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Blue Cheetah Analog Design, Inc.

Blue Cheetah Analog Design, Inc. is an innovative developer of chiplet interconnect technologies aiming to revolutionize semiconductor design. Based in Sunnyvale, California, Blue Cheetah is committed to delivering cutting-edge solutions that address the increasing complexity of chip architectures. Their work emphasizes the integration of chiplet solutions that combine flexibility with industry standards, enhancing the design and production processes for chip makers worldwide. At the core of Blue Cheetah’s offerings are its chiplet interconnect solutions, such as the BlueLynx line, which provide customizable, standards-based die-to-die interfaces. These solutions are designed to meet a variety of market needs, including AI, high-performance computing, and mobile markets, promoting faster and more efficient integration in system-on-chip (SoC) architectures. Blue Cheetah's expertise in chiplet interconnectivity is further highlighted by its collaboration with top tech companies in demonstrating successful silicon bring-up for chiplet-based designs. Blue Cheetah is also actively engaged in providing educational resources and training, aspiring to bridge the gap between emerging semiconductor challenges and existing solutions. Their commitment to innovation extends to their collaboration with a range of industry partners, enhancing their reach and impact across the semiconductor landscape. Read more

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BlueLynx Chiplet Interconnect

The BlueLynx Chiplet Interconnect facilitates seamless communication between chiplets, vital for modern semiconductor designs that emphasize modularity and efficiency. This technology supports both physical and link layer interfaces, adhering to the Universal Chiplet Interconnect Express (UCIe) and Open Compute Project (OCP) Bunch of Wires (BoW) standards. BlueLynx ensures high-speed data transfer, offering customizable options to tailor designs for specific workloads and application needs. Optimized for AI, high-performance computing, and mobile markets, BlueLynx's die-to-die adaptability provides system architects with the leeway to integrate a variety of packaging types and process nodes, including 2D, advanced 2.5D, and innovative 3D packaging options. The solution is recognized for delivering a balance of bandwidth, energy efficiency, and latency, ensuring robust system performance while minimizing power consumption. This IP has been silicon-proven across multiple process nodes, including advanced technologies like 3nm, 4nm, and 5nm, and is supported by major semiconductor foundries. It offers valuable features such as low latency, improved PPA (Power, Performance, Area), and industry-standard compliance, positioning it as a reliable and high-performing interconnect solution within the semiconductor industry.

Blue Cheetah Analog Design, Inc.
GLOBALFOUNDARIES, Samsung
3nm, 4nm, 5nm, 7nm, 12nm, 16nm
AMBA AHB / APB/ AXI, Clock Synthesizer, D2D, Gen-Z, IEEE1588, Interlaken, MIPI, Modulation/Demodulation, PCI, Processor Core Independent, VESA, VGA
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