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NanoSILICON, Inc.

NanoSILICON, Inc., established in 2010, stands at the forefront of silicon wafer technology in the heart of Silicon Valley. With its commitment to quality and innovation, this mid-sized company has carved a niche for itself by offering top-notch silicon wafer products and services. NanoSILICON is uniquely positioned with advanced processing tools and capabilities to handle wafers ranging in diameter from 50.8mm to 300mm. The company offers both virgin test and prime wafers, polished in-house or sealed from major manufacturers, ensuring high-quality standards.\n\nThe company prides itself on its ISO 9001:2015 certification, reflecting its dedication to high standards and continuous improvement across its sales, operations, and quality platforms. This certification underscores NanoSILICON's commitment to excellence, as they strive to uphold consistency, visibility, and accountability in their processes. Their focused team continuously aims for operational excellence within a dynamic work environment.\n\nIncorporating a strong focus on quality assurance, NanoSILICON provides reclaim services that include state-of-the-art polishing and wafer reclaim technologies. They are adept at reducing production costs for their clients by re-utilizing silicon wafers within production processes. The company has also embraced sustainable practices with its reclaiming services, which extend the lifecycle of silicon wafers, offering clients a cost-effective and environmentally friendly solution.\n\nNanoSILICON takes pride in being a performance leader within the silicon wafer market due to its relentless customer service approach. The San Jose-based company continues to engage with clients, providing innovative solutions and maintaining superior product selection and service consistency. Their vision is to maintain and build upon this leadership, always keeping in view the needs and requirements of their customer base. Read more

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Thermal Oxide Processing

Thermal Oxide is a foundational dielectric layer utilized in various semiconductor devices. When properly developed using high purity, low defect silicon substrates, Thermal Oxide serves as an excellent insulator. The application of Thermal Oxide includes its use as a 'field oxide', which can electrically isolate different conductive films such as polysilicon and metal from the silicon substrate. Furthermore, it is integral as a 'gate oxide' within devices, providing the necessary dielectric layer.\n\nManufacturing of Thermal Oxide involves oxidizing silicon wafers in high-temperature furnaces, with standard processes occurring between 800 and 1050 degrees Celsius. This method involves housing the wafers in quartz glass tubes that can withstand the high thermal requirements, ensuring minimal risk of cracking or warping during processing due to its inherent stability.\n\nThe Thermal Oxide process at NanoSILICON involves both wet and dry oxidation methods, utilizing ultra-high purity sources. The process enables the precise control of oxide thickness and uniformity, confirmed by advanced measurement tools such as the Nanometrics 210. This ensures that the resulting layers have uniform thickness across and within wafers, critical for the device's performance and reliability.\n\nNanoSILICON's expertise in Thermal Oxide Processing results in layers ranging from 500 to 100,000 Å, with carefully maintained process controls for thickness variation and uniformity. It is integral to various applications in the semiconductor industry, supported by their highly specialized equipment and meticulous quality assurance processes.

NanoSILICON, Inc.
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Analog Subsystems, Coder/Decoder, Temperature Sensor
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