All IPs > Memory Controller & PHY > HBM
In the world of high-performance computing and advanced data processing applications, HBM (High Bandwidth Memory) has become a pivotal technology. This category in our Silicon Hub encompasses Memory Controller & PHY semiconductor IPs specifically designed for HBM. Such semiconductor IPs are essential for connecting memory systems that require exceptionally high bandwidth with reduced power consumption, facilitating next-generation computing tasks.
HBM Memory Controller & PHY IP cores are utilized to interface between System on Chip (SoC) processors and HBM stacks, ensuring efficient data transmission and processing. These IPs are crucial in various applications, including graphics processing units (GPUs), network devices, and data centers, where performance and speed are critical. With the integration of HBM technology, products achieve increased memory throughput, which significantly enhances overall system performance.
The Memory Controller within these semiconductor IPs handles the flow of data to and from the HBM, ensuring optimal usage of bandwidth and managing multiple requests effortlessly. The PHY (Physical Layer) component, on the other hand, serves as the critical physical interface, translating digital data into signals that the memory can recognize and process. Together, these components enable high-speed data applications to leverage HBM's full potential while minimizing power usage.
By adopting HBM Memory Controller & PHY semiconductor IPs from our Silicon Hub, designers and developers gain access to state-of-the-art solutions that provide unmatched efficiency and speed for memory-intensive operations. Whether developing cutting-edge AI applications or high-resolution gaming systems, integrating these advanced IPs into your designs will provide the competitive edge needed to meet modern technology demands. Explore our selection to find the perfect IP to enhance your high-bandwidth projects.
The Aries fgOTN processor family is engineered according to the ITU-T G.709.20 fgOTN standard. This line of processors handles a variety of signals, including E1/T1, FE/GE, and STM1/STM4, effectively monitoring and managing alarms and performance metrics. Aries processors excel at fine-grain traffic aggregation, efficiently channeling fgODUflex traffic across OTN lines to support Ethernet, SDH, PDH client services. Their capacity to map signals to fgODUflex containers, which are then multiplexed into higher order OTN signals, demonstrates their versatility and efficiency. By allowing cascaded configurations with other Aries devices or Apodis processors, Aries products optimize traffic routes through OTN infrastructures, positioning them as essential components in optical networking and next-generation access scenarios.
The Apodis family of Optical Transport Network processors adheres to ITU-T standards, offering a comprehensive suite for signal termination, processing, and multiplexing. Designed to handle both SONET/SDH and Ethernet client services, these processors map signals to Optical Transport Network (OTN), empowering versatile any-port, any-service configurations. Apodis processors are notable for their capacity to support up to 16 client ports and four 10G OTN line ports, delivering bandwidth scalability up to 40G, crucial for wireless backhaul and fronthaul deployments. With a robust, non-blocking OTN switching fabric, Apodis facilitates seamless client-to-line and line-to-line connections while optimally managing network bandwidth. This adaptability makes the Apodis processors an ideal choice for next-generation access networks and optical infrastructures.
The DDR5/4 PHY & Memory Controller from SkyeChip presents an outstanding solution for high-performance and power-efficient memory interfacing, adhering strictly to the DDR5 (JESD79-5) and DDR4 (JESD79-4) standards. This single solution offers a comprehensive PHY & Controller setup with a remarkable efficiency of over 85%. It supports data rates up to 4800 MT/s and can be upgraded to 6400 MT/s, making it ideal for a variety of applications. SkyeChip's design includes advanced I/Os and configurable training sequences, providing flexibility and robustness in supporting diverse SDRAM modules and ranks, and allowing for seamless integration into complex memory systems.
The Orion MFH IP Cores are designed for optimal performance in 4G mobile fronthaul networks, compliant with the ITU-T specifications for CPRI signal multiplexing. They adeptly handle various CPRI options, ranging from 2.4576 Gbps to 12.16512 Gbps, ensuring high compatibility and performance. Featuring both muxponder and transponder configurations, Orion cores facilitate the efficient mapping and transport of CPRI signals via Optical Transport Network infrastructures, ideal for modern telecommunications frameworks. Their advanced capabilities enable telecommunications providers to enhance their network reliability and service delivery, adapting seamlessly to different fronthaul scenarios.
The RWM6050 baseband modem by Blu Wireless represents a highly efficient advancement in mmWave technology, offering an economical and energy-saving option for high bandwidth and capacity applications. Developed alongside Renesas, the modem is configured to work with mmWave RF chipsets to deliver scalable multi-gigabit throughput across access and backhaul networks. This modem is ideal for applications requiring substantial data transfer across several hundred meters.\n\nThe RWM6050 leverages flexible channelization and advanced modulation support to enhance data rates with dual modems and integrated mixed-signal front-end processing. This ensures that the modem can effectively handle diverse use cases with varying bandwidth demands. Its versatile subsystems, including PHY, MAC, ADC/DAC, and beamforming, facilitate adaptive solutions for complex networking environments.\n\nA standout feature of the RWM6050 is its integrated network synchronization, ensuring high precision in data delivery. Designed to meet the futuristic needs of communication networks, it helps end-users achieve superior performance through its programmable real-time scheduler and digital front-end processing. Additionally, the modem's highly digital design supports robust, secure connections needed for next-generation connectivity solutions.
SkyeChip's HBM3 PHY & Memory Controller is an advanced memory interface solution optimized for AI, HPC, data centers, and networking applications. It conforms to the HBM3 (JESD238A) JEDEC standards, ensuring compatibility and reliability. The solution supports a seamless integration of PHY and Controller functions, achieving a remarkable average random efficiency of over 85%. Capable of handling up to 6400 MT/s for HBM3, and extending up to 9600 MT/s for future-proofing with HBM3E. This memory controller supports up to 32Gb density per die and utilizes state-of-the-art 2.5D/3D packaging technologies to cater to diverse design architectures, including interposer designs and memory repairs.
The MVDP2000 series is engineered to deliver high sensitivity in differential pressure measurement using proprietary capacitive technology. This series is specifically designed for applications that demand precision and low power use, excelling in environments such as healthcare, HVAC, and industrial settings. It provides fast and accurate pressure readings while maintaining low energy consumption, making it suitable for portable and OEM devices where efficiency and quick response are essential.
The Scorpion family of processors offers support for OSU containers as per the CCSA and IEEE standards, particularly the OSUflex standard. These processors accommodate various client-side signals, including E1/T1, FE/GE, and STM1/STM4, ensuring robust performance monitoring and optional Ethernet rate limitation. Scorpion processors can adeptly map these client signals to OSU or ODU containers, which are subsequently multiplexed to OTU-1 lines. Known for their flexibility and efficiency in handling diverse traffic types, Scorpion processors serve as foundational elements for advancements in access networks and optical service units, ensuring sustained performance in increasingly complex networking environments.
The D-Series DDR5/4/3 PHY from MEMTECH is designed to address high-performance demands in servers, desktops, laptops, and other consumer electronics. It provides high-bandwidth and energy-efficient operations, supporting data rates up to 6400 Mbps. This PHY interface integrates effortlessly into designs, offering robust features like advanced calibration routines, signal integrity tests, and supports multitudes of DDR standards. This high-tech solution comes as a hard macro, ensuring ease of integration and maximum performance, particularly suited for high-demand applications needing registered and load-reduced modules. The D-Series DDR5 PHY offers further enhancements with support for data rates over 6400Mbps, featuring a variety of calibration and equalization techniques to ensure peak performance in varying conditions.
Presto Engineering offers a comprehensive range of foundational and platform-specific semiconductor IPs designed to meet diverse application needs. The Foundation IP includes a wide array of vital circuit blocks, such as high-accuracy sensors, digital controllers, and interface blocks. These fundamental IPs aim to reduce ASIC development risks by leveraging proven components like secure encryption blocks with low power consumption or analog front ends with enhanced specific capabilities. The Platform IPs, on the other hand, provide extensive customization options from functional design to optimized power efficiency. Users can expect specialized analog front ends tailored to demanding specifications such as high-dynamic optical handling, ultra-low-power motion ISP, and MCU integration. Moreover, RFID/NFC/UHF/ISM connectivity solutions are part of this lineup, all of which contribute to efficient energy management and harvesting applications. Presto Engineering's semiconductor IP offerings are geared towards enabling rapid development and ensuring cost-effective project realization, which in turn helps firms achieve faster market entry. By providing validated and efficiently designed IPs, Presto supports clients in overcoming both technical hurdles and market competition, facilitating successful product integration and implementation.
The SMS OC-3/12 Transceiver Core from Soft Mixed Signal Corporation is specially crafted for telecommunication applications, supporting SONET standards including OC-3 and OC-12. With an innovative architecture, this core integrates numerous functionalities such as clock synthesis and recovery within a compact, sub-micron CMOS process. It is engineered to conform to stringent jitter specifications as outlined by ANSI, Bellcore, and ITU, ensuring exceptional signal fidelity and stability. This transceiver harnesses proprietary signal processing technology to manage jitter effectively, offering robust performance even in challenging environments. Capable of handling multiple data rates, it supports essential telecommunication functions like jitter tolerance, transfer, and generation, making it versatile for deployment in various network systems. Furthermore, its design facilitates seamless integration into larger systems, offering significant scalability. Tailored for multi-port applications, this core's design enables easy migration to new applications while preserving performance standards. Its robust PLLs, featuring built-in loop filters, provide superb immunity to noise, a crucial factor for maintaining system integrity during data transmission. The OC-3/12 Transceiver Core is a testament to Soft Mixed Signal's commitment to innovative, high-performance telecommunication solutions.
Eliyan's NuLink Die-to-Memory PHY technology stands as a testament to the company's innovative approach toward enhancing semiconductor performance without resorting to advanced packaging. This IP solution offers low-power, high-performance connectivity capabilities for die-to-memory interconnects, utilizing the same foundational NuLink technology adapted for unique applications. Unlike traditional unidirectional designs, this PHY provides a more fluid data transfer, supporting a diverse range of industry standards while maintaining efficiency and adaptability. The NuLink Die-to-Memory PHY product allows integrations on both standard and advanced packaging, delivering exceptional performance metrics. In contrast to established methods that often necessitate complex silicon interposers, Eliyan’s solution is able to provide equivalent, if not superior, results using standard packaging techniques. Its structure is geared towards minimizing power consumption and maximizing data throughput, thus enabling the realization of more powerful and efficient semiconductors. This technology is particularly beneficial for applications requiring dynamic interfacing between dies and memory, making it viable for a multitude of cutting-edge electronic devices. By offering scalable and effective solutions, Eliyan facilitates advancements in both traditional memory coupling and emerging semiconductor technologies.
Tower Semiconductor’s Non-Volatile Memory (NVM) Solutions are at the forefront of embedded memory technology, providing enhanced functionality for diverse applications. These solutions offer remarkable ultra-low power consumption and high endurance, crucial for automotive grade products and a variety of consumer electronics. By implementing versatile memory modules, Tower Semiconductor enables faster programming with low start-up times, addressing the industry's demand for efficient and rapid data processing capabilities. Embedded within mixed-signal processing systems, these NVM solutions facilitate high levels of integration within System-on-Chip (SoC) architectures. The robust memory retention characteristics ensure reliability, and their security features make them ideal for sensitive data applications. Tower Semiconductor’s NVM technologies are supported by numerous US patents, setting a gold standard in reliability and manufacturing assurance for cutting-edge semiconductor applications. The diverse portfolio of NVM solutions is integral to supporting varied market needs, allowing flexibility in design and scalability in application-specific integrations. Coupled with outstanding technical support, Tower Semiconductor empowers designers with comprehensive tools to seamlessly embed non-volatile memory into their products, fast-tracking market readiness while enhancing product reliability and consumer satisfaction.
DDR Solutions encompass a comprehensive range of DDR technologies designed to enhance memory bandwidth and efficiency within various computing environments. Constant updates ensure they are aligned with the current standards, maintaining backward compatibility to support earlier DDR generations. These solutions support DDR, DDR2/3/4/5, and LPDDR configurations, making them suitable for everything from consumer electronics to computational servers. They include memory interfaces and PHY elements, which are critical in optimizing system performance and stability. The advanced capabilities of DDR Solutions make them ideal for developers aiming to exploit high-speed memory interfaces in their designs. Whether dealing with desktop computers, mobile devices, or complex server architecture, these solutions provide the necessary framework to enhance memory performance significantly.
Crossbar's ReRAM technology is adept as a flexible non-volatile memory solution capable of supporting few-time programmable (FTP) and one-time programmable (OTP) applications. This adaptability is due to the technology's inherent simplicity and scalability across different process nodes, making it a natural choice for secure applications, where memory reliability is paramount. ReRAM's inherent structure allows for robust FTP and OTP capabilities, fitting well into existing semiconductor processes without requiring drastic changes to architecture or foundry standards. Customarily, these memory types find their usage in applications that require embedded physical unclonable functions (PUF) alongside MTP, OTP, and FTP functionalities on the same substrate, adding layers of security via dynamic memory partitioning. The optimization provided by Crossbar also leads to reduced die sizes and cost-effective solutions that retain the high performance users expect from state-of-the-art non-volatile memory technologies. The deployment of FTP/OTP ReRAM in both secure and general-purpose computing environments assures a seamless transition from conventional memory technologies, easing the adoption of new designs without sacrificing integrity, thereby enabling OEMs to develop innovative products with enhanced functionalities and lower power profiles.
The H-Series HBM2/HBM2E PHY offered by MEMTECH is optimized for high-bandwidth applications demanding low latency and high performance. It features up to 8 memory channels and can support up to 8H stack configurations, catering to AI, ML, and high-performance computing needs. Designed for reduced area and power use, this PHY includes advanced interfacing with pseudo-channel support for peak bandwidth. It can handle various clock ratios, offering a Standard DFI 5.0 interface for ease of integration and superior performance in graphics and networking applications.
LogicFlash Pro® eFlash stands out as Actt's cutting-edge embedded flash technology. It is engineered to provide large-capacity storage while maintaining high performance and reliability standards. The technology is tailored for applications that require robust storage solutions, combining large memory capabilities with efficient access speeds, making it ideal for high-demand environments.
Designed for high-end applications, the MidasCORE HBM3 PHY enhances bandwidth capabilities to meet the needs of graphics, high-performance computing, networking, and communication systems. The PHY is engineered for efficient power usage and incorporates advanced design processes to ensure reliable performance. This IP can be part of a complete 2.5D system package with additional design support, demonstrating Alphawave Semi's commitment to tailored solutions.
MEMTECH's H-Series HBM2 and HBM2E PHY provide a top-tier interface solution for high-performance computing environments requiring extensive bandwidth and low latency. These IP cores support large data throughput capacities, furnishing scalability across applications in artificial intelligence, gaming, and high-performance computing. By integrating seamless interfacing capabilities and energy-conscious innovations, the H-Series PHY empowers designers to build systems that meet modern computational demands without compromising performance.
HermesCORE is a high-capacity memory controller designed to provide elevated bandwidth and reduced latency for graphics and networking applications. It supports the full HBM3 feature set, lying at the heart of data-intensive applications where memory throughput is critical. Its configurable nature enhances system efficiency, adapted specifically for workloads requiring scalable and responsive memory management.