All IPs > Network on Chip
Network on Chip (NoC) semiconductor IP is a pivotal element in the design and development of highly integrated electronic systems and chips. As devices become more complex and contain multiple processing units, effective communication through reliable interconnections is crucial. NoC IPs provide a scalable and efficient way to connect various intellectual properties (IPs) within a system on chip (SoC), enabling improved data transfer, performance, and power efficiency.
In modern multicore processor architectures, the traditional bus-based communication faces challenges with scalability, latency, and energy consumption. NoC IPs address these issues by offering packet-based communication paradigms, which are structured like networks to efficiently manage data flow between cores, memory controllers, and peripheral interfaces. This technology is vital for a range of applications including data centers, mobile processors, automotive systems, and beyond. It not only helps in breaking the bandwidth bottleneck but also enhances the overall performance of the system.
A detailed exploration of the Network on Chip category reveals various types of IPs designed to cater to different specific needs, including low-latency networks, high-bandwidth connections, and power-conserving interfaces. Developers and designers can choose from pre-verified solutions by leading vendors, ensuring reliability and reducing time to market. Functionalities offered by these IP solutions might include advanced routing algorithms, traffic prioritization, security features, and error correction mechanisms.
Furthermore, semiconductor IPs in the Network on Chip category are continuously evolving to support emerging technologies such as AI, IoT, and 5G. This makes NoC IPs not only a fundamental infrastructure element but also a key enabler of future technological advancements. Companies seeking to develop state-of-the-art, fully integrated SoCs will find the NoC IP category indispensable in constructing efficient and robust systems capable of meeting current and future demands.
SkyeChip's Coherent Network-on-Chip (NOC) is an innovative, scalable solution designed to support memory coherent systems. Engineered to decrease routing congestion in many-core systems, it effectively utilizes nodes like ACE4, ACE5, and CHI protocols. Operating efficiently at frequencies up to 2GHz, it complements SkyeChip’s Non-Coherent NOC for integrated and partitioned interconnect systems. The solution’s focus on reducing silicon usage makes it a prime candidate for applications where performance and area efficiency are paramount, ensuring seamless system integration with high coherency requirements.
The NoC Bus Interconnect from OPENEDGES Technology is an integral component of the ORBIT Memory Subsystem, engineered to offer high performance and efficient area use in semiconductor designs. Its design is centered around facilitating exceptional connectivity and adaptability within system-on-chip (SoC) architectures, employing an automated end-to-end interconnect generation flow. This interconnect solution excels in delivering high-speed routing with low latency, thanks to its use of HyperPath technology which enables superior throughput and flexibility in physical design. The NoC Bus Interconnect's ability to dynamically control bandwidth and latency, coupled with efficient clocking methods, supports diverse applications ranging from AI/ML to automotive technology. Incorporating advanced ActiveQoS bandwidth management, this interconnect offers significant advantages in managing traffic, reducing congestion, and enhancing overall SoC performance. It features long-distance Asynchronous Bridge (LDA) technology, optimizing connections across distant domains on a chip without the added complexity of a typical register slice scheme.
The Non-Coherent Network-on-Chip (NOC) by SkyeChip is designed to optimize bandwidth and latency for various ICs, focusing on reducing power and area needs while enhancing performance metrics. The solution supports a multitude of protocols such as AXI4, AXI5, and APB, thereby providing excellent routing and operation flexibility. It handles operating frequencies up to 2GHz, providing a robust platform for efficient IC interconnections. Its architecture supports both source synchronous and synchronous clocking models, making it suitable for high-frequency applications, while integrating seamlessly with SkyeChip's Coherent NOC.
Eliyan's NuLink Die-to-Die PHY for standard packaging is a technological innovation designed to enhance chiplet interconnectivity within conventional package forms. Tailored to seamlessly integrate with both silicon bridges and organic package substrates, this product eliminates the need for advanced packaging solutions while matching their performance characteristics. By achieving the same remarkable levels of data transfer efficiency and power optimization typically associated with advanced methods, NuLink technology stands out as a cost-effective solution for multi-die integration. Targeted for ASIC designs, the NuLink Die-to-Die PHY is capable of supporting a wide array of industry standards including UCIe and BoW. Its design enables the connection of chiplets in standard packaging without requiring large silicon interposers, ensuring both significant performance gains and cost savings. This flexibility makes it particularly appealing for systems that require mixing and matching of chiplets of varying dimensions. In practical applications, Eliyan’s solution facilitates increased placement flexibility and supports configurations that demand physical separation of components, such as those between hot ASICs and heat-sensitive dies. By leveraging a standard packaging approach, this PHY product provides substantial improvements in thermal management, cost efficiency, and production timelines compared to traditional methods.
The Xinglian-500 Interconnect Fabric is a self-developed solution by StarFive that focuses on providing consistent memory coherence in multicore CPU and SoC implementations. This IP solution is pivotal in constructing multicore systems by connecting various CPU clusters, I/O devices, and DDR, ensuring efficient data management and communication within high-performance systems. It introduces a network-on-chip (NoC) mechanism that supports multiple CPU clusters, enhancing the overall system performance through streamlined communication paths. The Xinglian-500 is engineered to maintain memory coherence across the SoC environment, making it an invaluable component for developers looking to optimize multicore processing solutions. Due to its scalable architecture, the Xinglian-500 offers flexibility in configuration, readily adapting to the growing demands of computational efficiency. It is designed to support both consumer and enterprise-level applications, enabling lengthy and complex operations with enhanced bandwidth management and reduced latency.
The HUMMINGBIRD by Lightelligence is an innovative optical Network-on-Chip processor that integrates photonic and electronic dies through advanced vertically stacked packaging technologies. This architecture provides a pathway to overcome conventional digital network limitations, particularly the 'memory wall.' With a 64-core domain-specific AI processor, HUMMINGBIRD uses a cutting-edge waveguide system to propagate light-speed signals, drastically reducing latency and power requirements compared to traditional electronic networks. This high-performance device serves as the communication backbone for data centers, facilitating data management and interconnect topology innovations. HUMMINGBIRD exploits the power of silicon photonics to offer a dense all-to-all data broadcast network that enhances the performance and scalability of AI workloads. HUMMINGBIRD's robust integration into PCIe form factors allows easy deployment onto industry-standard servers, and when paired with the Lightelligence Software Development Kit, it can significantly optimize AI and machine learning processes. This integration fosters a higher utilization of computing power and alleviates complexities associated with mapping workloads to hardware.
The nxFeed Market Data System is a high-performance FPGA-enabled feed handler that significantly improves the development and deployment of market data applications. By processing data feeds directly on FPGA hardware, nxFeed reduces latency and server load, providing reliable and swift access to critical market data. Built to complement trading applications or support in-house ticker plant development, nxFeed efficiently handles data arbitration, decoding, normalization, and order book creation with ease. This streamlined FPGA-based solution ensures minimal latency and enables developers to focus on core business logic rather than data processing bottlenecks. The system offers a versatile deployment model, adaptable via PCIe integration or through Ethernet distribution, catering to various infrastructural needs. With an easy API and swift integration capabilities, nxFeed offers a highly agile solution for firms focusing on high-frequency trading and other latency-sensitive applications.
The Bluetooth LE Audio Solutions offering by Packetcraft is a comprehensive package designed to streamline the transition to Bluetooth LE Audio functionalities. This suite includes pivotal components such as host, controller, and LC3 audio codec optimization, all integrated for ease of deployment. The inclusion of Auracast broadcast audio support, alongside TWS stereo compatibility, ensures that the solution caters to a diverse range of audio needs across various applications. Packetcraft has engineered these solutions to be chipset-agnostic, meaning they are already tested and ported to work seamlessly with popular chipsets available in the market. This offers product companies considerable flexibility in deployment, as they can leverage existing hardware platforms to implement advanced Bluetooth audio solutions without significant redevelopments. Aimed at reducing time to market, these solutions are crafted to help manufacturers roll out products that are both innovative and efficient. Furthermore, these solutions are not just about facilitating transitions; they are about enabling advancements. By adopting Packetcraft’s Bluetooth LE Audio Solutions, companies can ensure their products are ready to support the latest in audio transmission and broadcasting technologies, maintaining competitive edges and future-proofing their product lines. This comprehensive support makes it easier for enterprises to adopt new standards like Auracast, thereby maximizing the utility and consumer appeal of their audio offerings.
The NOC-X, or Network on Chip, developed by Extoll, serves as a crucial infrastructure for advanced chiplet systems, providing a highly efficient communication backbone for complex semiconductor designs. This technology is specifically architected to cater to the demands of high-data traffic environments, offering ultra-low power consumption and greatly enhanced data throughput. With Extoll's expertise in digital-centric architectures, the NOC-X is designed to streamline data transfer across large-scale chiplet configurations, ensuring that bandwidth is optimized, and latency is minimized. This network system is pivotal for integrating sizeable multicore designs, significantly enhancing the ability of various cores to operate in sync, while maintaining low energy costs. The NOC-X’s offerings make it indispensable in applications requiring precise control and efficient data management. Engineers and developers focusing on next-generation semiconductor designs will find NOC-X to be an invaluable asset. It simplifies the implementation of complex network topologies within a chip, thus paving the way for more scalable and powerful computing solutions. By integrating the NOC-X into their systems, developers can achieve remarkable improvements in system performance and efficiency, meeting the rigorous demands of modern technological applications.
The Speedster7t FPGAs are renowned for their optimization for high-data-rate applications. Engineered to overcome the limitations faced by conventional FPGA architectures, they provide significant enhancements in bandwidth, making them ideal for complex, data-intensive tasks. The unique architecture of Speedster7t mitigates traditional bottlenecks by incorporating features such as PCIe Gen5, 400G Ethernet, and support for the latest memory interfaces like DDR4 and GDDR6, ensuring swift processing and data transfer for demanding applications. These FPGAs cater to a range of fields including AI, machine learning, networking, and 5G infrastructure. Their design includes an innovative Network-on-Chip (NoC) architecture that effectively manages data communication internally, ensuring higher throughput and lower latency. This makes Speedster7t devices particularly suited for applications requiring extensive data crunching and fast interconnectivity. Furthermore, Speedster7t FPGAs are built to accommodate modern design challenges. They integrate seamlessly with Achronix's ACE design tools, providing users with a cohesive environment for developing high-performance systems. The FPGAs are supported by extensive documentation and technical support, making them an accessible choice for industries aiming for robust, scalable solutions in high-performance computing contexts.
aiSim 5 stands out as the first ISO26262 ASIL-D certified simulator tool designed for validating ADAS (Advanced Driver-Assistance Systems) and AD (Automated Driving) technologies. This simulator offers an unparalleled environment for testing automated driving systems, utilizing a highly optimized sensor simulation framework which ensures robust performance in runtime. Its advanced rendering engine produces realistic and deterministic environments, bypassing limitations typically found in game engine simulators. This tool is pivotal for car manufacturers as it enhances the reliability and safety of automated driving solutions. aiSim 5 boasts a flexible architecture that integrates smoothly with existing toolchains, encouraging a reduction in costly real-road testing. It focuses significantly on multi-sensor simulation, supporting diverse weather conditions and complex driving scenarios, which are essential for developing adaptive driving systems. This simulation environment allows for high mileage tests, vital for understanding and improving the effectiveness of driving systems in various settings. Additionally, aiSim 5 supports the creation of digital twin 3D environments that replicate real-world locations accurately. This enables a high-fidelity simulation of operational design domains, from highways to urban settings. aiSim's capability to simulate adverse scenarios such as snowstorms or heavy rain showcases its comprehensive approach to ensuring that AD systems are tested under every possible real-world condition.
As an upgraded version of its predecessor, the Smart Vision Processing Platform - JH7110 enhances image and video processing capability with its high-performance RISC-V SoC. Featuring a four-core U74 processor, the JH7110 achieves a clock speed of up to 1.5GHz, enhancing the processing power significantly over the previous generation. The platform's core advancements include a more robust multimedia processing system integrated with a high-performance GPU. Further enriched by an array of high-speed interfaces, the JH7110 maintains coherence in processing large-scale data management tasks. Designed with a focus on reducing power consumption while maximizing output, it remains an excellent option for high-demand computing environments. Its applications extend into cloud computation, industrial control, and intelligent network applications, making it a versatile and future-proof solution. Supporting an extensive range of peripherals and communication interfaces, the JH7110 is suitable for numerous applications, from personal computing devices to advanced industrial machinery.
FlexNoC Interconnect by Arteris is a groundbreaking physically aware network-on-chip (NoC) interconnect technology designed to facilitate faster SoC creation and deployment. It offers a state-of-the-art backbone for on-chip communication, supporting a wide variety of semiconductor design needs across dynamic market sectors. Integrating this technology can remarkably shorten the system's turn-around time by up to five times compared to manual iterations, thereby boosting efficient design completions. FlexNoC's architecture is formulated using an intelligent combination of elementary components, which are adeptly merged via sophisticated algorithms and a user-friendly GUI, allowing flexible topology creation. It supports an extensive range of SoC scales, seamlessly integrating source-synchronous communications and virtual channels. This results in superior performance with broad bandwidth capabilities, especially in driving on-chip data flow and interfacing with off-chip memory. Key features of the FlexNoC include automatic assistance for timing closure, visual integration on floorplans, and multi-clock/power domains. With multi-protocol capabilities aligning with AMBA standards, it facilitates quality of service (QoS), security, and in-system debugging, thereby aligning with the stringent requirements of modern semiconductor designs. The FlexNoC interconnect is a crucial tool for developers aiming at high-frequency, low-latency, and reduced power consumption within their SoC projects.
FlexWay Interconnect is a premier entry-level network-on-chip (NoC) IP by Arteris, specifically tailored for cost-effective and low-power applications, such as IoT edge devices and microcontrollers (MCUs). As part of the Flex family, FlexWay combines powerful algorithms and a user-friendly interface to create highly effective NoC designs suited for small to medium-scale SoCs, emphasizing efficiency and scalable designs. FlexWay leverages its simple to medium complexity scalability to adapt to embedded applications, ensuring performance without compromise on power efficiency. It encompasses multi-clock/power/voltage domains with unit-level clock gating, robust multi-protocol support, and integrated system simulation and verification support. Moreover, it supports AMBA 5, facilitating effective QoS management. This solution further enhances SoC development with its automated workflow, providing improved productivity and early error detection, facilitated through platforms like Magillem Connectivity. With a focus on reducing power consumption, die area, and verification efforts, FlexWay stands out as a comprehensive NoC IP solution for developers. This interconnect is ideal for the design teams aiming to navigate timing, scalability, and power challenges efficiently.
The Smart Vision Processing Platform - JH7100 is a versatile RISC-V SoC designed to handle complex image and video processing tasks. Equipped with a dual-core U74, it shares a 2MB L2 cache, operating at speeds up to 1.2GHz, and supports Linux operating systems. This robust platform is purpose-built to meet the needs of real-time edge applications, where swift data processing and minimal latency are crucial. The JH7100 integrates a StarFive ISP compatible with various mainstream camera sensors, enabling seamless image capturing and processing. Equipped with built-in capabilities for H264, H265, and JPEG encoding, it delivers a powerful visual computing experience. Key to its performance is the integration of powerful Vision DSP and NNE components, which provide enhanced AI processing. This platform is ideal for applications in industrial intelligence and smart home devices, offering security and versatility in a compact form. Its low power consumption and high processing efficiency optimize it for use in public safety, industrial automation, and intelligent appliances.
The Xinglian-700 Interconnect Fabric extends the capabilities of its predecessor by offering high scalability and exceptional performance tailored for extensive multicore systems. Supporting up to 256 CPU cores, this fabric IP is pivotal in building high-density computational infrastructures capable of handling intensive data processing tasks across various domains such as AI, analytics, and enterprise computing. Engineered to facilitate rapid connectivity and improved throughput, the Xinglian-700 enhances system efficiency by ensuring consistent data flow between CPU clusters, I/O, and DDR components. This interconnect fabric employs a sophisticated network-on-chip (NoC) approach that prioritizes memory coherence and system reliability, even under heavy load conditions. The fabric's design allows it to support a wide array of technological applications, from large-scale data centers to AI-driven analysis, making it a versatile tool for enterprises aiming to scale their processing capabilities. By optimizing data paths and reducing latency, the Xinglian-700 sets a benchmark for interconnect systems, bolstering the efficiency of complex computational environments.
The ORBIT Memory Subsystem by OPENEDGES Technology integrates a network-on-chip interconnect, memory controller, and PHY IPs into a cohesive solution, achieving remarkable system synergies. It is tailored for high-performance AI and computing applications, where its low latency, reduced power consumption, and extensive bandwidth support are paramount. This subsystem's structure is optimized for diverse next-gen semiconductor needs, incorporating ActiveQoS technology for advanced traffic control, managing data flow effectively to minimize latency and maximize performance. The combination of memory controller, PHY, and interconnect facilitates an adaptable and efficient ecosystem that can seamlessly manage a variety of DRAM protocols. By supporting multiple DRAM standards and optimizing for future technologies, the ORBIT Memory Subsystem extends the cycle life of semiconductor products, providing enhanced application coverage. Its design prioritizes energy efficiency and competitive functionality, reinforcing its role in state-of-the-art SoC development.
SEMIFIVE's SoC Platform leverages an advanced framework to facilitate efficient and rapid SoC development tailored for various applications. With a focus on reduced cost, minimized risk, and accelerated time to market, the platform integrates a pre-verified pool of IPs that are silicon-proven, optimizing the entire lifecycle from design to implementation. The platform also offers a straightforward engagement model, ensuring comprehensive support through the silicon design and manufacturing process, leveraging robust architecture, physical implementation, EDA tools, and more.
The 5G ORAN Base Station is designed to advance mobile networking by offering solutions that vastly improve wireless data capacity, paving the way for new wireless applications. Capitalizing on the latest advancements in 5G technology, this product is at the forefront of modern telecommunications, destined to transform communication methods with higher data throughput and reduced latency. Businesses looking to capitalize on the growing demand for robust mobile communications infrastructures will find this product's capabilities beneficial. Faststream Technologies bridges the gap between existing mobile technologies and the revolutionary potentials of 5G, making seamless connections and smart integrations possible. It supports application development and deploys effective strategies to leverage the new potential of 5G networks effectively. This system promotes not only the enhancement of current network operations but also sparks innovation in the development of emerging technologies and new business models in telecommunications. The ORAN architecture at the heart of this 5G Base Station promises flexible network configurations, enabling businesses to tailor their communications solutions according to unique operational needs. This adaptability ensures the scalability required to support increasing digital traffic, fortified by a vendor-agnostic approach aligned with trends towards open, integrated, and programmable networks.
Tensix Neo by Tenstorrent is a versatile processing core designed to provide unparalleled support for high-performance computing tasks, particularly in the realm of AI. Distinguished by its advanced architecture, Tensix Neo optimizes computations across a host of AI-centric operations, offering flexibility and efficiency. Tensix Neo integrates seamlessly into a variety of computational setups, whether for standalone AI applications or as a component of complex systems requiring substantial processing throughput. It supports a broad spectrum of AI and machine learning tasks, enabling smoother and faster model training processes. With a focus on sustainable performance, Tensix Neo ensures minimal resource consumption while maximizing output efficiency. Its carefully engineered design supports developers in creating and deploying AI solutions that meet rigorous performance standards without sacrificing operational integrity.
Channel Sounding is one of Packetcraft's latest advancements in Bluetooth technology, focusing on delivering precise distance measurements and location tracking through Bluetooth connections. This technology is pivotal in opening new applications for Bluetooth peripherals, offering advanced capabilities for spatial awareness and navigation. The implementation of Channel Sounding provides a robust solution for high-accuracy distance measurement, an essential feature for applications that require precise localization. This can span numerous fields, including automotive, where precise location data can enhance vehicular systems, and consumer electronics, where it can improve user interaction with devices. Packetcraft’s Channel Sounding is available for implementation in various systems, supporting those who aim to leverage Bluetooth for more than simple connectivity. By embedding this technology in their designs, product developers can offer enhanced features in their devices, challenging conventional use cases and ensuring products are equipped for future demands in connectivity and automation.
Wormhole is an integral part of Tenstorrent's high-performance AI compute solutions, engineered as a compact, flexible processor. This versatile IP is built to interconnect and enhance processing power for intensive AI applications. Its architecture allows seamless connections between multiple units, creating a mesh network that can be scaled to meet evolving computational demands. The Wormhole processor is designed to handle a wide range of AI tasks with ease, providing robust performance for applications in both enterprise and research settings. Its efficient topology supports extensive data throughput, making it an excellent choice for applications requiring substantial computational resources. Wormhole's adaptability makes it suitable for a variety of use cases, including AI model training and complex data analyses. Developers using Wormhole can benefit from its extensive computing capabilities without being constrained by power or space limitations. This flexibility results from its ability to easily integrate into existing infrastructures and dynamically adjust to processing needs.
The NoC Mesh Silicon by Truechip offers optimal connectivity for multiple protocol bus supportive devices, ensuring minimized latency, power, and physical footprint. It incorporates robust hardware cache coherence with an integrated mechanism for reducing wire resource usage. Implemented in Verilog RTL, this IP undergoes stringent testing to guarantee full code coverage. With support for diverse protocols and extensive configuration options, it facilitates efficient workflow in chip designs. The IP also includes easy integration via an intuitive GUI, emphasized by consistent operational features across all implementations.
Truechip's NoC Crossbar Silicon provides a refined solution for connecting multiple protocol bus supportive devices, minimizing latency, power, and area. It is architecturally designed to maintain hardware coherency while facilitating reduced wire usage in interconnections. The crossbar is delivered in native Verilog RTL and is subjected to thorough verification to ensure comprehensive code coverage and quality. The IP supports a versatile range of protocols and can be configured to individual designs with a user-friendly GUI. It is backed by a 24x5 customer support system, offering efficiency and reliability in silicon design processes.
Truechip’s NoC Coherent Crossbar Silicon is designed for efficient integration of various protocol bus supportive devices, with a focus on reducing latency, power, and spatial requirements. The IP supports hardware cache coherence, vital for maintaining synchronization across connected devices. It offers comprehensive protocol support and diverse configuration capabilities, ensuring it meets the demands of high-performance semiconductor designs. The IP is provided with user-friendly integration tools, complemented by significant customer support to streamline its adoption in multiple applications.
The Intelligent Coherent Network-on-Chip (C-NoC) from SignatureIP represents a state-of-the-art solution for coherent NoC systems, set to be available in the second half of 2023. This technology supports high-performance mesh, grid, and torus topologies and includes on-chip L3 cache support to significantly reduce latency. C-NoC stands out by ensuring coherency through a robust protocol suite, including CHI, AXI4/3, AXI-lite, ACE, and ACE-lite, making it versatile for a broad array of applications. With bus widths ranging from 32 to 2048 bits, this coherent system offers unparalleled speed and consistency in data management between processors and memory components. This solution is perfect for complex and demanding applications that require tight consistency and reduced communication delays. By supporting various topologies and an array of modern protocols, C-NoC helps reduce data latency, improve system coherence, and provide a streamlined, coherent communication backbone for advanced SoCs.
Marquee Semiconductor has honed its expertise in developing Network-on-Chip (NoC) based SoC solutions, catering to both coherent and non-coherent subsystems. These advanced integration methods allow for the construction of scalable chiplets, providing flexibility and enhanced performance in semiconductor designs. This ability to integrate diverse components positions them at the forefront of chip design, offering tailored solutions for varied technological requirements. Their NoC-based integration services enhance connectivity within and between chips, facilitating efficient data flow and optimized performance across the system. This method supports significant scalability, allowing for customization to meet the specific demands of a project while maintaining high power and area efficiency. By employing innovative approaches to SoC integration, Marquee Semiconductor ensures that their designs meet the rigorous requirements of modern applications, including high data throughput and enhanced energy efficiency. The company's approach involves leveraging coherent subsystems for seamless data management and non-coherent systems for intricate design solutions. Such versatility ensures that Marquee’s solutions remain relevant and state-of-the-art, suiting a range of industry applications including AI, ML, and beyond.
The iNoCulator™ by SignatureIP offers a revolutionary approach to crafting flexible and configurable Network-on-Chip (NoC) systems. This comprehensive solution spans from the initial concept stage to system architecture, RTL simulation, emulation, and final implementation. It stands out with its customizable features, allowing users to easily adjust the NoC topology and experiment dynamically within their own electronic design automation (EDA) environments. Employing a user-friendly interface, iNoCulator™ facilitates agile exploration of the NoC design space, enabling designers to iterate rapidly and refine their configurations. The tool supports a range of topologies and offers full integration with existing workflows, making it an invaluable asset for SoC developers looking to enhance the speed and efficiency of their designs. Whether you're focused on performance, latency, or power consumption, iNoCulator™ provides the insights and tools necessary to craft sophisticated interconnections that meet and exceed modern demands. This adaptability not only speeds up time-to-market but also enhances the overall design exploration process, ensuring that developers can achieve optimal configurations for their specific applications.
The Smart Non-Coherent Network-on-Chip (NC-NoC) by SignatureIP is designed as a versatile and scalable interconnection solution tailored for NoCs that do not require coherency. Featuring a layered architecture, the NC-NoC can efficiently handle a variety of protocols including AXI4/3, AHB, APB, and AXI-lite, while supporting a wide range of bus widths from 32 to 2048 bits. The architecture of NC-NoC is crafted to accommodate multiple clocking schemes, providing the flexibility to adapt to different system requirements. This NoC solution emphasizes physical awareness, enhancing its ability to manage and optimize system communication without the need for coherent protocols, which can often introduce additional complexity and overhead. Ideal for systems where data coherence across different components is not a critical requirement, NC-NoC enables effective data routing and efficient communication. Its adaptability and protocol support make it suitable for various applications, offering designers the ability to enhance performance, minimize latency, and optimize power consumption in non-coherent settings.