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Hermes X3D excels in electromagnetic simulation of advanced electronic packages and passive interconnects, essential for high-speed digital designs. It uses a quasi-static algorithm to extract RLGC parameters and generate SPICE models, which are crucial for system analysis regarding signal and power integrity and electromagnetic compatibility. Hermes X3D facilitates parasitic parameter extraction, supporting low-frequency precision and swift processing speeds, making it ideal for designing touch screens and other electromagnetic applications that require accurate capacitance analysis.
XDS serves as an all-encompassing platform for RF and microwave circuit design, unifying schematic and layout simulations across different scales. This software features extensive RF libraries and integrates linear circuit, spice, and MoM electromagnetic field solvers to handle diverse engineering needs. Its advanced technology supports automatic LC filter synthesis, optimizing the design of RF passive components. By managing third-party device libraries and facilitating efficient field-circuit simulations, XDS is a preferred choice for both preliminary and advanced stages of RF circuit development, ensuring high-precision and high-reliability results.
Hermes Layered stands as a leading solution for electromagnetic field simulations, particularly for complex systems needing board-level, IC, and package simulations. Developed with a full-wave high-precision EM simulation engine, it supports extensive simulations of every conceivable 3D structure from nanometer to centimeter scales. Hermes Layered's distributed parallel computing capabilities allow users to leverage powerful computing resources for fast, detailed model simulations. This tool is indispensable for industries that require accurate and quick iterations of design, supporting a variety of simulations from signal integrity to full system integrity.
SnpExpert is a specialized tool for analyzing S-parameters in high-speed and RF circuits, crucial for addressing issues such as reflections and crosstalk. Supporting a range of COM protocols, SnpExpert offers advanced analysis features like parameter extraction and margin calculations. It also facilitates the creation of broadband models using rational fitting, ensuring users can design optimized signal paths. Whether handling NRZ or PAM-4 modulations, SnpExpert provides engineers with the detailed insights needed for precise signal integrity analysis and system compliance.
iModeler simplifies the creation of process design kits (PDKs) for passive devices with rapid model synthesis across various nodes. Leveraging full-band 3D electromagnetic simulation, iModeler enhances the speed and accuracy of PDK modeling. The tool integrates seamlessly with Cadence Virtuoso, allowing users to control model parameters and configure complex on-chip passive devices such as inductors and capacitors. With its rich library of templates and dedication to optimizing parametric models, iModeler stands as a vital resource for the efficient and precise design of on-chip passive devices within different process environments.
IRIS is a robust solution for RF and analog IC electromagnetic simulations, crucial for addressing parasitic effects at high frequencies. Integrated with Cadence Virtuoso, IRIS ensures designers can execute precise electromagnetic field simulations within their design environment. It employs advanced 3D planar EM solvers based on the method of moments (MoM) to accurately model materials' skin and proximity effects. Additionally, IRIS facilitates design cycle reduction through parallel processing capabilities and unparalleled integration of front-end and back-end design environments, optimizing both synthesis and verification processes for RF circuits.
TmlExpert is a high-efficiency modeling tool tailored for the precise creation of transmission line models. This software is notable for its speed and ease of use, offering a variety of built-in templates that simplify the modeling of complex scenarios, such as serpentine and tabbed routing, while also providing intuitive evaluation of board-level impedance controls. Leveraging a blend of 2D RLGC, 2.5D MoM, and 3D FEM solvers, it ensures models are both reliable and swiftly generated. TmlExpert’s focus is on signal integrity, allowing users to accurately simulate and assess parameters like impedance and insertion loss.
Hermes 3D is designed for handling any 3D structure's electromagnetic simulation needs, delivering solutions ideally suited for modeling antennas and intricate electronic assemblies. This software accommodates mainstream 3D design file imports and is optimized for ease of use with features such as geometric center identification and direct model import. Thanks to its self-developed full-wave electromagnetic simulation engine, users can perform detailed simulations from DC to THz frequency ranges, enhancing capabilities in antenna design or EMI/EMC verification. Hermes 3D opens up vast potential for professionals requiring versatile simulation solutions across large platforms.
Notus provides comprehensive analysis capabilities across signal and power integrity, thermal management, and stress analysis for PCB and package designs. Equipped with electromagnetic technologies, it can offer detailed DC and AC power analyses, optimize decoupling capacitors, and conduct electrothermal simulations. Notus supports examining complex package structures and stacked die solutions, catering to specifications required in modern electronic designs. Its integration-friendly environment and dynamic analysis capabilities confirm Notus as a robust solution for optimizing power delivery systems and improving product reliability in electronic design.
ChannelExpert is designed to address the challenges of high-speed signal integrity, providing a simulation platform that accurately evaluates high-speed channel performance. This tool features built-in engines for time domain and convolution simulations, ideal for handling parameters across entire communication links from transmission to reception. ChannelExpert offers a refined workflow with support for IBIS-AMI simulations and comprehensive DDR bus analysis, ensuring the highest level of precision in high-frequency environments. Its compatibility with SerDes statistical eye diagram analysis makes it indispensable for optimizing complex communication networks.
MeasureExpert automates the testing and analysis of complex signal transmission characteristics, compatible with industry-standard vector network analyzers. With robust algorithms for de-embedding and precise measurement across time and frequency domains, this tool significantly improves testing efficiency. Users benefit from features like support for Intel's Delta-L 4.0 Methodology, customizable S-parameter testing, and TDR analysis, streamlining the validation of high-frequency electrical systems and enhancing debugging capabilities across various applications.
CableExpert facilitates the modeling and simulation of high-speed cables, crucial for assessing parameters like insertion loss and crosstalk. With pre-built templates for a range of cable types including coaxial and Ethernet, CableExpert manages simulations for protocols such as IEEE, A-PHY, and Auto-Serdes. Advanced solvers like the FEM3D and Tline2D enhance simulation speed and precision. This tool supports scanning simulations to refine designs by altering cable dimensions, ensuring that users can optimize cable assembly configurations effectively. CableExpert is an invaluable asset for designing high-speed digital communication systems with cable components.
XPLM is a versatile data management platform that integrates all necessary EDA functionalities into a unified environment, based on a web architectural framework. Its comprehensive management capabilities range from simulation data to model libraries, and include orchestration of simulation tasks via the JobQueue. XPLM's module functions like LibManager and LicenseManager facilitate efficient data handling, configuration management, and license control, ensuring users maximize the effectiveness of their design resources and processes within a flexible and scalable platform framework.
Genesis redefines package and PCB design with a comprehensive simulation-driven approach that optimizes the entire design process. By integrating simulations into the design workflow, Genesis allows for early detection and resolution of potential design issues in circuitry, electromagnetics, and thermal management. Its project management features enable streamlined collaboration across various design functions, ensuring that every aspect of the design is efficiently handled. Furthermore, it supports the cohesive creation of complex circuit designs and facilitates data management for diverse board-level and packaging projects. This platform enhances development efficiency and accelerates product design cycles.
Metis serves as a groundbreaking platform specifically for advanced 2.5D and 3D IC packaging design and analysis. Equipped with a 3D full-wave electromagnetic simulation engine, Metis effortlessly handles simulations for chips and various packaging structures, ensuring precise signal and power integrity modeling. Its hybrid meshing technology manages computational resources efficiently without compromising accuracy. Ideal for large-capacity packaging designs, Metis supports simulations from nanometer to centimeter scales, and its support for parallel computing provides significant benefits in terms of speed and efficiency.
ViaExpert is engineered for the 3D full-wave electromagnetic simulation of vias, vital for maintaining signal integrity in high-speed transmission channels. This tool is central to analyzing how vias affect key parameters, including differential and return loss. Built with multiple pre-simulation and layout editing templates, ViaExpert supports the precise modeling of solder balls, teardrops, and other complex via structures. Its ability to modify simulation environments in a 2D window and support for custom restriction zones make it indispensable for detailed via analysis. By integrating FEM3D solvers, it delivers fast, accurate results across varied structural simulations.
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