving system adaptability in fast-paced tech environments.
Xenergic's High-Speed Low-Power SRAM IP is designed to deliver maximum power efficiency without compromising on performance. This solution sees significant reductions in dynamic power usage and leakage, while maintaining high speeds and a competitive area. It is specifically optimized for applications such as IoT, sensors, and wearables, where conserving power is critical due to limited power budgets. The SRAM architecture supports better power optimization through both dynamic and static adjustments, positioning it as an ideal choice for always-on applications. By leveraging its low power nature, it enables efficient computation at the edge, particularly valuable in the burgeoning IoT landscape, ensuring reduced latency and improved device performance.
Crossbar's embedded ReRAM IP cores are designed to push the boundaries of non-volatile memory within microcontrollers (MCU) and system-on-chip (SoC) environments. These IP cores offer high-performance memory solutions that enhance the capabilities of IoT devices, wearables, and various consumer electronics. Available at process nodes starting from 28nm down to below 10nm, the embedded ReRAM solutions focus on achieving cost-effective yet highly reliable data storage and execution speeds. These IP cores not only match but exceed traditional flash memory capabilities with superior endurance and energy efficiency. Designed to meet diverse application requirements, these cores come in a range of densities, from low-memory footprints suitable for small-scale IoT devices to larger capacities needed for complex SoC designs. The technology is adaptable as both standalone memory solutions and as part of an integrated SoC design, ensuring that designers can achieve seamless integration in a wide array of products. The versatile nature of these IP cores makes them ideal for environments that require multi-time programmability alongside secure operations, especially where confidential data and secure keys need reliable protection. Not just limited to enhancing performance metrics, Crossbar's solutions allow for custom memory packaging, facilitating a seamless transition from design to deployment while maintaining rigorous operational standards across all devices.
Crossbar's high-density ReRAM IP cores redefine data storage with their scalable, non-volatile memory technology tailored for environments demanding extensive storage capabilities. Suitable for applications such as data centers, mobile computing, and cutting-edge AI systems, these IP cores provide a unique blend of superior density, low power consumption, and rapid access speeds, ensuring swift data processing and retrieval. The technology behind these cores scales efficiently below 10nm, facilitating the integration of multiple terabytes of storage within a single chip. Crossbar leverages its patented 3D stacking technology to arrange ReRAM cells in expansive cross-point arrays, maximizing utilization of silicon real estate while minimizing power loss and latency. These IP cores surpass traditional storage solutions, offering a new class of memory that caters to the needs of read-intensive tasks, which are pivotal in modern data-driven applications. By exceeding standard NV-DIMM performance metrics, Crossbar's ReRAM gives enterprises the ability to manage larger, more complex data workloads with improved efficiency and reliability. Whether used as a standalone solution or integrated into an overarching SoC architecture, the flexibility and high performance of Crossbar's ReRAM secure its place as a foundational component in the future of digital storage solutions.
TwinBit Gen-2 advances the TwinBit series, supporting process nodes from 40nm to 22nm. It inherits the maskless integration features from Gen-1, facilitating cost-effective and low-power designs. This latest variant employs a novel 'Pch Schottky Non-Volatile Memory Cell' resulting in ultra-low-power operations. Its design is engineered for efficient hot-carrier injection, providing a robust solution for small-scale and energy-sensitive applications requiring non-volatile storage.
TwinBit Gen-1 is a versatile, embedded non-volatile memory solution that seamlessly integrates with CMOS logic processes from 180nm to 55nm nodes. With a focus on endurance, it offers over 10,000 write/erase cycles. Not requiring additional masks or process steps, TwinBit Gen-1 is ideal for sophisticated applications like analog trimming and secure key storage. It provides memory sizes from 64 bits to 512K bits, catering to a broad range of applications including those needing field-rewritable firmware or security codes.
IC Manage's IP Central Management System is designed to streamline the complexities of semiconductor IP management by providing a comprehensive platform for organizing and accessing extensive IP catalogs. This system enables semiconductor firms to publish and store both internally developed and third-party IPs in a centralized, searchable database, ensuring easy accessibility for design teams worldwide. The IP Central system is crafted to enhance IP reuse, addressing the challenges posed by the competing demands on developers’ time and the wide array of historic designs. By creating a user-friendly IP catalog, the system ensures that team members can find and utilize the needed IPs effortlessly, optimizing resources and design efficiencies. Furthermore, IP Central enhances security with controlled access, ensuring that sensitive IP data is protected cohesively. Its comprehensive management capabilities support IP sharing and collaboration across design and engineering teams, driving innovation and reducing time-to-market for semiconductor products.
Spectral CustomIP offers a diverse set of silicon-proven, specialized memory architectures tailored for various integrated circuit applications. This comprehensive lineup includes options like Binary and Ternary CAMs, multi-ported memories, low voltage SRAMs, caches, and eFlash, showcasing Spectral's versatility in memory architecture design. Each CustomIP solution leverages foundry or custom bit cells to ensure robust counting while delivering high-density and low-power operations. These Speciality IPs focus on achieving speedy performance with minimal power use, aligning with the stringent demands of contemporary chip designs. Additionally, these are available in source code format, empowering users to further adapt the technology to their specific technological needs and capabilities. The range supports a multitude of features such as separate power rails, advanced compiler options, multiple aspect ratios, and comprehensive SOC integration views, making it applicable for a wide array of consumer electronics ranging from mobile devices to hearing aids. With rights-to-modify packages available, Spectral CustomIP allows for a breadth of customization to meet exacting specifications and market demands.
Spectral's MemoryIP encompasses a suite of silicon-proven, high-density, low-power SRAMs, built to optimize embedded systems. Offering six core compiler architectures, including Single Port and Dual Port SRAMs, ROM, and Register Files, these designs integrate advanced circuitry to maintain high-speed operations while minimizing power use. The solutions use either foundry or Spectral custom bit cells, ensuring solid performance coupled with spectral capabilities available in source code for further customizability. The MemoryIP is crafted not just for efficiency, but for adaptability, supporting multiple aspect ratios and high-density designs. Features such as separate power rails enhance flexibility and performance optimization across various scenarios. MemoryIP libraries support a full integration view set, easing the implementation process for developers and ensuring seamless compatibility with modern CMOS processes. This product line is also distinguished by the integration of SpectralTrak™ technology, which dynamically monitors environmental changes to safeguard critical memory operations. With options for deep customization and licensing, Spectral MemoryIP remains a versatile choice for fabless companies and foundries seeking a foundational memory library that delivers performance and efficiency.
The TSP1 Neural Network Accelerator from Applied Brain Research is a cutting-edge AI solution built to handle complex AI workloads with remarkable efficiency. Designed specifically for battery-powered devices, this chip excels in low-power operations while processing extensive neural network tasks. At its core, the TSP1 integrates state-of-the-art processing capabilities tailored for time series data, essential for applications like natural voice interfaces and bio-signal classification. This innovative chip is notable for its energy efficiency, consuming less than 10mW for complex AI tasks, making it an ideal solution for energy-conscious applications. Furthermore, it supports an array of sensor signal applications, ensuring versatile functionality across different domains including AR/VR, smart home automation, and medical wearables. By incorporating the Legendre Memory Unit, a proprietary advanced state-space neural network model, the TSP1 achieves superior data efficiency compared to traditional network architectures. ABR’s TSP1 stands out for its ability to perform powerful AI inferences with low latency, essential for real-time applications. It supports a wide range of interfaces, making it suitable for diverse integration scenarios, from voice recognition to industrial automation. Additionally, the chip's optimized hardware is key for algorithm scaling, facilitating smooth processing of larger neural models without compromising speed or performance.
CellSage is a robust tool for battery health modeling, simulation, and analysis, delivering precision insights into lithium-ion battery performance under real-world conditions. Results from a decade of research supported by the Idaho National Laboratory, this platform adopts hybrid modeling techniques that combine data-driven and physics-based approaches. Users get a comprehensive suite for analyzing aspects like capacity fade, thermal management, and operational parameters impacting battery life. CellSage is essential for sectors needing reliable battery management, helping reduce upfront R&D costs and accelerate development timelines. It further supports optimal battery management, enhancing safety and efficiency. Designed for academic and industrial researchers, CellSage facilitates dynamic interaction and integration with Battery Management Systems (BMS) and Integrated Vehicle Health Monitoring systems. It aids in ensuring precise state-of-health assessments and RUL predictions, thus supporting Condition-Based Maintenance. This capability not only improves operational continuity but also extends the battery lifespan, enabling forward-thinking battery technology.
Everspin's Serial Peripheral Interface MRAMs provide an efficient solution for applications where high-speed data retrieval and storage are necessary but with a minimal pin count. These MRAMs support SPI configurations, including a Quad SPI variant that achieves faster read and write speeds of up to 52MB per second. They are ideally suited for next-gen RAID controllers, storage device buffers, and embedded system applications, providing a small footprint with their 16-pin SOIC packaging. This series offers fast, persistent memory for data-critical environments.
The GCRAM On-Chip Memory represents a breakthrough in semiconductor memory technology, designed to address the modern constraints of chip design where memory often occupies over 50% of the total chip area. This state-of-the-art technology minimizes silicon area requirements by up to 50% compared to traditional SRAM technologies. Additionally, it achieves a tenfold reduction in power consumption while maintaining compatibility with standard CMOS processes. GCRAM technology is particularly suited for applications demanding high efficiency and performance, such as artificial intelligence, virtual and augmented reality, and automotive systems. The on-chip memory enables chips to operate at significantly lower power levels, thereby enhancing overall system performance and reliability. Given the rising complexity of systems and the termination of Moore's Law for SRAM, GCRAM provides an adaptable and scalable solution for advanced computational needs. Manufacturers can integrate this memory solution without additional fabrication costs or process modifications, making it a cost-effective and seamless addition to existing semiconductor manufacturing workflows. GCRAM not only extends the life and capabilities of chips but also contributes to longer product lifecycles and enhanced performance in demanding technological applications.