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XDS is an advanced tool for designing and simulating RF and microwave circuits, aimed at optimizing performance and enhancing the reliability of communication systems. The platform facilitates the accurate modeling of complex RF components, enabling engineers to assess various design configurations and their electromagnetic interactions. XDS offers a comprehensive set of simulation tools that support a wide range of frequency domains, ensuring precise analysis of key parameters such as gain, noise figure, and linearity. By providing detailed insights into RF performance characteristics, XDS aids in the identification of optimal design paths and ensures that communication devices operate efficiently under various conditions. This tool is particularly beneficial for developing wireless communication infrastructures, radar systems, and microwave technologies.
Hermes X3D facilitates rapid RLGC extraction for power, package, and touch panel modeling, delivering a flexible solution for industry professionals seeking efficient EM analysis. This tool excels in quick simulations, enabling users to swiftly obtain resistance, inductance, capacitance, and conductance parameters necessary for accurate modeling of complex electronic structures. With the capability to manage intricate layouts and heterogeneous material compositions, Hermes X3D offers unique advantages in optimizing design efficiency and performance. The platform aids in the identification of potential design bottlenecks and assists in refining layouts for improved power delivery and signal integrity, crucial in touch panel and package applications. Engineering teams benefit from Hermes X3D's capacity to streamline development timelines and bolster design accuracy.
SnpExpert provides advanced capabilities for S-parameter analysis, a critical aspect in the characterization of RF and microwave components. This tool assists designers in evaluating complex multi-port networks by providing detailed insights into scattering parameters, which are crucial for understanding component behavior and interactions. SnpExpert optimizes the design process by enabling engineers to simulate and assess variations in network responses under different operational conditions. This tool plays a pivotal role in enhancing the performance and efficiency of RF systems by providing accurate and comprehensive electromagnetic simulations. By harnessing SnpExpert's analytical capabilities, designers can ensure that their products meet stringent performance and reliability standards in demanding environments.
Hermes 3D provides a robust simulation platform tailored for arbitrary 3D structures and antenna designs, offering engineers a powerful tool for comprehensive electromagnetic analysis. This software package excels in FEM simulations, adeptly handling complex geometries and material layering to predict electromagnetic performance accurately. Hermes 3D is particularly beneficial in RF and antenna design applications, enabling engineers to explore spatial and material configurations to optimize performance. The tool supports a wide array of use cases, from wireless communication antenna systems to compact RF modules, ensuring designs meet precise specifications. By simulating electromagnetic fields across varied scenarios, Hermes 3D helps engineers achieve optimal design solutions efficiently, contributing to innovative and reliable product development.
iModeler is an automated tool for Process Design Kit (PDK) model generation, essential for semiconductor fabrication and circuit design. This product simplifies the creation of accurate models by automating the extraction and validation processes, reducing the time and effort typically required by engineers. iModeler facilitates the generation of precise and verified models that are critical for accurate simulations and successful chip manufacturing. It offers robust support for a wide array of device structures and process technologies, ensuring broad applicability across different semiconductor fabrication processes. With iModeler, design teams can ensure that their libraries are up-to-date and reflective of real-world conditions, enhancing the predictability of their design outcomes and ensuring robust performance.
IRIS provides a highly accurate simulation platform for RF and analog IC designs, facilitating the development of circuits that require precision and performance. This tool supports a comprehensive suite of simulation and modeling capabilities tailored to the unique challenges posed by high-frequency and analog circuits. IRIS helps engineers evaluate and optimize the performance of ICs by simulating fundamental RF parameters, including S-parameters, noise, and power metrics. Additionally, the tool offers insights into harmonic generation and thermal effects, critical for high-performance RF design. By integrating multiple simulation components, IRIS allows developers to address a wide range of design scenarios, ensuring the successful implementation of innovative RF and analog solutions.
TmlExpert offers a comprehensive solution for transmission-line modeling and simulation, designed to streamline the design process for electrical engineers. It provides fast and accurate analyses to ensure that signal integrity requirements are met, particularly in high-speed digital and RF systems. By leveraging advanced mathematical models, TmlExpert helps predict the performance of transmission lines in various scenarios, assisting engineers in optimizing line characteristics for improved system performance. The tool supports a wide range of parameters, enabling detailed modeling of interconnects at the chip, package, and board levels, making it an indispensable tool for modern electronic design. TmlExpert's intuitive interface allows users to set up simulations swiftly, analyze results efficiently, and make informed design decisions to enhance overall product performance.
Hermes Layered offers a sophisticated finite element method (FEM) simulation tool tailored for the analysis of multilayered IC, package, and PCB structures. This product addresses the intricate nature of electromagnetic field interactions in layered environments, providing precise EM modeling solutions for designers. Hermes Layered is designed to manage complex geometries and material properties, facilitating the exploration of design alternatives and optimization strategies. Its extensive simulation capabilities help engineers predict system behavior under various conditions, ensuring high-fidelity outcomes in RF, microwave, and high-speed digital applications. By supporting multi-physics simulation, Hermes Layered confirms that designs not only meet functional specifications but also maintain performance integrity under real-world conditions.
MeasureExpert automates the testing and analysis of electronic components, providing a streamlined approach to verification processes within design cycles. This platform supports the evaluation of electronic device characteristics by conducting accurate measurements across multiple parameters, facilitating faster and more reliable test results. MeasureExpert helps identify potential issues in design or manufacturing processes early on, allowing for timely corrective actions and the prevention of costly rework. By offering automated measurement solutions, MeasureExpert enhances efficiency in the testing phase, freeing engineers to focus on development and innovation. This tool is crucial for maintaining high quality assurance standards in the production of electronic devices.
CableExpert offers an advanced platform for simulating and analyzing cable harnesses in complex electronic systems. This tool is crucial for ensuring the integrity and performance of cable interconnections across various applications, from industrial machinery to automotive systems. CableExpert provides a detailed examination of electromagnetic interactions and signal integrity within cable systems, allowing engineers to assess and optimize harness designs. By simulating different routing configurations and material properties, CableExpert helps identify potential issues, such as signal degradation and electromagnetic interference (EMI), before they affect system performance. This powerful simulation platform supports comprehensive analysis, giving engineers the insights needed to develop reliable and efficient cable harness designs.
Notus provides a comprehensive simulation and analysis tool for assessing signal integrity (SI), power integrity (PI), thermal effects, and mechanical stress in electronic designs. This multi-functional platform supports detailed evaluations across these critical design domains, contributing to the reliability and efficiency of electronic components. Notus aids engineers in identifying potential performance bottlenecks, thermal hotspots, and mechanical weaknesses, providing actionable insights to refine and optimize designs. Its simulation capabilities span a broad range of scenarios, offering realistic assessment of environmental and operational conditions on device performance. By supporting iterative design processes, Notus ensures that engineers can enhance product reliability and achieve optimal performance in diverse applications.
ViaExpert is designed to provide precise modeling and simulation of vias, which are critical components in multilayered PCBs and packages. Vias can significantly impact signal integrity and reliability, especially in high-frequency applications. ViaExpert aids in the design of vias by offering detailed analysis of their effects on signal propagation, minimizing potential disruptions and losses. This tool allows engineers to simulate various via configurations and parameters, helping them identify optimal designs that meet strict performance requirements. With ViaExpert, users can visualize electromagnetic fields, evaluate crosstalk, and optimize via placements, ultimately leading to enhanced signal quality and robust electronic designs.
Genesis is a comprehensive tool for package and PCB system design, providing powerful capabilities to help engineers create efficient and optimized layouts from scratch. It combines advanced algorithms and design methodologies to support multi-layered layouts, component placement, and routing strategies. Genesis allows users to manage constraints effectively, ensuring that designs meet electrical and manufacturing specifications. Its simulation capabilities enable the evaluation of electromagnetic effects, thermal performance, and mechanical stress, contributing to the reliability and performance of the final product. The intuitive interface of Genesis makes it accessible for both novice and experienced designers, while its robust functionalities make it suitable for handling complex projects with ease.
XPLM provides a comprehensive solution for simulation process and data management, playing a critical role in coordinating EDA workflows and enhancing efficiency. This platform integrates design, simulation, and data management capabilities, allowing seamless collaboration among engineering teams. XPLM enhances productivity by automating data handling, ensuring that design data is consistently current and accessible, thus supporting informed decision-making across development processes. It features a robust set of tools for managing design iterations, version control, and configuration management, thereby minimizing errors and improving the accuracy of design information. XPLM's holistic approach to data management supports the robust integration of simulation workflows, fostering innovation and ensuring successful project outcomes.
ChannelExpert offers a systematic platform for SI/PI simulation, specifically targeting the challenges associated with high-speed systems. This tool is vital for engineers working on advanced communication systems wherein data transmission rates exert significant effects on signal quality. ChannelExpert provides detailed insights into signal behavior within channels, assisting in the design and enhancement of high-performance interconnects. It supports simulations that examine crosstalk, jitter, and other impairments, offering solutions to mitigate adverse effects through informed design changes. With ChannelExpert, engineers can model complex environments, ensuring that systems maintain robust signal integrity and reliability across high-speed channels. This capability is crucial for developing next-generation networking and telecommunication technologies.
Metis is an advanced EM solver specifically designed to handle large-capacity analyses for 2.5D and 3D IC packaging. This tool is essential for engineers dealing with the complex interactions and integration challenges inherent in modern multi-die systems. Metis provides comprehensive electromagnetic analysis capabilities, allowing for detailed simulations of signal and power integrity across multiple dies and packaging layers. The tool supports the optimization of interconnects and through silicon vias (TSVs), ensuring that package designs meet the stringent electrical and thermal requirements of high-performance computing applications. By integrating its powerful simulation engine with user-friendly design interfaces, Metis facilitates efficient workflows and drives advancements in IC packaging technology.
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