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Aragio Solutions has designed a comprehensive range of general-purpose I/O circuits aimed at meeting the rigorous demands of integrated circuit (IC) designs. These circuits feature robust ESD and latch-up tolerance, ensuring reliability under various operating conditions. Designers benefit from an array of power pads and configuration options for isolated power domains, which can be adapted for specific IC design requirements. Particularly notable is the inclusion of programmable GPIO, which provides fault-tolerant inputs. The architecture supports multiple power supply sequencing requirements, ensuring a smooth and regulated flow of power during operation. Additional features like distributed power-on-control enable effective system powering, while maintaining the structural integrity and function of the design. Aragio has made sure that their GPIO solutions are compatible with different technological environments, demonstrated by their silicon-proven implementations across various process nodes like 28nm and 40nm, available at foundries such as GLOBALFOUNDRIES and TSMC. This adaptability and proven efficacy make them indispensable for modern electronic systems where versatility and reliability are crucial.
Aragio Solutions delivers comprehensive I/O pads that cater to a variety of DDR standards, providing seamless interface solutions for DDR, DDR2, DDR3, and DDR4 memories. This IP family is designed to support full DDRx capabilities, compliant with JEDEC standards, ensuring compatibility and high performance in memory-intensive applications. The solution features pad sets designed for distinct power domains, offering flexibility and isolation crucial for optimal memory operation. With programmable drive strength and the capacity for on-die termination, the interfaces are crafted to accommodate different memory configurations and performance requirements, supporting data rates up to 1600 MT/s for DDR4 and 800 MT/s for DDR3. Employing advanced process nodes, these interfaces are silicon-proven to support a range of technological environments across various foundries. This ensures reliability and scalability across electronics solutions, making them ideal for use in data centers, high-performance computing, and consumer electronics where robust memory handling is paramount.
Designed for high-performance and efficiency, the High-speed LVDS Solutions provide a robust differential signaling interface capable of operating frequencies up to 1 GHz. The module includes driver and receiver components optimized for low power consumption and operates from a 1.8V I/O power supply while maintaining core supply voltages within the 1.0V to 1.1V range. Featuring integrated low power consumption and a versatile common mode range, these solutions are perfectly designed for environments requiring reliable and high-speed data transmission. The LVDS driver is capable of handling 50Ω and 100Ω differential termination, supporting a wide range of data throughput requirements, which makes it suitable for modern high-speed circuit designs. Aragio Solutions ensures that these LVDS solutions are compliant with the IEEE standards, providing a reliable framework for both input and output components. Silicon validation ensures that the implementations are production-ready and can be easily integrated into a variety of applications demanding high-speed data transfer coupled with low energy consumption.
This IP offers a comprehensive ESD solution for USB 2.0 and RF interfaces, engineered to handle high voltage and current demands typical of such applications. It features 5-volt tolerant ESD protection, designed to sustain high current paths without compromising signal integrity. This solution includes ESD protection diodes and Silicon-Controlled Rectifiers (SCRs) for robust circuit protection. These specialized components ensure minimal capacitance impact while safeguarding analog and core circuit components from high voltage surges. With an emphasis on silicon reliability, Aragio Solutions has fine-tuned this library to pass stringent ESD standards, such as the 4kV HBM. This IP addresses various application needs, allowing for customization based on ESD current profiles and interface proximity to core circuitry. The ESD solution is adaptable to several process nodes, ensuring compatibility with prevailing industry technologies and forward-looking designs. Its fundamental design strengthens circuit paths, ensuring a controlled and balanced ESD response, ideal for both USB and RF applications where component robustness is critical.
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